| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/25/2009 | EP2040186A1 Analyzing device for circuit device, analyzing method, analyzing program and elecronic medium |
| 03/25/2009 | EP2039511A1 Position matching method and screen printing device |
| 03/25/2009 | EP2039231A1 Assemblies useful for the preparation of electronic components and methods for making same |
| 03/25/2009 | EP2038903A1 Housing for accommodating an electronic component and electronic component arrangement |
| 03/25/2009 | EP2038624A2 Electric component comprising a sensor element, method for encapsulating a sensor element and method for producing a board assembly |
| 03/25/2009 | EP1747706B1 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 03/25/2009 | EP1592825B1 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 03/25/2009 | EP1528977B1 Method for the production of a fixed connection between two layers of a multilayer system, and multilayer system |
| 03/25/2009 | EP1344396B1 FOLDable DISPLAY DEVICE |
| 03/25/2009 | CN201213257Y Wireless modem |
| 03/25/2009 | CN201212558Y Leakage proof means |
| 03/25/2009 | CN101395979A Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate |
| 03/25/2009 | CN101395978A Circuit wiring board incorporating heat resistant substrate |
| 03/25/2009 | CN101395977A Paste transfer apparatus and electronic component mounting apparatus |
| 03/25/2009 | CN101395976A Electronic component mounted body, electronic component with solder bump, solder resin mixed material, electronic component mounting method and electronic component manufacturing method |
| 03/25/2009 | CN101395975A Electronic part mounting structure and its manufacturing method |
| 03/25/2009 | CN101395974A Thermally printable electrically conductive ribbon and manufacturing method therefor |
| 03/25/2009 | CN101395710A Mounting method, board with electrical component, and electrical apparatus |
| 03/25/2009 | CN101395652A Pattern-forming device and pattern-forming method |
| 03/25/2009 | CN101395522A Component bonding method and component bonding device |
| 03/25/2009 | CN101395234A Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof |
| 03/25/2009 | CN101394714A Method for producing multilayered wiring substrate, multilayered wiring substrate, and electronic apparatus |
| 03/25/2009 | CN101394713A Photoelectric circuit board and manufacturing method thereof |
| 03/25/2009 | CN101394712A Hole blackening solution and preparation thereof |
| 03/25/2009 | CN101394711A Manufacture method of buildup circuit board |
| 03/25/2009 | CN101394710A Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device |
| 03/25/2009 | CN101393871A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 03/25/2009 | CN101393394A Photo-cured and heat-cured resin composition and pcondensate thereof |
| 03/25/2009 | CN101393331A Pressure bench structure and press joint device |
| 03/25/2009 | CN101391241A Jet orifice structure and preparation method thereof |
| 03/25/2009 | CN100473262C Metal foil adhered laminate |
| 03/25/2009 | CN100473261C Method and material for manufacturing circuit formed substrate |
| 03/25/2009 | CN100473260C Infrared melting welding machine |
| 03/25/2009 | CN100473259C Circuit board assembling method and structure, and tool for assembling said structure |
| 03/25/2009 | CN100473258C Electronic part and manufacturing method thereof |
| 03/25/2009 | CN100473257C Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet |
| 03/25/2009 | CN100473256C Laminating device of ceramic PCB substrate and laminating method thereof |
| 03/25/2009 | CN100473255C Circuit board for flip-chip connection and manufacturing method thereof |
| 03/25/2009 | CN100473254C Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
| 03/25/2009 | CN100472883C Interposed electrical connector which is intended to connect two stacked electronic circuits |
| 03/25/2009 | CN100472856C Method of producing membrane electrode assemblies |
| 03/25/2009 | CN100472779C Module part |
| 03/25/2009 | CN100472763C Semiconductor packing structure comprising passive element |
| 03/25/2009 | CN100472727C Resist film removing apparatus, method of removing resist film, organic matter removing apparatus and method of removing organic matter |
| 03/25/2009 | CN100472676C Distribution capacitor in high density application |
| 03/25/2009 | CN100472258C Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 03/25/2009 | CN100471673C Scraper for screen process press |
| 03/24/2009 | US7508681 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics |
| 03/24/2009 | US7508515 System and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 03/24/2009 | US7508076 Information handling system including a circuitized substrate having a dielectric layer without continuous fibers |
| 03/24/2009 | US7507913 Multilayer printed wiring board |
| 03/24/2009 | US7507682 Includes a ceramic component, an acrylic resin, and a cellulose resin, and loss factor tan delta of the paste; prevents a layer bonding failure and warping deformation |
| 03/24/2009 | US7507660 Deposition processes for tungsten-containing barrier layers |
| 03/24/2009 | US7507592 Bonding pad structure for a display device and fabrication method thereof |
| 03/24/2009 | US7507519 Thin film substrate with photothermal conversion material; light radiation zones |
| 03/24/2009 | US7507302 Method for producing nanocomposite magnet using atomizing method |
| 03/24/2009 | US7506794 High-temperature alloy standoffs for injection molding of solder |
| 03/24/2009 | US7506443 Beveled charge structure |
| 03/24/2009 | US7506438 Low profile integrated module interconnects and method of fabrication |
| 03/24/2009 | US7506437 Printed circuit board having chip package mounted thereon and method of fabricating same |
| 03/24/2009 | US7506436 Methods for making conforming shielded form for electronic component assemblies |
| 03/24/2009 | US7506435 Manufacturing method of a multi-layer circuit board with an embedded passive component |
| 03/24/2009 | US7506434 Electronic parts mounting method |
| 03/19/2009 | WO2009035867A1 Partially rigid flexible circuits and method of making same |
| 03/19/2009 | WO2009035136A1 Screen printing apparatus |
| 03/19/2009 | WO2009035071A1 Method for manufacturing multilayer printed wiring board |
| 03/19/2009 | WO2009035014A1 Process for producing multilayer printed wiring board |
| 03/19/2009 | WO2009034940A1 Method for formation of conductive layer, method for production of circuit board, method for production of conductive microparticle, and composition for formation of conductive layer |
| 03/19/2009 | WO2009034857A1 Film for metal film transfer and adhesive film with metal film |
| 03/19/2009 | WO2009034834A1 Ceramic multilayer substrate and method for producing the same |
| 03/19/2009 | WO2009034770A1 Contact exposure method and device thereof |
| 03/19/2009 | WO2009034764A1 Process for producing printed wiring board and printed wiring board produced by the production process |
| 03/19/2009 | WO2009034628A1 Solder precoated substrate, mounting substrate, and solder precoating method |
| 03/19/2009 | WO2009033842A1 Method for the hot embossing of at least one conductor track onto a substrate and substrate comprising at least one conductor track |
| 03/19/2009 | WO2009033716A1 Illumination device and method for the production thereof |
| 03/19/2009 | WO2008130493A3 Connecting microsized devices using ablative films |
| 03/19/2009 | US20090075404 Ball film for integrated circuit fabrication and testing |
| 03/19/2009 | US20090073670 Multilayered printed circuit board and fabricating method thereof |
| 03/19/2009 | US20090073668 Carrier Assembly For An Integrated Circuit |
| 03/19/2009 | US20090073661 Thin circuit module and method |
| 03/19/2009 | US20090073100 Signal transmission film and a liquid crystal display panel having the same |
| 03/19/2009 | US20090072378 Memory device system with stacked packages |
| 03/19/2009 | US20090071705 Printed circuit board having embedded components and method for manufacturing thereof |
| 03/19/2009 | US20090071704 Circuit board and method for fabricating the same |
| 03/19/2009 | US20090071701 Laminated structure, forming method of the same, wiring board, matrix substrate and electronic display apparatus |
| 03/19/2009 | US20090071699 Packaging substrate structure and method for manufacturing the same |
| 03/19/2009 | US20090071696 Partially rigid flexible circuits and method of making same |
| 03/19/2009 | US20090071259 Pressure Sensor and Manufacturing Method Thereof |
| 03/19/2009 | US20090070996 Printed circuit board manufacturing method |
| 03/19/2009 | US20090070995 Manufacturing method of display apparatus |
| 03/19/2009 | US20090070994 Method for manufacturing circuit board on which electronic component is mounted |
| 03/19/2009 | US20090070992 Pick And Place System For A Semiconductor Mounting Apparatus |
| 03/19/2009 | US20090070974 Apparatus for producing non-woven fabric |
| 03/19/2009 | DE19882125B4 Direkte Abscheidung von Palladium Direct deposition of palladium |
| 03/19/2009 | DE19838574B4 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device |
| 03/19/2009 | DE102007044337A1 Device for adjustment drive, particularly window lifter adjustment drive in vehicle, has mechanical or electrical component, which has epilam layer, which is formed on base of stearic acid, perfluorinated plastic or silicon |
| 03/19/2009 | DE102007043536A1 Control device i.e. internal-combustion engine control device, for motor vehicle, has three electrical modules connected with each other by module-oriented electrical connecting units that exhibit different electrical connection technique |
| 03/19/2009 | DE102006060801B4 Verfahren zur Herstellung eines Chipkartenmoduls und Chipkartenmodul A process for producing a chip card module and the smart card module |
| 03/18/2009 | EP2037723A2 LED contacts |
| 03/18/2009 | EP2037494A2 Method of using pre-applied underfill encapsulant |