| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/08/2009 | EP2044820A1 Lead terminal bonding method and printed circuit board |
| 04/08/2009 | EP2044819A1 Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier |
| 04/08/2009 | EP2044600A1 Transformer and associated method of making using liquid crystal polymer (lcp) material |
| 04/08/2009 | EP1625680A4 Method for optimizing high frequency performance of via structures |
| 04/08/2009 | EP1598862B1 Semiconductor device and radiation detector employing it |
| 04/08/2009 | CN201219328Y Auxiliary tin stamping clamper |
| 04/08/2009 | CN201217160Y Balance mobile device of printed circuit board shaping machine |
| 04/08/2009 | CN101406114A Shifted segment layout for differential signal traces to mitigate bundle weave effect |
| 04/08/2009 | CN101406113A Plate, patterning device employing the plate, and patterning method |
| 04/08/2009 | CN101405657A Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board |
| 04/08/2009 | CN101404857A Welding method and apparatus for connector |
| 04/08/2009 | CN101404856A Method for plug-in mounting press key lamp and printed circuit board |
| 04/08/2009 | CN101404855A Production method for organic oxidation-resistant film of circuit board and special air blade hole blowing device |
| 04/08/2009 | CN101404853A Splicing PCB board produced by paper fiber sheet material |
| 04/08/2009 | CN101404353A Ultra-broadband folding coil antenna of coplanar waveguide feed and method for producing the same |
| 04/08/2009 | CN101404259A Wiring board, semiconductor apparatus and method of manufacturing them |
| 04/08/2009 | CN101403863A Double-side exposal device |
| 04/08/2009 | CN101402808A Conductive pattern formation ink, conductive pattern and wiring substrate |
| 04/08/2009 | CN101402423A Adhesive material tape, method of connecting, and press-connecting the tape, adhesive material-tape reel, adhering device |
| 04/08/2009 | CN101402091A Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment |
| 04/08/2009 | CN100477891C Multilayer wiring board, method for producing the came, and method for producing fiber reinforced resin board |
| 04/08/2009 | CN100477890C Non-porous ring circuit manufacturing method of circuit board |
| 04/08/2009 | CN100477889C Method for manufacturing soft-hard composite board |
| 04/08/2009 | CN100477888C Method and device for mounting conductive ball |
| 04/08/2009 | CN100477887C Method for solder planting of conducting terminal |
| 04/08/2009 | CN100477886C Weld method of printing base plate and jet-flow welding flux trough |
| 04/08/2009 | CN100477885C Copper removing method for lead-free tin spray process in PCB and SMT |
| 04/08/2009 | CN100477884C Screen printing apparatus and screen printing method |
| 04/08/2009 | CN100477883C Method for manufacturing circuit board |
| 04/08/2009 | CN100477882C Power delivery apparatus, system and method |
| 04/08/2009 | CN100477881C Pattern forming structure, method of forming pattern, device, electrooptical device and electronic equipment |
| 04/08/2009 | CN100477438C Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 04/08/2009 | CN100477207C Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 04/08/2009 | CN100477194C Circuit board, manufacturing method thereof and semiconductor package and manufacturing method thereof |
| 04/08/2009 | CN100477193C Multilayer wiring board and manufacturing method thereof |
| 04/08/2009 | CN100477185C Surface mountable clip suitable for use in a mobile communication device |
| 04/08/2009 | CN100477118C Method for making layout wire and method for making semiconductor device |
| 04/08/2009 | CN100477063C Connection member and driving device of plasma display panel |
| 04/08/2009 | CN100477030C Common backed ceramic capacitor for printed-wiring board and manufacturing method thereof |
| 04/08/2009 | CN100477021C Techniques for fabricating a resistor on a flexible base material |
| 04/08/2009 | CN100476980C Improved method for adding flexiable circuit assembly of magnetic head stack assembly to actuator arm |
| 04/08/2009 | CN100475882C Impregnated glass fiber strands and products including the same |
| 04/08/2009 | CN100475738C Ceramic composition being fired at low temperature and having high strength and method for preparing the same, and laminated electronic parts using the same |
| 04/08/2009 | CN100475544C Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board |
| 04/08/2009 | CN100475513C Press for the production of laminates |
| 04/07/2009 | US7515879 Radio frequency circuit module |
| 04/07/2009 | US7515242 Liquid crystal display device comprising a thermally conductive layer and method of fabricating the same |
| 04/07/2009 | US7515240 Flat display panel and assembly process or driver components in flat display panel |
| 04/07/2009 | US7515116 Method for forming radio frequency antenna |
| 04/07/2009 | US7514791 High reliability multilayer circuit substrates |
| 04/07/2009 | US7514779 Multilayer build-up wiring board |
| 04/07/2009 | US7514770 Stack structure of carrier board embedded with semiconductor components and method for fabricating the same |
| 04/07/2009 | US7514637 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
| 04/07/2009 | US7514379 Reacting fluorene with vinylbenzyl halide; cured products having high heat resistance, low water absorption and excellent dielectric properties, for use in electronics |
| 04/07/2009 | US7514298 Printed wiring board for mounting semiconductor |
| 04/07/2009 | US7514176 Battery having a molded resin portion |
| 04/07/2009 | US7514038 hermetic sealed vias, formed by laser drilling and annealing, which are filled with conductive material such as fritless ink; electronics; biosensors; portable diagnostic medical equipment |
| 04/07/2009 | US7513182 Integrated circuit package separators |
| 04/07/2009 | US7513037 Method of embedding components in multi-layer circuit boards |
| 04/07/2009 | US7513036 Method of controlling contact load in electronic component mounting apparatus |
| 04/07/2009 | US7513035 Method of integrated circuit packaging |
| 04/07/2009 | US7513032 Method of mounting an electronic part to a substrate |
| 04/07/2009 | CA2343444C Printed conductors made of polyalkylene dioxythiophene |
| 04/02/2009 | WO2009042142A1 Electrical component mounting assemblies |
| 04/02/2009 | WO2009041484A1 Circuit substrate manufacturing method, and circuit substrate |
| 04/02/2009 | WO2009041299A1 Ink composition |
| 04/02/2009 | WO2009041292A1 Copper foil for printed circuit and copper clad laminate |
| 04/02/2009 | WO2009041235A1 Electronic part mounting method and device |
| 04/02/2009 | WO2009041166A1 Ceramic multilayer substrate |
| 04/02/2009 | WO2009041099A1 Reflow furnace |
| 04/02/2009 | WO2009040921A1 Epoxy resin composition and, produced therewith, prepreg and metal clad laminate |
| 04/02/2009 | WO2009040213A1 Method for production of an electronic appliance, in particular a power module, electrical appliance and connecting contact |
| 04/02/2009 | WO2009039802A1 Method for producing a semiconductor component, and semiconductor component |
| 04/02/2009 | WO2009039631A1 Carrier chip with cavity |
| 04/02/2009 | WO2009023238A4 High-speed router with backplane using multi-diameter drilled thru-holes and vias |
| 04/02/2009 | WO2009018993A3 Device for electrical connection between a first support element and a second support element, method of electrical connection between a first support element and a second support element, and method of mounting an electrical component on a first support element |
| 04/02/2009 | WO2008154123A3 Method of forming solid blind vias through the dielectric coating on high density interconnect (hdi) substrate materials |
| 04/02/2009 | WO2008113644A3 Sensor element of a gas sensor |
| 04/02/2009 | WO2005048670A3 Method for verifying hairline cracks in a soldered joint between a component and a printed circuit board |
| 04/02/2009 | WO2005020648A3 Copper-faced modules, imprinted copper circuits, and their application to suptercomputers |
| 04/02/2009 | US20090088618 System and Method for Manufacturing a Swallowable Sensor Device |
| 04/02/2009 | US20090087548 Method of forming circuit pattern |
| 04/02/2009 | US20090087547 Printed circuit board and method of manufacturing the same |
| 04/02/2009 | US20090086455 Circuit device and method of manufacturing the same |
| 04/02/2009 | US20090086453 Package with passive component support assembly |
| 04/02/2009 | US20090086450 Printed circuit board, method for manufacturing printed circuit board and electronic apparatus |
| 04/02/2009 | US20090086447 Electronic circuit device and method of making the same |
| 04/02/2009 | US20090085691 Printed circuit board with embedded chip capacitor and chip capacitor embedment method |
| 04/02/2009 | US20090085050 Island submount and a method thereof |
| 04/02/2009 | US20090084684 Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method |
| 04/02/2009 | US20090084598 Coreless substrate and method of manufacture thereof |
| 04/02/2009 | US20090084596 Multi-layer board incorporating electronic component and method for producing the same |
| 04/02/2009 | US20090084595 Printed circuit board and manufacturing method of the same |
| 04/02/2009 | US20090084591 Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor |
| 04/02/2009 | US20090084586 Assembly comprising an electromagnetically screened smd component, method and use |
| 04/02/2009 | US20090084585 Wiring substrate and method of manufacturing the same |
| 04/02/2009 | US20090084583 Multilayer printed wiring board and method for fabrication thereof |
| 04/02/2009 | US20090083977 Method for Filling Via Holes in Semiconductor Substrates |
| 04/02/2009 | US20090083976 Method for manufacturing printed circuit board |
| 04/02/2009 | US20090083975 Method of interconnecting layers of a printed circuit board |