| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/20/2009 | CN100490608C Tin solder jointing method |
| 05/20/2009 | CN100490607C Laser punching system and method for flexible printed circuit board |
| 05/20/2009 | CN100490606C Device for operating on circuit substrate |
| 05/20/2009 | CN100490603C Circuit board with verified laminated layer sequence |
| 05/20/2009 | CN100490260C Mould for detaching or mounting connector and semiconductor experiment device possessing the mould |
| 05/20/2009 | CN100490129C Metal-base circuit board and its manufacturing method |
| 05/20/2009 | CN100489548C Circuit board inspection device |
| 05/20/2009 | CN100489156C Resin substrate having a resin-metal composite layer and method for manufacturing thereof |
| 05/20/2009 | CN100488906C Glass fiber-reinforced prepreg, laminates, electronic circuit boards and methods for assembling fabric |
| 05/20/2009 | CN100488766C Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof |
| 05/20/2009 | CN100488689C Method for producing metal-ceramic composite lining and solder material used for same |
| 05/19/2009 | US7536375 Method and apparatus for predicting sporting success conditions |
| 05/19/2009 | US7535728 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors |
| 05/19/2009 | US7535723 Surface mounted electrical components and method for mounting and retaining same |
| 05/19/2009 | US7535106 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| 05/19/2009 | US7535095 Printed wiring board and method for producing the same |
| 05/19/2009 | US7535094 Substrate structure, a method and an arrangement for producing such substrate structure |
| 05/19/2009 | US7534966 Edge connection structure for printed circuit boards |
| 05/19/2009 | US7534716 System and method for venting pressure from an integrated circuit package sealed with a lid |
| 05/19/2009 | US7534660 Methods for assembly and packaging of flip chip configured dice with interposer |
| 05/19/2009 | US7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 05/19/2009 | US7534487 transparent, electrically conductive, biaxially oriented, single- or multilayer polyester film which includes a coating composed of (a) conductive (ITO) indium tin oxide particles or (ATO) antimony tin oxide particles, or of a mixture of these |
| 05/19/2009 | US7534361 Methods for making laminated member for circuit board, making circuit board and laminating flexible film |
| 05/19/2009 | US7534145 Design and method for plating PCI express (PCIE) edge connector |
| 05/19/2009 | US7533793 Solder preforms for use in electronic assembly |
| 05/19/2009 | US7533665 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements |
| 05/19/2009 | US7533459 Electronic component mounting method and electronic component mounting apparatus |
| 05/19/2009 | US7533458 Method for reducing noise coupling in high speed digital systems |
| 05/19/2009 | US7533457 Packaging method for circuit board |
| 05/14/2009 | WO2009060908A1 Photocurable resin composition, cured product pattern, and printed wiring board |
| 05/14/2009 | WO2009060902A1 Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module |
| 05/14/2009 | WO2009060821A1 Circuit board and method for manufacturing the same |
| 05/14/2009 | WO2009060755A1 Process for producing intermediate structure and inspection apparatus |
| 05/14/2009 | WO2009060505A1 Lamination order inspection method and wiring board manufacturing method |
| 05/14/2009 | WO2009060068A1 Method for operation of a wave soldering system which uses perfluoric polyether for reaction with impurities containing lead |
| 05/14/2009 | WO2009059752A2 Method and means for connecting thin metal layers |
| 05/14/2009 | WO2009059584A1 Screen for commercial screen printing |
| 05/14/2009 | US20090124137 Network jack and manufacturing method therefor |
| 05/14/2009 | US20090124045 Low Profile Stacking System and Method |
| 05/14/2009 | US20090124029 Method of fabricating resistor and proximate drive transistor for a printhead |
| 05/14/2009 | US20090123661 System and method for forming high resolution electronic circuits on a substrate |
| 05/14/2009 | US20090123642 Epoxy resin composition, conductive film forming method, conductive pattern forming method, and multilayered wiring board manufacturing method |
| 05/14/2009 | US20090122554 Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| 05/14/2009 | US20090122494 Cooling Device for Printed Circuit Board and Method for the Prosecution Thereof |
| 05/14/2009 | US20090122116 Fluid ejection device with resistive element close to drive circuits |
| 05/14/2009 | US20090121811 Multilayered coplanar waveguide filter unit and method of manufacturing the same |
| 05/14/2009 | US20090120679 Conductive through via structure and process for electronic device carriers |
| 05/14/2009 | US20090120678 Printed Circuit Board Interconnecting Structure With Compliant Cantilever Interposers |
| 05/14/2009 | US20090120677 Wiring substrate and associated manufacturing method |
| 05/14/2009 | US20090120675 Mounted structural body and method of manufacturing the same |
| 05/14/2009 | US20090120674 Built-in battery assembly and a method of assembling the built-in battery with a circuit board |
| 05/14/2009 | US20090120671 Fpcb substrate and method of manufacturing the same |
| 05/14/2009 | US20090120666 Clad Contact Point Material and Method for Mounting a Clad Contact Point Material |
| 05/14/2009 | US20090120660 Electrical member and method of manufacturing a printed circuit board using the same |
| 05/14/2009 | US20090120312 Contrifugal Printing Apparatus And A Method Of Printing |
| 05/14/2009 | US20090120310 Printing screens |
| 05/14/2009 | US20090119915 Method for Manufacturing Circuit Device |
| 05/14/2009 | US20090119914 Process for Forming Electrical Contacts on a Semiconductor Wafer Using a Phase Changing Ink |
| 05/14/2009 | US20090119913 Electronic Circuit Device and Production Method of the Same |
| 05/14/2009 | US20090119912 Electronic component mounting apparatus |
| 05/14/2009 | US20090119911 Forming a three-dimensional stackable die configuration for an electronic circuit board |
| 05/14/2009 | US20090119910 Component with bonding adhesive |
| 05/14/2009 | DE102008051921A1 Mehrschichtsystem mit Kontaktelementen und Verfahren zum Erstellen eines Kontaktelements für ein Mehrschichtsystem Multilayer system with contact elements and method for creating a contact member for a multi-layer system |
| 05/14/2009 | DE102007053857A1 Verfahren zum Betrieb einer Wellenlötanlage A method of operating a wave soldering |
| 05/14/2009 | DE102007052969A1 Electrically contacting thin-film conducting webs to organic carrier by producing openings in dielectric carrier of thin-film circuits, comprises removing large part of thick material of the dielectric carrier on a rear side of circuit |
| 05/13/2009 | EP2059103A1 Semiconductor device and multilayer wiring board |
| 05/13/2009 | EP2059102A2 Wired circuit board |
| 05/13/2009 | EP2058903A1 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
| 05/13/2009 | EP2058874A1 Composite films suitable for use in opto-electronic and electronic devices |
| 05/13/2009 | EP2058856A2 Semiconductor package and mounting method thereof |
| 05/13/2009 | EP2058822A1 Conductive bonding material and electronic device |
| 05/13/2009 | EP2058667A2 Microelectronic spring contact element |
| 05/13/2009 | EP2058646A1 Substrate inspecting apparatus |
| 05/13/2009 | EP2058119A2 Ceramic sheet and producing method thereof |
| 05/13/2009 | EP2057868A1 Circuit board having configurable ground link and with coplanar circuit and ground traces |
| 05/13/2009 | EP2057699A1 Uv-photopolymerizable composition for producing organic conductive layers, patterns or prints |
| 05/13/2009 | EP2057680A2 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same |
| 05/13/2009 | EP2057677A1 Method and apparatus for manufacturing an electronic module, and electronic module |
| 05/13/2009 | EP2057006A2 Non-random array anisotropic conductive film (acf) and manufacturing processes |
| 05/13/2009 | EP1949771B1 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
| 05/13/2009 | EP1531025B1 Tin-zinc lead-free solder and solder-joined part |
| 05/13/2009 | EP1356498A4 Chromium adhesion layer for copper vias in low-k technology |
| 05/13/2009 | EP0804061B1 Multilayered printed wiring board and its manufacture |
| 05/13/2009 | CN201238442Y Positioning and assembling template for printed circuit board element of liquid crystal television back light source |
| 05/13/2009 | CN201238424Y Four-conductor layer circuit board used for wireless signal receiver |
| 05/13/2009 | CN201238423Y 芯片模块 Chip Module |
| 05/13/2009 | CN201238422Y Split electronic circuit structure |
| 05/13/2009 | CN101433134A Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 05/13/2009 | CN101433133A Process for manufacturing circuit board and circuit board obtained by the process |
| 05/13/2009 | CN101432931A Electroconductive particle placement sheet and anisotropic elctroconductive film |
| 05/13/2009 | CN101432659A 感光性树脂组合物及感光性薄膜 The photosensitive resin composition and a photosensitive film |
| 05/13/2009 | CN101432368A 热固化性树脂组合物及其用途 Heat-curable resin composition and use thereof |
| 05/13/2009 | CN101432134A Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board |
| 05/13/2009 | CN101432094A Laser processing method and laser processing apparatus |
| 05/13/2009 | CN101431868A Production method of winding integrated multi-layer PCB |
| 05/13/2009 | CN101431867A Mounting structure |
| 05/13/2009 | CN101431866A Method for producing flexible circuit board by rinsing technique |
| 05/13/2009 | CN101431865A Printed circuit board and its production metho |
| 05/13/2009 | CN101431864A Method for manufacturing printed wiring board with raised pad |
| 05/13/2009 | CN101431863A Back glue attaching method for flexible printed circuit board |