| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/06/2009 | CN100485913C Substrate for mounting semiconductor |
| 05/06/2009 | CN100485909C Structure combining IC integration base board and carrier board and manufacturing method for the same and electronic device |
| 05/06/2009 | CN100485902C Substrate dividing method |
| 05/06/2009 | CN100485901C Substrate dividing method |
| 05/06/2009 | CN100485774C Display device |
| 05/06/2009 | CN100484755C Multilayer body and method for producing same |
| 05/06/2009 | CN100484753C Flexible metal laminated body and producing method thereof |
| 05/06/2009 | CN100484730C Flexible printed circuit board cutting method |
| 05/06/2009 | CN100484686C Method for producing leadless welding flux delamination structure |
| 05/05/2009 | US7529102 Wiring substrate, electronic device, electro-optical device, and electronic apparatus |
| 05/05/2009 | US7528488 Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure |
| 05/05/2009 | US7528487 Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board |
| 05/05/2009 | US7528486 Anisotropic conductive film and bump, and packaging structure of semiconductor having the same |
| 05/05/2009 | US7528470 Conductor board and method for producing a conductor board |
| 05/05/2009 | US7528220 Bis(cyanatophenylmethyl)-biphenyls and -naphthyls and their oligomers; low dielectric constant; high glass transition temperature; matrix resin for a laminate or a prepreg used for electrical devices; semiconductor-sealing resin, printed wiring board adhesive |
| 05/05/2009 | US7527692 Processing apparatus which performs predetermined processing while supplying a processing liquid to a substrate |
| 05/05/2009 | US7527681 Electroless copper and redox couples |
| 05/05/2009 | US7526861 Method for fabricating structure of polymer-matrix conductive film |
| 05/05/2009 | US7526859 Apparatus for manufacturing a wiring board |
| 04/30/2009 | WO2009055517A1 Negative imaging method for providing a patterned metal layer having high conductivity |
| 04/30/2009 | WO2009055116A2 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating |
| 04/30/2009 | WO2009054523A1 Flexible printed circuit board, inlet sheet using the same, rfid media, and method for producing the rfid media |
| 04/30/2009 | WO2009054505A1 Metal-clad polyimide resin base material |
| 04/30/2009 | WO2009054502A1 Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle |
| 04/30/2009 | WO2009054456A1 Method for manufacturing printed wiring board |
| 04/30/2009 | WO2009054410A1 Conductive particle, circuit connecting material, and connection structure |
| 04/30/2009 | WO2009054343A1 Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same |
| 04/30/2009 | WO2009054194A1 Anisotropically conductive adhesive |
| 04/30/2009 | WO2009054191A1 Wiring board receiving plate, and device and method for connection of wiring board using same |
| 04/30/2009 | WO2009054105A1 Part built-in printed wiring board, and its manufacturing method |
| 04/30/2009 | WO2009054098A1 Wiring board with built-in component and method for manufacturing wiring board with built-in component |
| 04/30/2009 | WO2009054011A1 A method of soldering components on circuit boards and corresponding circuit board |
| 04/30/2009 | WO2009053786A1 Positioning device to position one or more plates for electronic circuits in a metal deposition unit, and related method |
| 04/30/2009 | WO2009052761A1 A pcb device and a method of manufacture thereof |
| 04/30/2009 | WO2009029939A3 Aerosol jet® printing system for photovoltaic applications |
| 04/30/2009 | WO2008139472A3 Dual spindle system |
| 04/30/2009 | WO2007129322A3 System and method for imaging objects |
| 04/30/2009 | WO2007064672A3 Lead(pb)-free electronic component attachment |
| 04/30/2009 | US20090109636 Multiple package module using a rigid flex printed circuit board |
| 04/30/2009 | US20090109624 Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
| 04/30/2009 | US20090108416 Direct-connect signaling system |
| 04/30/2009 | US20090107715 Wiring board with a built-in component and method for manufacturing the same |
| 04/30/2009 | US20090107712 Sensor for a Hardware Protection System for Sensitive Electronic-Data Modules Protecting Against External Manipulations |
| 04/30/2009 | US20090107710 Differential trace profile for printed circult boards |
| 04/30/2009 | US20090107709 Printed circuit board and manufacturing method thereof |
| 04/30/2009 | US20090107708 Electronic parts substrate and method for manufacturing the same |
| 04/30/2009 | US20090107705 Methods and systems for reducing noise coupling in high speed digital systems |
| 04/30/2009 | US20090107704 Composite substrate |
| 04/30/2009 | US20090107702 Printed interconnection board and method of manufacturing the same |
| 04/30/2009 | US20090107699 Method of manufacturing printed circuit board and printed circuit board manufactured by the same |
| 04/30/2009 | US20090107624 Multi-layer circuit board and method of making the same |
| 04/30/2009 | US20090106977 Manufacturing method of printed circuit board |
| 04/30/2009 | US20090106976 Method for reducing noise coupling in high speed digital systems |
| 04/30/2009 | US20090106975 Roughened Printed Circuit Board And Manufacturing Method Thereof |
| 04/30/2009 | DE112006003899T5 Verfahren zur Bildung eines Resistmusters, Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte A method of forming a resist pattern The method for producing a printed circuit board and printed circuit board |
| 04/30/2009 | DE102007051930A1 Verfahren zur Herstellung einer Leiterbahnstruktur A method of fabricating a wiring structure |
| 04/30/2009 | DE102007051114A1 Printed circuit board for photovoltaic system or large area lamp, comprises layers, which are supported by passive magnetic components, which are combined together in a planar module and arranged in extension direction of the layers |
| 04/30/2009 | DE102007050901A1 Molded interconnected device manufacturing method, involves molding interconnected device from plastic, molding or vulcanizing seal to interconnected device and attaching conductive strip structure on interconnected device |
| 04/30/2009 | DE102007033488A1 Printed circuit board comprises insulating material, through-contact that is formed on given location of insulating material, and copper seeding layer that is formed with through-contact |
| 04/29/2009 | EP2053909A1 Multilayer printed wiring board with solder resist composition |
| 04/29/2009 | EP2053908A1 Multilayer printed wiring board with a solder resist composition |
| 04/29/2009 | EP2053907A2 Method of producing an overmolded electronic module with a flexible circuit pigtail |
| 04/29/2009 | EP2053906A2 Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
| 04/29/2009 | EP2053030A1 Process for production of formed ceramic bodies |
| 04/29/2009 | EP2052805A1 Bonding material, bonded portion and circuit board |
| 04/29/2009 | EP2052294A1 Long length flexible circuits and method of making same |
| 04/29/2009 | EP2051820A2 Process for improving the adhesion of polymeric materials to metal surfaces |
| 04/29/2009 | EP1929848B1 Connection of two semi-conductor plates or flat components by means of a mechanical lock |
| 04/29/2009 | EP1869724A4 Circuitry module |
| 04/29/2009 | EP1586224A4 Cover for ball-grid array connector |
| 04/29/2009 | EP1585604A4 Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors |
| 04/29/2009 | CN201230408Y Paster tray for circuit board |
| 04/29/2009 | CN201230407Y Image developing electroplating apparatus for circuit board |
| 04/29/2009 | CN201230406Y Slot type board placing rack |
| 04/29/2009 | CN201230405Y Environmental protection multifunctional fast board making machine |
| 04/29/2009 | CN201230403Y 印刷电路板 A printed circuit board |
| 04/29/2009 | CN201230402Y 印刷电路板 A printed circuit board |
| 04/29/2009 | CN201228284Y Gas drive circuit board etching machine |
| 04/29/2009 | CN201227698Y Microbit for printed circuit boards industry |
| 04/29/2009 | CN101422091A Multilayer circuit board having cable section, and manufacturing method thereof |
| 04/29/2009 | CN101422090A Solder ball loading method and solder ball loading apparatus |
| 04/29/2009 | CN101421886A Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| 04/29/2009 | CN101421672A Alkali developable solder resist, cured product of the same and printed wiring board obtained using the same |
| 04/29/2009 | CN101421671A Photosensitive element, method for formation of resist pattern, and method for production of print circuit board |
| 04/29/2009 | CN101421086A Mold release sheet for hot pressing and method for manufacturing flexible printed wiring board using the same |
| 04/29/2009 | CN101420824A Method for forming circuit on PCB substrate |
| 04/29/2009 | CN101420821A Printed circuit board and manufacturing method thereof |
| 04/29/2009 | CN101420820A Double side flexible copper coated board and manufacturing method thereof |
| 04/29/2009 | CN101420819A Printing circuit board and electronic apparatus |
| 04/29/2009 | CN101420064A Producing method for RFID antenna |
| 04/29/2009 | CN101420006A Surface-mountable, radiation-emitting component and method for the production thereof |
| 04/29/2009 | CN101419949A Circuit apparatus and method of manufacturing the same |
| 04/29/2009 | CN101419918A Method of manufacturing printed circuit board and printed circuit board manufactured by the same |
| 04/29/2009 | CN101419409A Exposure device and rectification device of baseal plate |
| 04/29/2009 | CN101419403A Diazo sheet for processing printed circuit board and method for producing the same |
| 04/29/2009 | CN101419264A Method for manufacturing flexible printed circuit board and detection method thereof |
| 04/29/2009 | CN101418201A Adhesive composite for flexible circuit board |
| 04/29/2009 | CN101417758A Adhesive material tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, and adhering apparatus |
| 04/29/2009 | CN101417521A Bed course for compression moulding, manufacturing method and compression moulding method therefor |
| 04/29/2009 | CN100484382C Energy pathway arrangements for energy conditioning |