| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/15/2009 | CN101411249A Reflow furnace |
| 04/15/2009 | CN101411248A Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method |
| 04/15/2009 | CN101410973A Wafer-level chip scale package and method for fabricating and using the same |
| 04/15/2009 | CN101410755A Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board |
| 04/15/2009 | CN101410503A Improved alkaline solutions for post CMP cleaning processes |
| 04/15/2009 | CN101409987A Core substrate and method of producing the same |
| 04/15/2009 | CN101409986A Core substrate and manufacturing method thereof |
| 04/15/2009 | CN101409985A Method of producing substrate |
| 04/15/2009 | CN101409984A Circuit board and production method thereof |
| 04/15/2009 | CN101409983A Method of producing substrate |
| 04/15/2009 | CN101409982A Method for manufacturing circuit board |
| 04/15/2009 | CN101409979A Circuit board and processing method thereof |
| 04/15/2009 | CN101409978A Multi-layer wiring board, interconnection blank and interconnection element capable of being patterned, and manufacturing method of the multi-layer wiring board |
| 04/15/2009 | CN101409977A Core member and method of producing the same |
| 04/15/2009 | CN101409976A Multilayer flexible circuit board |
| 04/15/2009 | CN101409273A Ball-placing side surface structure for package substrate and manufacturing method thereof |
| 04/15/2009 | CN101409239A Method for manufacturing wiring plate |
| 04/15/2009 | CN101409238A Method for preparing seedless layer package substrate |
| 04/15/2009 | CN101408688A Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 04/15/2009 | CN101407705A Double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board and wiring circuit board |
| 04/15/2009 | CN101407636A Resin composition for appearance inspection of printed circuit board |
| 04/15/2009 | CN100479636C Method for soldering electronic component comprising a welding disk on substrate |
| 04/15/2009 | CN100479635C Circuit board, circuit board mounting method, and electronic device using the circuit board |
| 04/15/2009 | CN100479634C Method for improving circuitboard welding quality and air knife device therefor |
| 04/15/2009 | CN100479633C Layered pattern producing method, distribution producing method and method for producing electronic equipment |
| 04/15/2009 | CN100479632C Backboard wiring method |
| 04/15/2009 | CN100479631C Method of manufacturing package substrate with fine circuit pattern using anodic oxidation |
| 04/15/2009 | CN100479230C Electric circuit battery support |
| 04/15/2009 | CN100479131C Method for manufacturing trajectory with enlarged capacitive coupling and corresponding trajectory |
| 04/15/2009 | CN100479123C Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof |
| 04/15/2009 | CN100478985C Method and device for continuously producing electronic film components, and an electronic film component |
| 04/15/2009 | CN100478743C Display device |
| 04/15/2009 | CN100478492C Method for improving fluidity and weldability of metal coating welded on substrate |
| 04/14/2009 | US7518882 Circuit module |
| 04/14/2009 | US7518275 Vibrator and portable terminal device mounted with the vibrator |
| 04/14/2009 | US7518248 Inductive filters and methods of fabrication therefor |
| 04/14/2009 | US7518228 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 04/14/2009 | US7518065 Printed wiring board for plasma display and process for producing the same |
| 04/14/2009 | US7517636 Can shorten developing time and has high stripping property and tent reliability |
| 04/14/2009 | US7517560 Method of manufacturing substrate having resist film |
| 04/14/2009 | US7517553 Applying a polyimide precursor solution to a substrate, drying, applying as an adhesive aid a phenolic hydroxyl group-containing polyamide, e.g., from 5-hydroxyisophthalic acid, and imidizing the precursor by heating at 200-500 degrees C.; single and double-sided copper-clad laminate |
| 04/14/2009 | US7517419 Substrate support jig, circuit board production apparatus, and method of producing circuit board |
| 04/14/2009 | US7517410 Micro adhesive nozzle and adhesive applying apparatus |
| 04/14/2009 | US7517225 Connector with wipe |
| 04/14/2009 | US7516545 Method of manufacturing printed circuit board having landless via hole |
| 04/14/2009 | US7516544 Spacers for reducing crosstalk and maintaining clearances |
| 04/14/2009 | US7516543 Method for manufacturing semiconductor component with a media channel |
| 04/14/2009 | US7516542 Wiring board and manufacturing method therefor |
| 04/14/2009 | CA2364918C Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
| 04/09/2009 | WO2009045932A1 Improved systems and methods for drilling holes in printed circuit boards |
| 04/09/2009 | WO2009044801A1 Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device |
| 04/09/2009 | WO2009044737A1 Electronic component |
| 04/09/2009 | WO2009044732A1 Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure |
| 04/09/2009 | WO2009044706A1 Circuit-connecting material and circuit terminal connection structure |
| 04/09/2009 | WO2009044699A1 Three-dimensional board warp analysis system, three-dimensional board warp analysis device, three-dimensional board warp analysis method and program |
| 04/09/2009 | WO2009044695A1 Method and the like for mounting electronic component |
| 04/09/2009 | WO2009044678A1 Circuit connecting material, circuit connection structure, and method for producing the same |
| 04/09/2009 | WO2009044219A1 Method and system for making a line of required length using ink jet |
| 04/09/2009 | WO2009043724A1 Connecting film and electrical connection element |
| 04/09/2009 | WO2008145229A3 Method for the treatment of flat substrates, and use of said method |
| 04/09/2009 | WO2008142070A3 Method for the production of polymer-coated metal foils, and use thereof |
| 04/09/2009 | WO2008020910A3 Process for improving the adhesion of polymeric materials to metal surfaces |
| 04/09/2009 | WO2007106636A3 Warp compensated package and method |
| 04/09/2009 | WO2007060661A3 Method and devices for surface mounting |
| 04/09/2009 | WO2005119860A3 Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
| 04/09/2009 | WO2005089143A3 Manufacture of rfid tags and intermediate products therefor |
| 04/09/2009 | US20090091904 Circuit Module and Radio Communications Equipment, and Method for Manufacturing Circuit Module |
| 04/09/2009 | US20090091896 Optimum Structure for Single-sides PCB with SMD LEDs for the Express Card |
| 04/09/2009 | US20090091603 Inkjet Printhead With Arcuate Actuator Path |
| 04/09/2009 | US20090091601 Inkjet Nozzle Utilizing Electrostatic Attraction Between Parallel Plates |
| 04/09/2009 | US20090091406 Compact via transmission line for printed circuit board and design method of the same |
| 04/09/2009 | US20090090548 Circuit board and fabrication method thereof |
| 04/09/2009 | US20090090547 Multilayer printed wiring board |
| 04/09/2009 | US20090090544 System and Method for Substrate with Interconnects and Sealing Surface |
| 04/09/2009 | US20090090543 Circuit board, semiconductor device, and method of manufacturing semiconductor device |
| 04/09/2009 | US20090090542 Multilayer printed wiring board |
| 04/09/2009 | US20090090465 Printed wiring board with conductive constraining core including resin filled channels |
| 04/09/2009 | US20090090004 Method for manufacturing printed wiring board |
| 04/09/2009 | US20090090003 Printed wiring board and method for producing the same |
| 04/09/2009 | US20090090002 Method of manufacturing an electronic component substrate |
| 04/09/2009 | US20090089999 Analyte Monitoring Device and Methods of Use |
| 04/09/2009 | US20090089997 Method Of Forming An Electrical Circuit With Overlaying Integration Layer |
| 04/09/2009 | DE19755765C5 Gehäuse mit Deckel Housing with cover |
| 04/09/2009 | DE112007001051T5 Verfahren zum Begutachten eines Druckes, Vorrichtung zum Begutachten eines Druckes und Drucker Method for the assessment of a pressure device for the assessment of pressure and printers |
| 04/09/2009 | DE102008039768A1 Befestigungsstruktur für eine elektronische Vorrichtung für eine Stromschiene Mounting structure for an electronic device for a conductor rail |
| 04/09/2009 | DE102008022977A1 Encapsulated circuit manufacturing method for hearing aid, involves not encapsulating printed circuit board region by encapsulation and by rotatary attachment of upper surface to self-adhesive encapsulation, where surface is encapsulated |
| 04/09/2009 | DE102007047708A1 Verfahren und Vorrichtung zur Herstellung zumindest einer Leiterplatte Method and apparatus for production of at least one printed circuit board |
| 04/09/2009 | DE102007046493A1 Dreidimensionaler elektronischer Schaltungsträgeraufbau, sowie Schaltungsgrundträger aufweisend den Schaltungsträgeraufbau als Funktionsbauteil und dreidimensionale Schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen Schaltungsträgeraufbauten Three-dimensional electronic circuit support structure, as well as basic circuit carrier comprising the circuit board structure as a functional component and three-dimensional circuit arrangement consisting of at least two of such three-dimensional circuit carrier assemblies |
| 04/09/2009 | DE102007046428A1 Anschlussfolie und elektrische Anschlussverbindung Connection foil and electrical terminal connection |
| 04/09/2009 | DE102007045930A1 Partial galvanic pure tin-surface producing method for printed circuit board, involves stripping photo-layer by alkaline stripper, tin-plating and soldering solder pad, and covering regions provided as copper surfaces with solder resist |
| 04/09/2009 | DE102007045732A1 Component e.g. electronic component such as sensor, has three-dimensional soldering surface with soldering body having slots at surface, where slots are fixed for receiving of fluid solder during soldering process by capillary forces |
| 04/09/2009 | DE102007045630A1 Vibration resistance ensuring method for cup capacitor, involves assembling and soldering components using supporting balls for capacitor, whose body form protrudes in surface level of flat module over pad at rim of capacitor |
| 04/09/2009 | DE102007044754A1 Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly |
| 04/09/2009 | DE102005017331B4 Schaltungsplatine Circuit board |
| 04/09/2009 | DE102004037629B4 Verbindungselement für Leiterplatten Connecting element for printed circuit boards |
| 04/09/2009 | DE10143919B4 Elekrisch leitende Paste und Verfahren zur Herstellung eines mehrlagigen keramischen elektronischen Bauteils unter verwendung dieser Paste By electricity-conducting paste and method of manufacturing a multilayer ceramic electronic component using this paste |
| 04/09/2009 | DE10120641B4 Keramik mit sehr guten Hochfrequenzeigenschaften und Verfahren zu ihrer Herstellung Ceramic having excellent high-frequency properties and processes for their preparation |
| 04/08/2009 | EP2046107A1 Circuit board device, electronic device provided with the circuit board device and gnd connecting method |
| 04/08/2009 | EP2046103A1 Flexible printed board, electronic device mounted with this, and flexible printed board folding method |
| 04/08/2009 | EP2044821A1 Ball grid array (bga) connection system and related method and ball socket |