| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/18/2009 | EP2037493A2 Method of mounting conductive ball and conductive ball mounting apparatus |
| 03/18/2009 | EP2036656A1 Bonding material, electronic component, bonding structure and electronic device |
| 03/18/2009 | EP2036411A2 Improved process for pressureless constrained sintering of low temperature co-fired ceramic with surface circuit patterns |
| 03/18/2009 | EP2036410A1 Method for fixing an electrical or electronic component, in particular a printed circuit board, in a housing and fixing element therefor |
| 03/18/2009 | EP1842402B1 Wire-printed circuit board or card comprising conductive tracks and conductors with a rectangular cross-section |
| 03/18/2009 | EP1578559B1 Bonding method |
| 03/18/2009 | CN201210770Y Character curing device for flexible printed circuit board |
| 03/18/2009 | CN201210520Y Digital television antenna |
| 03/18/2009 | CN101390455A Process for manufacturing soldering mounted structure and apparatus therefor |
| 03/18/2009 | CN101390207A Mounting method |
| 03/18/2009 | CN101390205A Soldering method, soldering apparatus and method for manufacturing semiconductor device |
| 03/18/2009 | CN101390174A Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure |
| 03/18/2009 | CN101390017A Heat curable composition for protective film, cured product, and liquid crystal display device |
| 03/18/2009 | CN101389712A Thermosetting resin composition containing low-chlorine multifunctional aliphatic glycidyl ether compound, cured product of such composition and use thereof |
| 03/18/2009 | CN101389443A Anti-flux migration composition for solder |
| 03/18/2009 | CN101389191A Multi-layer circuit board and manufacturing method thereof |
| 03/18/2009 | CN101389190A Multilayer printed wiring board production method |
| 03/18/2009 | CN101389189A Circuit board producing method |
| 03/18/2009 | CN101389188A Method for manufacturing PCB by copper coated board |
| 03/18/2009 | CN101389187A Producing method of suspension board with circuit |
| 03/18/2009 | CN101389186A PCB soft hard board combining device |
| 03/18/2009 | CN101389183A Through-hole region design system and method for differential signal line |
| 03/18/2009 | CN101388436A Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board |
| 03/18/2009 | CN101386128A Riveting tool device of support column for processing double-layer circuit board |
| 03/18/2009 | CN101386070A Silver powder |
| 03/18/2009 | CN100471376C Flexible printed wiring board |
| 03/18/2009 | CN100471367C Circuit board with recognition information and its making method |
| 03/18/2009 | CN100471366C Separator plate for the production of circuit board components |
| 03/18/2009 | CN100471365C Method for printed circuit board wiring and printed circuit board |
| 03/18/2009 | CN100471364C Electronic devices and methods of forming electronic devices |
| 03/18/2009 | CN100471363C Mounting method for electronic parts |
| 03/18/2009 | CN100471362C Method for manufacturing flexible circuit board |
| 03/18/2009 | CN100471361C Method for opening window on polyimide base material of flexible printed circuit board and its etching fluid |
| 03/18/2009 | CN100471360C Method for drilling holes in a substrate, in particular in circuit substrate by laser beam |
| 03/18/2009 | CN100471359C Epoxy resin laminated plate for reinforced material of flexible printed circuit board |
| 03/18/2009 | CN100471357C Multi-layer circuit board assembly, unit thereof and manufacture method thereof |
| 03/18/2009 | CN100470958C Method for preventing electric connector inclination while fixing it onto substrate |
| 03/18/2009 | CN100470933C Dielectric sheet |
| 03/18/2009 | CN100470784C Semiconductor device, method of manufacturing the semiconductor device and substrate to be used to manufacture the semiconductor device |
| 03/18/2009 | CN100470772C Solder-free PCB assembly |
| 03/18/2009 | CN100470692C Chip type battery |
| 03/18/2009 | CN100470558C Board joint method of dual-side printed circuit board |
| 03/18/2009 | CN100469948C Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 03/18/2009 | CN100469851C Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| 03/18/2009 | CN100469499C Location hole processing method for multilayer circuit board |
| 03/17/2009 | US7505281 Multilayer wiring board for an electronic device |
| 03/17/2009 | US7505149 Apparatus for surface inspection and method and apparatus for inspecting substrate |
| 03/17/2009 | US7504722 Semiconductor device with slanting side surface for external connection |
| 03/17/2009 | US7504719 Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same |
| 03/17/2009 | US7504668 Transponder assembly for use with parallel optics modules in fiber optic communications systems |
| 03/17/2009 | US7504604 Method for soldering miniaturized components to a baseplate |
| 03/17/2009 | US7504199 Multilayer wiring pattern of low resistivity metal formed in simple manner at low cost; metals constituting respective layers can be freely selected according to intended application; forming photocatalytic film layer, water-soluble polymer layer, exposing layers to light to form latent image; plating |
| 03/17/2009 | US7504191 Photosensitive resin composition and method for the formation of a resin pattern using the composition |
| 03/17/2009 | US7503993 Method for manufacturing multilayer ceramic electronic element |
| 03/17/2009 | US7503112 Methods for manufacturing lead frame connectors for optical transceiver modules |
| 03/17/2009 | US7503111 Method for increasing wiring channels/density under dense via fields |
| 03/17/2009 | US7503109 Method of mounting an electronic component |
| 03/12/2009 | WO2009032515A2 Nanoparticle semiconductor device and method for fabricating |
| 03/12/2009 | WO2009031903A1 Device and method for mounting an electronic component |
| 03/12/2009 | WO2009031586A1 Circuit board and method for manufacturing circuit board |
| 03/12/2009 | WO2009031472A1 Adhesive and connecting structure using the same |
| 03/12/2009 | WO2009031187A1 Method of soldering and apparatus therefor |
| 03/12/2009 | WO2009030612A1 Integrated sensor module |
| 03/12/2009 | WO2009030284A1 Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit |
| 03/12/2009 | WO2009009639A3 Electronic assemblies without solder and methods for their manufacture |
| 03/12/2009 | WO2008152506A3 A method and a device for depositing or removing a layer on/from a workpiece, an analysis method and device for analysing an expected layer thickness, a method for setting up a database for such an analysis method or device, as well as such a database |
| 03/12/2009 | WO2005036587A3 Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator |
| 03/12/2009 | US20090068856 LED light source module, manufacturing method thereof and LED backlight module using the same |
| 03/12/2009 | US20090067147 Circuit board connection structure and circuit board connection method |
| 03/12/2009 | US20090067145 Circuit pattern designing method, wherein an electroconductive coating material is used, and a printed circuit board |
| 03/12/2009 | US20090067144 Flexible network |
| 03/12/2009 | US20090066624 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board |
| 03/12/2009 | US20090066447 High speed interconnect and method of manufacture |
| 03/12/2009 | US20090065934 Wiring substrate, tape package having the same, display device having the tape package, method of manufacturing the wiring substrate, method of manufacturing a tape package having the same and method of manufacturing a display device having the tape package |
| 03/12/2009 | US20090065586 Electronic device |
| 03/12/2009 | US20090065246 Circuit board structure and method for manufacturing the same |
| 03/12/2009 | US20090065243 Printed wiring board |
| 03/12/2009 | US20090065242 Manufacturing method of printed wiring board and printed wiring board including potting dam obtained by using manufacturing method |
| 03/12/2009 | US20090065142 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion |
| 03/12/2009 | US20090064497 Printed circuit board using paste bump and manufacturing method thereof |
| 03/12/2009 | US20090064496 Interposer for connecting plurality of chips and method for manufacturing the same |
| 03/12/2009 | US20090064495 Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates |
| 03/12/2009 | US20090064494 Manufacturing process for a quad flat non-leaded chip package structure |
| 03/12/2009 | US20090064493 Printed circuit board |
| 03/12/2009 | DE102008039660A1 Bedruckstoff bearbeitende Maschine und Verfahren in einer Bedruckstoff bearbeitenden Maschine Substrate machined machine and method in a substrate preparation applications |
| 03/12/2009 | DE102007043098A1 Verfahren zur Herstellung eines Vielschichtbauelements A process for producing a multilayer component |
| 03/12/2009 | DE102007042411A1 Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn A method of hot-stamping at least one strip conductor on a substrate as well as substrate with at least one conductor track |
| 03/12/2009 | DE102007040871A1 Verbindungselement Connecting element |
| 03/11/2009 | EP2034810A1 Flex rigid wiring board and method for manufacturing the same |
| 03/11/2009 | EP2034809A2 Electronic device including printed circuit board and electronic element mounted on the printed circuit board |
| 03/11/2009 | EP2034807A2 Circuit board stack comprised of circuit boards soldered to each other |
| 03/11/2009 | EP2034806A1 Circuit board device, method for connecting wiring boards, and circuit substrate module device |
| 03/11/2009 | EP2034039A1 Metallic film and method of its manufacture and use |
| 03/11/2009 | EP2033781A1 Squeegee for printing device, printing device, and printing method |
| 03/11/2009 | EP2033780A1 Printing device and printing method |
| 03/11/2009 | EP2033501A1 Method for producing electrically conductive surfaces on a carrier |
| 03/11/2009 | EP2033269A1 Electronic housing comprising a standard interface |
| 03/11/2009 | EP1943104B1 Multilayer imageable element with improved chemical resistance |
| 03/11/2009 | EP1819523B1 Printing screens, machine and method for screen printing |
| 03/11/2009 | EP1707315B1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |