| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/22/2009 | CN100482044C Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting the components in a circuit board |
| 04/22/2009 | CN100482043C Soldering process |
| 04/22/2009 | CN100482042C Paste-tin printing apparatus for non-plane printed circuit board |
| 04/22/2009 | CN100482041C 印刷布线板 A printed circuit board |
| 04/22/2009 | CN100482040C Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits |
| 04/22/2009 | CN100482039C Method for printed circuit board making process to overcome gold touch in non penetration hole |
| 04/22/2009 | CN100482038C Exposure unit |
| 04/22/2009 | CN100482037C Method for manufacturing embedded film resistor of printed circuit board |
| 04/22/2009 | CN100482036C Vacuum air compression warehouse for circuit board |
| 04/22/2009 | CN100482035C Method for manufacturing heat conductive substrate |
| 04/22/2009 | CN100482034C Method for forming metal layer |
| 04/22/2009 | CN100482033C Connection structure of printed wiring board |
| 04/22/2009 | CN100482032C Printed circuit board having embedded RF module power stage circuit |
| 04/22/2009 | CN100481444C A modular integrated circuit chip carrier |
| 04/22/2009 | CN100481362C Fabrication method of semiconductor integrated circuit device |
| 04/22/2009 | CN100481357C Method for manufacturing a substrate with cavity |
| 04/22/2009 | CN100481116C Touch panel and liquid crystal display apparatus using the same |
| 04/22/2009 | CN100480754C Method of forming optical devices |
| 04/22/2009 | CN100480722C Printed circuit board with weak magnetic field sensor and method of fabricating the same |
| 04/22/2009 | CN100480695C Electrochemical screen printing electrode sensing test piece and making process thereof |
| 04/22/2009 | CN100480620C System and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 04/22/2009 | CN100480365C Detergent composition |
| 04/22/2009 | CN100480100C Bus bar substrate for vehicle interior light |
| 04/21/2009 | US7522384 Method of head stack assembly flexible circuit assembly attached to an actuator arm |
| 04/21/2009 | US7522262 Method for determining position of reference point |
| 04/21/2009 | US7521811 Substrate for packaging semiconductor chip and method for manufacturing the same |
| 04/21/2009 | US7521809 Semiconductor device having a chip stack on a rewiring plate |
| 04/21/2009 | US7521789 Electrical assembly having heat sink protrusions |
| 04/21/2009 | US7521781 Integrated circuit package system with mold clamp line critical area having widened conductive traces |
| 04/21/2009 | US7521779 Roughened printed circuit board |
| 04/21/2009 | US7521651 Multiple beam micro-machining system and method |
| 04/21/2009 | US7521636 Connecting apparatus adapted in a board module |
| 04/21/2009 | US7521286 Methods of refining lead-containing materials |
| 04/21/2009 | US7521115 Low temperature bumping process |
| 04/21/2009 | US7520767 Joint member and joint connector for wire harness |
| 04/21/2009 | US7520742 Nanoprint equipment and method of making fine structure |
| 04/21/2009 | US7520416 Transparent window with non-transparent contact surface for a soldering bonding |
| 04/21/2009 | US7520054 Process of manufacturing high frequency device packages |
| 04/21/2009 | US7520053 Method for manufacturing a bump-attached wiring circuit board |
| 04/21/2009 | US7520052 Method of manufacturing a semiconductor device |
| 04/21/2009 | US7520051 Packaging methods and systems for measuring multiple measurands including bi-directional flow |
| 04/21/2009 | CA2505981C Compositions containing fluorinated hydrocarbons and oxygenated solvents |
| 04/16/2009 | WO2009048604A2 Robust multi-layer wiring elements and assemblies with embedded microelectronic elements |
| 04/16/2009 | WO2009048338A1 Method and device for supplying electrical power |
| 04/16/2009 | WO2009047854A1 Electrical connection body, method for forming electrical connection body, and cartridge |
| 04/16/2009 | WO2009047849A1 Production device of flexible wiring board |
| 04/16/2009 | WO2009047075A1 Method and device for producing at least one printed circuit board |
| 04/16/2009 | WO2009046546A1 Systems, methods, and apparatus for multilayer superconducting printed circuit boards |
| 04/16/2009 | WO2008137459A3 Agitation of electrolytic solution in electrodeposition |
| 04/16/2009 | WO2008127282A3 Composition and associated method |
| 04/16/2009 | WO2007025060A3 Rfid tag and method and apparatus for manufacturing same |
| 04/16/2009 | WO2006132828A3 Telecommunications module storage apparatus and method |
| 04/16/2009 | WO2006099582A3 Mini wave soldering system and method for soldering wires and pin configurations |
| 04/16/2009 | WO2006099554A3 Manufacturing process: how to construct constraining core material into printed wiring board |
| 04/16/2009 | US20090099025 Systems, methods, and apparatus for multilayer superconducting printed circuit boards |
| 04/16/2009 | US20090098643 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| 04/16/2009 | US20090098350 Conductor composition v |
| 04/16/2009 | US20090097214 Electronic chip embedded circuit board and method of manufacturing the same |
| 04/16/2009 | US20090097209 Driver module structure |
| 04/16/2009 | US20090095818 Wireless Devices Including Printed Integrated Circuitry and Methods for Manufacturing and Using the Same |
| 04/16/2009 | US20090095524 Core substrate and method of producing the same |
| 04/16/2009 | US20090095520 Wiring substrate and method of manufacturing the same |
| 04/16/2009 | US20090095519 Current distribution structure and method |
| 04/16/2009 | US20090095518 Wiring board and method of manufacturing the same |
| 04/16/2009 | US20090095514 Wiring board, semiconductor apparatus and method of manufacturing them |
| 04/16/2009 | US20090095511 Circuit board and method of producing the same |
| 04/16/2009 | US20090095510 Electronic device, electronic module, and methods for manufacturing the same |
| 04/16/2009 | US20090095509 Core substrate and method of producing the same |
| 04/16/2009 | US20090095508 Printed circuit board and method for manufacturing the same |
| 04/16/2009 | US20090095507 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits |
| 04/16/2009 | US20090095176 Method and apparatus for PCB finishing processes |
| 04/16/2009 | US20090094826 Contacting component, method of producing the same, and test tool having the contacting component |
| 04/16/2009 | US20090094825 Method of producing substrate |
| 04/16/2009 | US20090094824 Method of producing substrate |
| 04/16/2009 | DE10210041B4 Wärmeableitvorrichtung zum Ableiten von Wärme, die von einem elektrischen Bauelement erzeugt wird und Verfahren zum Herstellen einer derartigen Wärmeableitvorrichtung Heat sink for dissipating heat generated by an electrical component and method for manufacturing such a heat sink |
| 04/16/2009 | DE102005008878B4 Verfahren zur Bestimmung der Position eines Fräswerkzeuges und ein zur Durchführung des Verfahrens bestimmter Bearbeitungskopf A method for determining the position of a milling tool and a specific method for carrying out the machining head |
| 04/16/2009 | CA2697829A1 Apparatus and methods for the measurement of cardiac output |
| 04/15/2009 | EP2048924A2 Electronic component with high density, low cost attachment |
| 04/15/2009 | EP2048923A2 Method of manufacturing silicon substrate with a conductive through-hole |
| 04/15/2009 | EP2048704A1 Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display |
| 04/15/2009 | EP2048209A1 Adhesive composition, and connection structure for circuit member |
| 04/15/2009 | EP2048205A1 Dispersion conatining metal fine particles, process for production of the dispersion, and articles having metal films |
| 04/15/2009 | EP2047943A2 Cream solder and method of soldering electronic part |
| 04/15/2009 | EP2047725A1 Production method of solder circuit board |
| 04/15/2009 | EP2047724A2 Conductor carrier and arrangement comprising a conductor carrier |
| 04/15/2009 | EP2047715A1 Resistor assembly and method for producing said assembly |
| 04/15/2009 | EP1973742B1 Material jet system |
| 04/15/2009 | EP1663569A4 Closed loop backdrilling system |
| 04/15/2009 | EP1525069B1 System and method of laser drilling using a continuously optimized depth of focus |
| 04/15/2009 | EP1474811B1 Process for forming an embedded resistor |
| 04/15/2009 | EP1447712B1 Methods of producing photosensitive ceramic composition and multi-layer substrate using it |
| 04/15/2009 | EP1354351B1 Direct build-up layer on an encapsulated die package |
| 04/15/2009 | CN201222824Y Apparatus for cleaning solder resist for processing circuit board |
| 04/15/2009 | CN201222823Y Multi-layer shelf apparatus |
| 04/15/2009 | CN201222822Y Platform apparatus for plate-placing vehicle |
| 04/15/2009 | CN201222821Y Holder for storing PCB plate |
| 04/15/2009 | CN101411253A Multilayer wiring board and its manufacturing method |
| 04/15/2009 | CN101411252A Circuit board, method for testing circuit board, and method for manufacturing circuit board |
| 04/15/2009 | CN101411251A Method for forming bump and device for forming bump |
| 04/15/2009 | CN101411250A Method for applying solder particles to contact surfaces as well as solder particles suitable for this and components with contact surfaces |