| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/27/2009 | CN100492632C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/27/2009 | CN100492628C Electronic assembly comprisnig substrate with embedded capacitors and methods of manufacture |
| 05/27/2009 | CN100492554C Electrical devices and process for making such devices |
| 05/27/2009 | CN100492040C Wafer-level burn-in and test cartridge |
| 05/27/2009 | CN100491489C Isotropic conductive adhesive and adhesive film using the same |
| 05/27/2009 | CN100491446C Aromatic polyimide and its preparation and use |
| 05/27/2009 | CN100491053C Solder paste and printed circuit board |
| 05/26/2009 | US7538642 Waveguide coupler |
| 05/26/2009 | US7538440 Method for improved high current component interconnections |
| 05/26/2009 | US7538278 Printed circuit board for preventing increase of thermal expansion |
| 05/26/2009 | US7538237 gas-in-liquid emulsion in a reactor to continuously process relatively large quantities of materials; hydrogen peroxide synthesis by reacting a solution of DI H2O with oxygen and hydrogen gases; p-xylene oxidation by reacting p-xylene in water with oxygen |
| 05/26/2009 | US7537799 Methods of forming electrically conductive pathways using palladium aliphatic amine complexes |
| 05/26/2009 | US7537498 Solder-bearing contacts and method of manufacture thereof and use in connectors |
| 05/26/2009 | US7536781 Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware |
| 05/26/2009 | US7536780 Method of manufacturing wiring substrate to which semiconductor chip is mounted |
| 05/26/2009 | US7536762 Method of manufacturing an ink-jet assembly |
| 05/26/2009 | CA2493351C Pb-free solder-connected structure and electronic device |
| 05/26/2009 | CA2490604C Connecting structure between busbar base and printed circuit board |
| 05/22/2009 | WO2009065105A2 Thermal packaging of transmission controller using carbon composite printed circuit board material |
| 05/22/2009 | WO2009064745A1 High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean |
| 05/22/2009 | WO2009064518A1 Component with bonding adhesive |
| 05/22/2009 | WO2009063883A1 Method for forming elecroconductive thin line |
| 05/22/2009 | WO2009063730A1 Screen printing mask, solder paste printing machine using the mask, and solder paste printing method using the mask |
| 05/22/2009 | WO2009063515A1 Device for the generation of a temperature-controlled thermal barrier to the magnetic induction poles of a welding head |
| 05/22/2009 | WO2009033716A4 Illumination device and method for the production thereof |
| 05/22/2009 | WO2009017928A3 Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board |
| 05/22/2009 | WO2008070532A8 Method for printing electrically conductive circuits |
| 05/21/2009 | US20090130908 Memory module, socket and mounting method providing improved heat dissipating characteristics |
| 05/21/2009 | US20090129038 Circuit device and method of manufacturing the same |
| 05/21/2009 | US20090129037 Printed wiring board with built-in semiconductor element, and process for producing the same |
| 05/21/2009 | US20090129031 Planar Element Module, Manufacturing Method of Planar Element Module, and Planar Element Device |
| 05/21/2009 | US20090129029 Method for manufacturing an integrated circuit |
| 05/21/2009 | US20090128684 Method for Assembling a Camera Module, and Camera Module |
| 05/21/2009 | US20090128604 Inkjet nozzle with paddle layer sandwiched between first and second wafers |
| 05/21/2009 | US20090128263 Cavity resonator |
| 05/21/2009 | US20090126983 Method and Apparatus to Reduce Impedance Discontinuity in Packages |
| 05/21/2009 | US20090126982 Wiring board and method for manufacturing the same |
| 05/21/2009 | US20090126981 Wiring board and method for manufacturing the same |
| 05/21/2009 | US20090126979 Semiconductor package circuit board and method of forming the same |
| 05/21/2009 | US20090126976 Flexible wiring board, method of producing the same and imaging device |
| 05/21/2009 | US20090126967 Thermal packaging of transmission controller using carbon composite printed circuit board material |
| 05/21/2009 | US20090126189 Method for producing printed circuit board assembly and mounting device |
| 05/20/2009 | EP2061290A1 Ceramic substrate manufacturing method and ceramic substrate |
| 05/20/2009 | EP2060907A1 Board appearance inspection method and device |
| 05/20/2009 | EP2060326A2 Device and method to wet-treat goods |
| 05/20/2009 | EP2059945A1 Device for wetting bumps of a semiconductor chip with a liquid substance |
| 05/20/2009 | EP1366207B1 Plating method of metal film on the surface of polymer |
| 05/20/2009 | DE112007001365T5 Elektrodenbondierungsverfahren und Teilmontageeinrichtung Elektrodenbondierungsverfahren and part mounting device |
| 05/20/2009 | DE112007000232T5 Optimales Abbildungssystem und Verfahren für einen Schablonendrucker Optimal imaging system and method for a stencil printing |
| 05/20/2009 | DE10318074B4 Verfahren zur Herstellung von BOC Modul Anordnungen mit verbesserten mechanischen Eigenschaften Process for the preparation of BOC module assemblies with improved mechanical properties |
| 05/20/2009 | DE102008050154A1 Verdrahtungsplatte und Verfahren zum Verhindern eines Hochspannungsschadens Wiring board and method for preventing a high voltage damage |
| 05/20/2009 | DE102008023457A1 Elektronische Steuervorrichtung und Verfahren zum Herstellen einer elektronischen Steuervorrichtung An electronic control apparatus and method for manufacturing an electronic control device |
| 05/20/2009 | DE102007054692A1 Verfahren zur Herstellung eines Transponders auf einem Substrat Process for the preparation of a transponder on a substrate |
| 05/20/2009 | DE102007041960B3 Replacing a component e.g. optical component fastened on support e.g. electrical printed circuit board by replacement module using thermally meltable composite material, comprises heating the composite material in the area of the component |
| 05/20/2009 | DE102004012979B4 Kopplungssubstrat für Halbleiterbauteile, Anordnungen mit dem Kopplungssubstrat, Kopplungssubstratstreifen, Verfahren zur Herstellung dieser Gegenstände und Verfahren zur Herstellung eines Halbleitermoduls Coupling substrate for semiconductor devices, with the coupling assemblies substrate, coupling substrate strip, process for producing these articles and methods for manufacturing a semiconductor module |
| 05/20/2009 | CN201243411Y Sheet material conveying device |
| 05/20/2009 | CN201243410Y Fixed welded structure of power transistor on printed circuit board |
| 05/20/2009 | CN201243409Y Fixed welded structure of transformer on printed circuit board |
| 05/20/2009 | CN201243408Y Circuit board with embedded capacitance element |
| 05/20/2009 | CN201243405Y Pattern structure of circuit board |
| 05/20/2009 | CN201243404Y 电路板 Board |
| 05/20/2009 | CN201242661Y Treatment equipment for etching sheet material |
| 05/20/2009 | CN201242660Y Treatment equipment for etching sheet material |
| 05/20/2009 | CN201242415Y Measurement jig for tin wave width |
| 05/20/2009 | CN201240095Y Combined strippable offset printing mould |
| 05/20/2009 | CN201239841Y Apparatus for preventing tin connection in wave soldering |
| 05/20/2009 | CN201239837Y Hot blast reflow soldering furnace |
| 05/20/2009 | CN101438636A Method for forming resist pattern, circuit basal plate and manufacturing method thereof |
| 05/20/2009 | CN101438635A Method for supplying leadless stick-shaped solder to solder groove and solder groove |
| 05/20/2009 | CN101438210A Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board |
| 05/20/2009 | CN101438208A Photosensitive resin composition |
| 05/20/2009 | CN101437914A Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
| 05/20/2009 | CN101437368A Multi-chip common power supply/grounding structure for printed circuit board |
| 05/20/2009 | CN101437367A Method for preparing printed circuit board |
| 05/20/2009 | CN101437366A Method for manufacturing circuit board with raised bonding pad |
| 05/20/2009 | CN101437365A Holding apparatus and holding method |
| 05/20/2009 | CN101437364A Device mounting structure and device mounting method |
| 05/20/2009 | CN101437363A Structure and method for welding circuit board |
| 05/20/2009 | CN101437360A Flexible circuit board, preparation method and fixed method thereof |
| 05/20/2009 | CN101437358A Protection film for printed circuit board and procedure for processing circuit board using the protection film |
| 05/20/2009 | CN101437357A Pad structure for welding printed circuit board and method for forming the same |
| 05/20/2009 | CN101437356A Circuit board module and structure intensification method thereof |
| 05/20/2009 | CN101436709A Individually unique hybrid printed antennae for chipless RFID applications |
| 05/20/2009 | CN101436705A Method for manufacturing antenna element and antenna module with the same |
| 05/20/2009 | CN101436578A Wiring board and method for manufacturing the same |
| 05/20/2009 | CN101436575A Semiconductor package and mounting method thereof |
| 05/20/2009 | CN101436551A Method for making copper-core layer multi-layer encapsulation substrate |
| 05/20/2009 | CN101436550A Method for making non-core layer multi-layer encapsulation substrate |
| 05/20/2009 | CN101436549A Method for making copper-core layer multi-layer encapsulation substrate |
| 05/20/2009 | CN101436548A Method for making non-core layer multi-layer encapsulation substrate |
| 05/20/2009 | CN101436547A Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier |
| 05/20/2009 | CN101435922A LCD device circuit board structure and method for manufacturing LCD device using the same |
| 05/20/2009 | CN100490621C Surface mounting machine |
| 05/20/2009 | CN100490620C Method for arranging solid tin on circuit board |
| 05/20/2009 | CN100490614C Manufacturing method of printed circuit board |
| 05/20/2009 | CN100490613C Method for producing circuit board |
| 05/20/2009 | CN100490612C Production of multi-layer circuit board of built-in passive assembly |
| 05/20/2009 | CN100490611C Circuit board with embedded components and method of manufacture |
| 05/20/2009 | CN100490610C Circuit substrate production method and method for mounting electronic element |
| 05/20/2009 | CN100490609C Assembly and electric package |