| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/29/2009 | CN100484372C Printed-wiring board and method of producing the same |
| 04/29/2009 | CN100484371C Welding disk for preventing host board short circuit |
| 04/29/2009 | CN100484370C Production of flexible printing circuit board |
| 04/29/2009 | CN100484369C Correcting system of vision punching machine of printed circuit board machine |
| 04/29/2009 | CN100484366C Method for preparing multilayer ceramic substrate |
| 04/29/2009 | CN100484365C Flexible printed circuit board |
| 04/29/2009 | CN100484363C Wiring circuit board and production method thereof |
| 04/29/2009 | CN100483694C Package for semiconductor devices |
| 04/29/2009 | CN100483565C Insulating material, film, circuit board and method for manufacture thereof |
| 04/29/2009 | CN100483190C Audio signal processing circuit and a display device incorporating the same |
| 04/29/2009 | CN100483024C Heat radiation structure of LED lamp |
| 04/29/2009 | CN100482859C Metal film forming device |
| 04/29/2009 | CN100482756C Electrode connection method and surface processing distribution panel and adhesive film used thereof |
| 04/28/2009 | US7526152 Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard |
| 04/28/2009 | US7525817 Wiring layout of auxiliary wiring package and printed circuit wiring board |
| 04/28/2009 | US7525768 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 04/28/2009 | US7525628 Planar display module |
| 04/28/2009 | US7525221 Connection arrangement for connecting an electronic component and a power circuit of a control device |
| 04/28/2009 | US7525190 Printed wiring board with wiring pattern having narrow width portion |
| 04/28/2009 | US7524893 Conductive adhesive |
| 04/28/2009 | US7524748 Method of interconnecting terminals and method of mounting semiconductor devices |
| 04/28/2009 | US7524703 Integrated circuit stacking system and method |
| 04/28/2009 | US7524702 Conductor substrate, semiconductor device and production method thereof |
| 04/28/2009 | US7524559 Resin particle, conductive particle, and anisotropic conductive adhesive containing the same |
| 04/28/2009 | US7524528 Precursor compositions and methods for the deposition of passive electrical components on a substrate |
| 04/28/2009 | US7524194 Lithographic type microelectronic spring structures with improved contours |
| 04/28/2009 | US7524025 Inkjet printer |
| 04/28/2009 | US7523551 Manufacturing method of a multi-layer circuit board embedded with a passive component |
| 04/28/2009 | US7523549 Dimensionally stabilized flexible circuit fabrication method and product |
| 04/28/2009 | US7523548 Method for producing a printed circuit board |
| 04/28/2009 | US7523547 Method for attaching a flexible structure to a device and a device having a flexible structure |
| 04/28/2009 | US7523546 Method for manufacturing a composite layer for an electronic device |
| 04/28/2009 | US7523545 Methods of manufacturing printed circuit boards with stacked micro vias |
| 04/28/2009 | CA2497118C Surface mount technology evaluation board |
| 04/23/2009 | WO2009051465A1 Overhead traveling camera inspection system |
| 04/23/2009 | WO2009051239A1 Wiring board, mounting structure and method for manufacturing wiring board |
| 04/23/2009 | WO2009051209A1 Resin composition |
| 04/23/2009 | WO2009051120A1 Substrate with semiconductor element mounted thereon |
| 04/23/2009 | WO2009050974A1 Process for manufacturing ceramic multilayer substrate with cavity |
| 04/23/2009 | WO2009050971A1 Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit substrate |
| 04/23/2009 | WO2009050970A1 Metal covered polyimide composite, process for producing the composite, and apparatus for producing the composite |
| 04/23/2009 | WO2009050956A1 Solder melting method, method for manufacturing mounting substrate, and solder melting apparatus |
| 04/23/2009 | WO2009050936A1 Multilayer ceramic substrate and process for producing the multilayer ceramic |
| 04/23/2009 | WO2009050851A1 Circuit board and electronic device |
| 04/23/2009 | WO2009050843A1 Electronic device |
| 04/23/2009 | WO2009050829A1 Wiring board and its manufacturing method |
| 04/23/2009 | WO2008031492A8 Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
| 04/23/2009 | US20090104804 Led metal strip flexible interconnection |
| 04/23/2009 | US20090103387 High performance high capacity memory systems |
| 04/23/2009 | US20090103276 Circuit device and method of manufacturing the same |
| 04/23/2009 | US20090103267 Electronic assembly and method for making the electronic assembly |
| 04/23/2009 | US20090101513 Method of manufacturing a film printed circuit board |
| 04/23/2009 | US20090101400 Method for manufacturing component-embedded substrate and component-embedded substrate |
| 04/23/2009 | US20090101398 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component |
| 04/23/2009 | US20090101391 Circuit board having barcode and fabrication method thereof |
| 04/23/2009 | US20090101390 Electronic control unit and process of producing the same |
| 04/23/2009 | US20090101279 Adhesive, method of connecting wiring terminals and wiring structure |
| 04/23/2009 | US20090101274 Single or Multi-Layer Printed Circuit Board With Improved Via Design |
| 04/23/2009 | US20090100673 Method for manufacturing wiring board |
| 04/23/2009 | US20090100672 Electronic component placement method |
| 04/23/2009 | US20090100671 Printed circuit board and manufacturing method thereof |
| 04/23/2009 | US20090100670 Input device and its manufacturing method |
| 04/23/2009 | DE4345586B4 Verfahren zum Erzeugen von Vielfach-Dickschichtsubstraten A method of generating multiple thick film substrates |
| 04/23/2009 | DE19980146B4 Verfahren zum Verwerten von Altplatinen und mit diesem hergestellte Verbundplatte Method for utilizing Altplatinen and with this manufactured composite board |
| 04/23/2009 | DE19900437B4 Verfahren und Vorrichtung zur Ionenimplantation in Festkörpern und/oder zur Beschichtung von Festkörperoberflächen sowie die Verwendung von Verfahren und Vorrichtung Method and apparatus for ion implantation in solids and / or for the coating of solid surfaces and the use of methods and apparatus |
| 04/23/2009 | DE19714385B4 Verfahren zur Befestigung von Bauelementen in COB-Bauweise A process for fixing components in COB-construction |
| 04/23/2009 | DE112007000238T5 Vorrichtung und Methode zur Außer-Achse-Beleuchtung An apparatus and method for off-axis illumination |
| 04/23/2009 | DE102008049357A1 Low-inductive condenser assembly arrangement, has condenser sleeve with two poles which are connected with outward guided electrical feed lines, where one pole is electrically coupled with housing |
| 04/23/2009 | DE102008048065A1 Elektrisch leitende Zusammensetzung, Verfahren zur Herstellung eines elektrisch leitenden Films und elektrisch leitender Film Electrically conductive composition, method of producing an electroconductive film and electroconductive film |
| 04/23/2009 | DE102007045261A1 Elektrisches Gerät, insbesondere Steuergerät für ein Kraftfahrzeug Electrical device, in particular control device for a motor vehicle |
| 04/23/2009 | DE102007044602A1 Multilayer-Leiterplatte und Verwendung einer Multilayer-Leiterplatte Multi-layer printed circuit board and using a multi-layer printed circuit board |
| 04/22/2009 | EP2051570A1 Method of producing multilayer ceramic substrate |
| 04/22/2009 | EP2050567A2 Method to align a carrier material that is to be printed |
| 04/22/2009 | EP2050322A1 Registration system and method |
| 04/22/2009 | EP2050321A1 Method for producing structured electrically conductive surfaces |
| 04/22/2009 | EP2050320A1 Method and apparatuses for printing and printed product |
| 04/22/2009 | EP2050131A1 Method for producing an electric functional layer on a surface of a substrate |
| 04/22/2009 | EP1706844A4 Method and system for manufacturing radio frequency identification tag antennas |
| 04/22/2009 | EP1552732B1 Method and device for joining at least two parts |
| 04/22/2009 | EP1500743B1 Heat-resistant synthetic fiber sheet |
| 04/22/2009 | EP1332238B1 Metallized film, method for the production thereof, and its use |
| 04/22/2009 | EP0782766B1 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 04/22/2009 | CN201226615Y Apparatus for leveling circuit board |
| 04/22/2009 | CN201226078Y Combined printing formwork |
| 04/22/2009 | CN101416570A Multilayer ceramic substrate, method for producing the same and electronic component |
| 04/22/2009 | CN101416569A Electrolytic method for filling holes and cavities with metals |
| 04/22/2009 | CN101416568A Components joining method and components joining structure |
| 04/22/2009 | CN101415546A Mold release film, mold release cushion material, and process for manufacturing printed board |
| 04/22/2009 | CN101415502A Process for creating a pattern on a copper surface |
| 04/22/2009 | CN101415299A Method of manufacturing multi-layer circuit board |
| 04/22/2009 | CN101415298A Gibbosity type kettle mouth with external-open tin-overflowing mouth |
| 04/22/2009 | CN101415297A Printed plate component and method of processing the same |
| 04/22/2009 | CN101414566A Wiring circuit board, manufacturing method thereof, circuit module provided with this wiring circuit board |
| 04/22/2009 | CN101414499A Multi-layer type over-current and over-temperature protection structure, and preparation method thereof |
| 04/22/2009 | CN101414130A Exposure device |
| 04/22/2009 | CN101412298A Method of producing flexible single-sided polyimide copper-clad laminate |
| 04/22/2009 | CN100482048C Wiring board and fabrication method thereof |
| 04/22/2009 | CN100482047C Manufacturing method for multilayer printed circuit board with convex column conducting |
| 04/22/2009 | CN100482046C Printed circuit board manufacturing method |
| 04/22/2009 | CN100482045C Method and apparatus for manufacturing circuit board |