| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/02/2009 | US7540931 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet |
| 06/02/2009 | US7540596 Electric device where actuator unit and printed wiring board are connected using bonding parts |
| 06/02/2009 | US7540592 Micro-electromechanical nozzle assembly with an arcuate actuator |
| 06/02/2009 | US7540082 Method for manufacturing printed wiring board |
| 06/02/2009 | US7540081 Thermally conductive interface |
| 06/02/2009 | US7540080 Method for mounting component by suction nozzle |
| 06/02/2009 | US7540079 Laminated member for circuit board, method and apparatus for manufacturing of circuit board |
| 06/02/2009 | US7540078 Method for recycling wastes of an electrical appliance |
| 05/28/2009 | WO2009066759A1 Process for producing multilayered printed wiring board |
| 05/28/2009 | WO2009066692A1 Process for producing substrate for power module, substrate for power module, and power module |
| 05/28/2009 | WO2009066658A1 Base processing agent for metal material and method for processing base for metal material |
| 05/28/2009 | WO2009066396A1 Ink for conductive film formation and process for producing printed wiring board |
| 05/28/2009 | WO2009066379A1 Via designing device, via designing program, and via designing method |
| 05/28/2009 | WO2009066183A2 Tightly-coupled pcb gnss circuit and manufacturing method |
| 05/28/2009 | WO2009065543A1 Flexible circuit substrate for electric circuits and method for the production thereof |
| 05/28/2009 | WO2009039342A3 X-ray inspection of solder reflow in high-density printed circuit board applications |
| 05/28/2009 | WO2008048554A8 Improved epoxy compositions |
| 05/28/2009 | US20090136725 Process for producing copper wiring polyimide film, and copper wiring polyimide film |
| 05/28/2009 | US20090136656 Method of manufacturing printed circuit board |
| 05/28/2009 | US20090135573 Circuit board device, wiring board interconnection method, and circuit board module device |
| 05/28/2009 | US20090135570 Method for improving ebg structures and multi-layer board applying the same |
| 05/28/2009 | US20090135043 Vehicle Radar Sensor Assembly |
| 05/28/2009 | US20090133920 Printed circuit board and manufacturing method of the same |
| 05/28/2009 | US20090133919 Multilayer printed wiring board, method for manufacturing buildup printed wiring board, and electronic apparatus |
| 05/28/2009 | US20090133914 Method for producing an integrated device and a device produced thereby |
| 05/28/2009 | US20090133911 Release film for use in manufacture of printed circuit boards |
| 05/28/2009 | US20090133909 Tip Printing and Scrape Coating Systems and Methods for Manufacturing Electronic Devices |
| 05/28/2009 | US20090133906 Flexible printed circuit board and manufacturing method thereof |
| 05/28/2009 | US20090133904 Module and manufacturing method thereof |
| 05/28/2009 | US20090133806 Method of manufacturing dielectric sheet and multilayer ceramic substrate |
| 05/28/2009 | US20090133254 Components with posts and pads |
| 05/28/2009 | US20090133253 Method of manufacturing printed circuit board |
| 05/28/2009 | US20090133252 Chip Capacitor |
| 05/28/2009 | US20090133251 Manufacture of a circuit board and circuit board containing a component |
| 05/28/2009 | DE19822511B4 Auf einer Oberfläche befestigbare elektronische Bauelemente On a surface attachable electronic components |
| 05/28/2009 | DE102007057125A1 Etching process and assembly for the manufacture of printed circuit boards has de-complexor ioniser |
| 05/28/2009 | DE102007055275A1 Flexibles Schaltungssubstrat für elektrische Schaltungen und Verfahren zur Herstellung desselben Flexible circuit substrate for electrical circuits and methods for manufacturing the same |
| 05/28/2009 | DE102007030414B4 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur A process for producing an electrically conductive structure |
| 05/27/2009 | EP2063692A2 Method of forming conductive bumps |
| 05/27/2009 | EP2063691A2 Plasma display device |
| 05/27/2009 | EP2063466A2 Interconnection element and method of fabrication thereof |
| 05/27/2009 | EP2063318A1 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| 05/27/2009 | EP2062849A2 Method for Obtaining Controller Sidewall Profile in Print-Patterned Structures |
| 05/27/2009 | EP2062470A2 Electronic components mounting adhesive and electronic components mounting structure |
| 05/27/2009 | EP2062469A1 Electric components connecting method |
| 05/27/2009 | EP2062468A1 Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure |
| 05/27/2009 | EP2062467A1 Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
| 05/27/2009 | EP2008021A4 Illuminator |
| 05/27/2009 | EP1785016B1 Multilayer body with differently microstructured areas provided with an electroconductive coating |
| 05/27/2009 | EP1656256B1 Screen printing apparatus |
| 05/27/2009 | EP1359172B1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 05/27/2009 | CN201248216Y Circuit board for controlling dustproof and water-proof mah-jongg machine dice disk |
| 05/27/2009 | CN201248202Y Circuit board bearing device |
| 05/27/2009 | CN201248201Y Device for recovering folded plate margin |
| 05/27/2009 | CN201248200Y Routing architecture for circuit board of base pin type quartz oscillator |
| 05/27/2009 | CN201248199Y Routing circuit board for quartz voltage-controlled oscillator |
| 05/27/2009 | CN201248198Y Routing structure for circuit board of secondary encapsulation quartz oscillator |
| 05/27/2009 | CN201245702Y Hanging basket for PTH process of PCB production |
| 05/27/2009 | CN201245701Y Combined hanging basket for PTH process of PCB production |
| 05/27/2009 | CN201244721Y Anti-deforming combined clamp for wave soldering of printed board with heat radiation board |
| 05/27/2009 | CN101443833A Pattern forming method |
| 05/27/2009 | CN101443669A Substrate inspecting jig, and electrode structure of connecting electrode unit in the jig |
| 05/27/2009 | CN101443486A Method, clip and device for transporting an article to be treated in an electrolytic system |
| 05/27/2009 | CN101443480A Recyclable etching solution |
| 05/27/2009 | CN101442901A Method for composing multilayer printed circuit board |
| 05/27/2009 | CN101442900A Apparatus and method for processing bad solder paste |
| 05/27/2009 | CN101442896A Electronic assembly remanufacturing system and method |
| 05/27/2009 | CN101442887A Production method of multilayer printed wiring board and multilayer printed wiring board |
| 05/27/2009 | CN101442886A Printed circuit board and manufacturing method of the same |
| 05/27/2009 | CN101442885A Method for preparing circuit board guide hole |
| 05/27/2009 | CN101442884A Method for processing on-state hole of multilayer printed circuit board |
| 05/27/2009 | CN101442883A Method for manufacturing multilayer ceramic substrate |
| 05/27/2009 | CN101442882A Galvanic process for making printed conductive metal markings for chipless rfid applications |
| 05/27/2009 | CN101442881A Method for joining electrode |
| 05/27/2009 | CN101442880A Conversion method for layer-exchange hole-through conductive capability in PCB |
| 05/27/2009 | CN101442877A Novel interconnection structure and method for creating electric through-hole |
| 05/27/2009 | CN101442876A Circuit board |
| 05/27/2009 | CN101442875A Circuit board with multilayer welding-proof structure |
| 05/27/2009 | CN101442174A Method for welding electric external down-lead on electrode of ITO conductive glass |
| 05/27/2009 | CN101442013A Circuit module and manufacturing method thereof |
| 05/27/2009 | CN101441307A Apparatus for bonding camera module, equipment for assembling camera module having the apparatus, and method of assembling camera module using the equipment |
| 05/27/2009 | CN101441064A Substrate for offset check of tin soldering position, check apparatus and check method |
| 05/27/2009 | CN101440263A Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board |
| 05/27/2009 | CN100493324C Electronic component mounting apparatus |
| 05/27/2009 | CN100493323C Electronic control unit |
| 05/27/2009 | CN100493304C Cover for ball-grid array connector and mounting device for ball-grid array connector |
| 05/27/2009 | CN100493303C Circuit board air-pumping ink-penetrating hole-filling method and device thereof |
| 05/27/2009 | CN100493302C Manufacturing method of modular circuit board |
| 05/27/2009 | CN100493301C Printed circuit board |
| 05/27/2009 | CN100493300C Method for welding FPC plate with PCB plate and its dedicated clamp |
| 05/27/2009 | CN100493299C Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 05/27/2009 | CN100493298C System for mounting components |
| 05/27/2009 | CN100493297C Patterned method for tape coiling type thin object in automated process |
| 05/27/2009 | CN100493296C Multiple head line burying machine |
| 05/27/2009 | CN100493295C Method of mounting printed circuit board by flat package IC and its soldering method and air conditioner |
| 05/27/2009 | CN100493294C Microconnector for FPC and method of producing the same |
| 05/27/2009 | CN100493291C Plug-in and its manufacture method |
| 05/27/2009 | CN100492680C Multi-stack surface mount light emitting diodes |
| 05/27/2009 | CN100492637C Semiconductor device package and its manufacturing method, and semiconductor |
| 05/27/2009 | CN100492633C Welding disc mode structure |