| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/02/2009 | DE102008041644A1 Verfahren und computerlesbarer Code zum Bewerten eines dreidimensionalen Raums Method and computer readable code for evaluating a three-dimensional space |
| 04/01/2009 | EP2043419A1 Station for working on electronic boards with improved ergonomics |
| 04/01/2009 | EP2043142A1 Mounting method using thermocompression head |
| 04/01/2009 | EP2042983A2 Modular image display |
| 04/01/2009 | EP2042620A1 ELECTROLESS Ni-P PLATING METHOD AND SUBSTRATE FOR ELECTRONIC COMPONENT |
| 04/01/2009 | EP2042006A2 Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
| 04/01/2009 | EP2041782A1 Method of temporarily attaching a rigid carrier to a substrate |
| 04/01/2009 | EP2041020A1 Systems and methods for applying a liquid coating material to a substrate |
| 04/01/2009 | EP1807240A4 Electroform spring built on mandrel transferable to other surface |
| 04/01/2009 | EP1327265B1 Electronic module having canopy-type carriers |
| 04/01/2009 | EP1324135B1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 04/01/2009 | CN201216042Y Second order hole overlapping construction constructed by reverse suspension type blind hole |
| 04/01/2009 | CN101401496A Circuit board, electronic circuit device, and display |
| 04/01/2009 | CN101401495A Ceramic laminated device and method for manufacturing same |
| 04/01/2009 | CN101401494A Bump forming method and bump forming apparatus |
| 04/01/2009 | CN101401493A Methods of forming a flexible circuit board |
| 04/01/2009 | CN101401197A 电子元器件模块 Electronic Component Module |
| 04/01/2009 | CN101401039A Photosensitive composition, photosensitive film, method for permanent pattern formation using said photosensitive composition, and printed board |
| 04/01/2009 | CN101401035A Photosensitive resin composition, photosensitive transfer film, and method for pattern formation |
| 04/01/2009 | CN101400716A Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film |
| 04/01/2009 | CN101400246A Conductor rail with heat conduction |
| 04/01/2009 | CN101400222A Printed circuit board assembly and manufacturing method thereof |
| 04/01/2009 | CN101400221A Circuit board |
| 04/01/2009 | CN101400220A Method for producing wiring substrate |
| 04/01/2009 | CN101400219A Multilayer printed wiring board and method for fabrication thereof |
| 04/01/2009 | CN101400218A Method of interconnecting layers of a printed circuit board |
| 04/01/2009 | CN101400217A Method for heating flexible substrate for printed circuit board |
| 04/01/2009 | CN101400216A Method for producing wiring substrate with solder protuberance |
| 04/01/2009 | CN101400215A Circuit board producing method |
| 04/01/2009 | CN101400214A Turnover mechanism for printed circuit board |
| 04/01/2009 | CN101400213A Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method |
| 04/01/2009 | CN101400212A Method for producing printed circuit board for local region high frequency circuit by half-addition method |
| 04/01/2009 | CN101400211A Highly efficient copy method for PCB |
| 04/01/2009 | CN101399246A Package substrate structure and production method thereof |
| 04/01/2009 | CN101399210A Substrate manufacturing method |
| 04/01/2009 | CN101399171A Method of forming alignment mark |
| 04/01/2009 | CN101399117A Manufacturing method of laminated film and multilayer ceramic electronic device thereof |
| 04/01/2009 | CN101398990A Plasma display device |
| 04/01/2009 | CN101397656A Metallised parts made from plastic material |
| 04/01/2009 | CN101397425A Ink composition, pattern formation method and droplet discharge device |
| 04/01/2009 | CN101397402A Thermosetting resin composite and cured resin |
| 04/01/2009 | CN100475014C Operating circuit for a lamp with a heat sink |
| 04/01/2009 | CN100475012C Method for manufacturing intermediate plate |
| 04/01/2009 | CN100475006C Production technique for surface mounting multi-layer resistive plate |
| 04/01/2009 | CN100475005C Multilayer printed wiring board having filled-via structure |
| 04/01/2009 | CN100475004C Wiring board manufacturing method |
| 04/01/2009 | CN100475003C Printing circuit board embedding electronic device and manufacture method thereof |
| 04/01/2009 | CN100475002C Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board |
| 04/01/2009 | CN100475001C Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus |
| 04/01/2009 | CN100475000C Electric circuit module and method for assembling the same |
| 04/01/2009 | CN100474999C Copper size and wiring board using the same |
| 04/01/2009 | CN100474582C Mixed integrated circuit device and manufacturing method thereof |
| 04/01/2009 | CN100474572C Connector for making electrical contact at semiconductor scales and method for forming the same |
| 04/01/2009 | CN100474465C Formed element by coating technology and method for fabricating the same |
| 04/01/2009 | CN100474395C Suspension board with circuit |
| 04/01/2009 | CN100473507C Method for deburring in punching operation and method for manufacturing punched product |
| 04/01/2009 | CN100473454C Method of oxidizing substance and oxidizing apparatus thereof |
| 03/31/2009 | US7511616 Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit |
| 03/31/2009 | US7511378 Enhancement of performance of a conductive wire in a multilayered substrate |
| 03/31/2009 | US7510759 Electronic part and manufacturing method thereof |
| 03/31/2009 | US7510744 high adhesion between a resin layer and a metallic layer and excellent durability; providing a porous structure on the surface of the resin layer, and forming the metallic layer on the surface of the resin layer; e.g. polyimide; e.g. endless belts |
| 03/31/2009 | US7510617 Transfer sheet |
| 03/31/2009 | US7510592 reducing ions of a metal by precipitation with a reducing agent in a liquid-phase reaction system so that the metal is precipitated as metal powder particles; reducing agent is a reducing saccharide or a glycitol |
| 03/31/2009 | US7509909 Support system and method for a screen printing unit |
| 03/31/2009 | US7509733 Method for producing means of connecting and/or soldering a component |
| 03/26/2009 | WO2009039342A2 X-ray inspection of solder reflow in high-density printed circuit board applications |
| 03/26/2009 | WO2009039006A1 Filtered feedthrough assemblies for implantable devices and methods of manufacture |
| 03/26/2009 | WO2009038950A2 Flexible circuit board, manufacturing method thereof, and electronic device using the same |
| 03/26/2009 | WO2009038190A1 Adhesive composition and bonded body |
| 03/26/2009 | WO2009038177A1 Curable resin composition and use thereof |
| 03/26/2009 | WO2009038166A1 Epoxy resin composition |
| 03/26/2009 | WO2009038082A1 Photosensitive resin composition and laminate thereof |
| 03/26/2009 | WO2009037939A1 Printed wiring board and method for manufacturing the same |
| 03/26/2009 | WO2009037918A1 High frequency substrate and high frequency module using same |
| 03/26/2009 | WO2009037738A1 Pull-out wiring method, pull-out wiring program and pull-out wiring device |
| 03/26/2009 | WO2005065238A3 Micro pin grid array with pin motion isolation |
| 03/26/2009 | US20090081596 Metal photoetching product and production method thereof |
| 03/26/2009 | US20090080168 Printed circuit board, fabrication method and apparatus |
| 03/26/2009 | US20090080135 Apparatus and Method for ESD Protection of an Integrated Circuit |
| 03/26/2009 | US20090079056 Large substrate structural vias |
| 03/26/2009 | US20090078578 Pre-plating solutions for making printed circuit boards and methods for preparing the same |
| 03/26/2009 | US20090078451 Printed wiring board and method for manufacturing same |
| 03/26/2009 | US20090078449 Dielectric sheet |
| 03/26/2009 | US20090077799 Circuit board structure with capacitor embedded therein and method for fabricating the same |
| 03/26/2009 | US20090077798 Method for forming conductive post, method for manufacturing multilayered wiring substrate, and method for manufacturing electronic apparatus |
| 03/26/2009 | US20090077797 Electric connection element, and method of contacting electric components |
| 03/26/2009 | US20090077796 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 03/26/2009 | DE4324479B4 Verfahren zur Herstellung von lötfähigen Strukturen zur Kontaktierung von elektrischen Modulen A process for the production of solderable structures for contacting the electrical modules |
| 03/26/2009 | DE102008038835A1 Laserdirektabbildungsvorrichtung und Abbildungsverfahren Laser direct imaging apparatus and imaging method |
| 03/26/2009 | DE102007040662A1 Verfahren zur Montage von elektronischen Bauteilen und elektromechanischen Komponenten auf einer Leiterplatte A method for mounting electronic components and electromechanical components on a circuit board |
| 03/26/2009 | DE102006021560B4 Umspritzter Flachbandleiter mit heißgeprägter Schaltung Injection-molded ribbon cables with heat embossed circuit |
| 03/26/2009 | DE102005043279B4 Leiterplatte und Verfahren zur Lötung von SMD-Bauteilen in einem Reflow-Lötofen und anschließender selektiver Lötung von wenigstens einem bedrahteten Bauteil Circuit board and method for soldering SMD components in a reflow oven and subsequent selective soldering of at least one wired component |
| 03/25/2009 | EP2040528A1 Module for integrated control electronics with simplified construction |
| 03/25/2009 | EP2040526A2 Electric device, in particular control device for a motor vehicle |
| 03/25/2009 | EP2040524A1 Method for manufacturing an electronic device, in particular a power module, electrical device and connecting contact |
| 03/25/2009 | EP2040523A1 Wiring-connecting material and wiring-connected board production process using the same |
| 03/25/2009 | EP2040522A2 Laminated structure, forming method of the same, wiring board, matrix substrate and electronic display apparatus |
| 03/25/2009 | EP2040518A2 Heat transfer member and connector |
| 03/25/2009 | EP2040289A2 Packaging substrate structure and method for manufacturing the same |
| 03/25/2009 | EP2040268A1 Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |