Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2009
03/11/2009EP1657659B1 Printed circuit board return route check method and printed circuit board pattern design cad device
03/11/2009EP1629549A4 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
03/11/2009EP1567979B1 Chipcard and method for production of a chipcard
03/11/2009EP1467845B1 A method and related apparatus for cutting a product from a sheet material
03/11/2009CN201207762Y Moving spool rod labeling device and moving spool rod
03/11/2009CN201207761Y Regulation type hot wind cover
03/11/2009CN201205606Y Drilling machine for printed circuit boards
03/11/2009CN101385404A Circuit board manufacturing method and circuit board
03/11/2009CN101385403A Method for manufacturing multilayer wiring board
03/11/2009CN101385402A Circuit board and process for producing the same
03/11/2009CN101385401A Optimal imaging system and method for a stencil printer
03/11/2009CN101384897A Off-axis illumination assembly and method
03/11/2009CN101384521A Slurry composition for ceramic green sheets and method for producing the same and multilayer ceramic electronic component and method for producing the same
03/11/2009CN101384436A Screen printing apparatus and screen printing method
03/11/2009CN101384425A Porous film and multilayer assembly using the same
03/11/2009CN101384162A Novel packing box, manufacturing and unit plugging technique for dual-color substrate
03/11/2009CN101384140A Electronic appliance and method for manufacturing the same
03/11/2009CN101384138A Fixing device and multilayer circuit board press fitting
03/11/2009CN101384137A Manufacturing method for circuit board with heat radiating metallic layer
03/11/2009CN101384136A Surface mounting process for flexible circuit board and used magnetic tool and steel mesh
03/11/2009CN101384135A Sheet peeling device and sheet printing system using same device
03/11/2009CN101384134A Method for embedding heat conductive element on circuit board
03/11/2009CN101384133A Contraposition method
03/11/2009CN101384132A Multi-component board
03/11/2009CN101384131A Circuit board and method for manufacturing the same
03/11/2009CN101381873A Etching solution and conductor pattern forming method
03/11/2009CN100469231C Control method for reflux welding curve on surface sticking process production line
03/11/2009CN100469223C Conductive sheet having conductive layer with improved adhesion and product including the same
03/11/2009CN100469222C Methods of forming solder areas on electronic components and electronic components having solder areas
03/11/2009CN100469221C Method for manufacturing printed circuit board
03/11/2009CN100469220C A method for making elastic circuit with the non-weaving cloth as base
03/11/2009CN100469219C Nickelplating gold-immersion technology and anti-bending agent in printing circuit
03/11/2009CN100469218C Circuit board checker and circuit board checking method
03/11/2009CN100469216C Manufacturing method of multilayer flexible wiring plate
03/11/2009CN100469215C Multiplayer circuit base and its producing method
03/11/2009CN100469065C Symbol-based signaling device for an elctromagnetically-coupled bus system
03/11/2009CN100468706C Circuit board and method for manufacturing the same, semiconductor package, component built-in module
03/11/2009CN100468669C Method of forming a semiconductor package and leadframe therefor
03/11/2009CN100468644C Protective layer during scribing
03/11/2009CN100468613C Method and apparatus for removing material from a substrate surface
03/11/2009CN100468450C Method for mounting an electronic component on a substrate
03/11/2009CN100468417C Printed circuit wiring board designing support device and printed circuit board designing method
03/11/2009CN100468199C Double-sided projection exposure device of belt-shape workpieces
03/11/2009CN100467474C Dicopper (i) oxalate complexes as precursor for metallic copper deposition
03/10/2009US7502231 Thin printed circuit board for manufacturing chip scale package
03/10/2009US7501752 Color image display unit
03/10/2009US7501584 Circuit board device and method for board-to-board connection
03/10/2009US7501582 Electrical device and method for making same
03/10/2009US7501578 Electric conductors
03/10/2009US7501338 Semiconductor package substrate fabrication method
03/10/2009US7501156 Pattern formation substrate and method for pattern formation
03/10/2009US7501048 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
03/10/2009US7501038 Assembling apparatus, assembling method and terminal cleaning apparatus
03/10/2009US7501014 Formaldehyde free electroless copper compositions
03/10/2009US7500857 Arrangement with a contact element
03/10/2009US7500308 Method of detaching electronic component from printed circuit board
03/10/2009US7500307 High-speed RFID circuit placement method
03/10/2009US7500306 Coupling of conductive vias to complex power-signal substructures
03/10/2009CA2384370C Pressure laminator apparatus and non-woven fabric formed thereby
03/05/2009WO2009029939A2 Aerosol jet® printing system for photovoltaic applications
03/05/2009WO2009029938A2 Apparatus for anisotropic focusing
03/05/2009WO2009028596A1 Passive element built-in substrate, manufacturing method, and semiconductor device
03/05/2009WO2009028493A1 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
03/05/2009WO2009028289A1 Ceramic multilayer substrate
03/05/2009WO2009028239A1 Structure for mounting semiconductor device and method for mounting semiconductor device
03/05/2009WO2009028208A1 Negative photosensitive material and circuit board
03/05/2009WO2009028110A1 Multilayered wiring board and semiconductor device
03/05/2009WO2009028108A1 Multi-layer substrate
03/05/2009WO2009027132A1 Method for fabricating electrical bonding pads on a wafer
03/05/2009WO2009027016A1 Article with a nanoscopic coating of precious/semiprecious metal and process for its production
03/05/2009WO2009011834A3 Microalignment using laser-softened glass bumps
03/05/2009WO2008145804A3 Interference shielded electronics module and method for providing the same
03/05/2009US20090061566 Semiconductor package having a grid array of pin-attached balls
03/05/2009US20090060426 Optical module
03/05/2009US20090058590 Electronic component and method for fixing the same
03/05/2009US20090058569 Coaxial waveguide microstructures having an active and methods of formation thereof
03/05/2009US20090057910 Method of embedding passive component within via
03/05/2009US20090057149 Method of Manufacturing a Diagnostic Test Strip
03/05/2009US20090057006 Electronic unit and production method of the same
03/05/2009US20090057001 Integrated circuit package and manufacturing method thereof
03/05/2009US20090056998 Methods for manufacturing a semi-buried via and articles comprising the same
03/05/2009US20090056997 Electronic Assemblies Without Solder and Methods for their Manufacture
03/05/2009US20090056989 Printed circuit board and method for preparation thereof
03/05/2009US20090056987 Multilayer ceramic electronic device and method for manufacturing the same
03/05/2009US20090056986 Integrated circuit (ic) carrier assembly with first and second suspension means
03/05/2009US20090056985 Printed circuit board and method of production of an electronic apparatus
03/05/2009US20090056979 Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
03/05/2009US20090056120 Biosensor and method of making
03/05/2009US20090056119 Method of fabricating multilayer printed circuit board
03/05/2009US20090056118 Method of manufacturing a combined multilayer circuit board having embedded chips
03/05/2009US20090056117 Method of partially attaching an material for various types of printed circuit boards
03/05/2009US20090056111 Alignment jig for electronic component
03/05/2009US20090056102 Method for fabricating semiconductor device
03/05/2009DE102008045306A1 Solution for etching copper during printed circuit board manufacture, includes copper ion source, acid, water, azole, aromatic compound and hydrogen peroxide
03/05/2009DE102008045003A1 Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte A method for manufacturing a multilayer printed circuit board
03/05/2009DE102007053059B3 Verfahren zum Ausrichten von einem zu bedruckenden Trägermaterial A method for aligning a print carrier material
03/05/2009DE102007041904A1 Combined solder joint for attachment of electrical component with printed circuit board, has push through connection surface running through printed circuit board and connected with printed circuit board by reflow surface soldered joint
03/05/2009DE102007041892A1 Elektrische Schaltanordnung mit einem MID-Schaltungsträger und einer damit verbundenen Verbindungsschnittstelle Electrical switching arrangement having a circuit carrier MID and an associated connection interface
03/05/2009DE102007041770A1 Leiterplattenstapel aus löttechnisch miteinander verbundenen Leiterplatten PCB stack of löttechnisch interconnected printed circuit boards
03/05/2009DE102007041039A1 Herstellung leitfähiger Beschichtungen mittels Tintenstrahldrucks Preparation of conductive coatings using inkjet printing