Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2009
06/10/2009CN100499962C Flexible printed circuit board and liquid crystal display having the same
06/10/2009CN100499961C Printed wiring board connection structure
06/10/2009CN100498318C Investigation apparatus
06/10/2009CN100496858C Methods of drilling through-holes in homogenous and non-homogeneous substrates
06/10/2009CN100496206C Vibration ranking device for rice seeding sowing
06/09/2009US7545947 Hearing aid using printed circuit board
06/09/2009US7545049 Electronic parts packaging structure
06/09/2009US7545044 Semiconductor device and radiation detector employing it
06/09/2009US7544898 Multilayer wiring board, touch panel and manufacturing method of the same
06/09/2009US7543546 Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method
06/09/2009US7543377 Perimeter matrix ball grid array circuit package with a populated center
06/09/2009US7543375 Process for filling via hole in a substrate
06/09/2009US7543374 Method of manufacturing wiring substrate
06/09/2009US7543373 Gel package structural enhancement of compression system board connections
06/04/2009WO2009070428A1 Tip printing and scrape coating systems and methods for manufacturing electronic devices
06/04/2009WO2009070018A1 Method of providing conductive structures in a multi-foil system and multi-foil system comprising same
06/04/2009WO2009069791A1 Wiring substrate, mounting structure, and method for manufacturing the wiring substrate
06/04/2009WO2009069683A1 Method for manufacturing multilayer printed wiring board
06/04/2009WO2009069601A1 Flux for soldering, soldering paste composition, and method of soldering
06/04/2009WO2009069600A1 Flux for soldering and soldering paste composition
06/04/2009WO2009069398A1 Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component
06/04/2009WO2009069273A1 Electrically conductive paste, and electrical and electronic device comprising the same
06/04/2009WO2009069236A1 Circuit board module and electronic equipment
06/04/2009WO2009069210A1 Atomizer, method of atomization, apparatus for wiring formation, and method of wiring formation
06/04/2009WO2009068741A1 Panelizing method for printed circuit board manufacturing
06/04/2009WO2009038950A3 Flexible circuit board, manufacturing method thereof, and electronic device using the same
06/04/2009WO2008146014A3 Improved structural adhesive materials
06/04/2009US20090142966 Plug for connection strips and method for the production thereof
06/04/2009US20090142559 Method of forming conductive tracks for flexible electronic circuits
06/04/2009US20090142493 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion
06/04/2009US20090142477 Portable electronic device and transferring method of circuit element thereof
06/04/2009US20090141460 Ceramic multilayer component, method for the production thereof and retaining device
06/04/2009US20090141425 Screen-printable encapsulants based on soluble polybenzoxazoles
06/04/2009US20090141401 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit
06/04/2009US20090140725 Integrated circuit including sensor having injection molded magnetic material
06/04/2009US20090139761 Multilayer printed wiring board and manufacturing method thereof
06/04/2009US20090139760 Multilayer printed wiring board and method of manufacturing the same
06/04/2009US20090139758 Printed circuit board assembly and manufacturing method for the same
06/04/2009US20090139756 Fabricating process of circuit board with embedded passive component
06/04/2009US20090139755 Surface mounted semiconductor device and method for manufacturing same
06/04/2009US20090139753 Copper Clad Laminate for Chip on Film
06/04/2009US20090139421 Metal pattern and process for producing the same
06/04/2009US20090139086 Method for manufacturing printed circuit board
06/04/2009US20090139085 Circuit substrates, semiconductor device, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
06/04/2009DE102008057982A1 Verfahren zur Herstellung eines Systems Process for the preparation of a system
06/04/2009DE102007058094A1 Verfahren zur Herstellung einer Leiterplattenschicht (Schaltungsebene) für eine insbesondere mehrschichtige Leiterplatte (keramisches Substrat) A process for producing a printed circuit board layer (circuit level) for a particular multi-layer printed circuit board (ceramic substrate)
06/04/2009DE102006008332B4 Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit A process for preparing a functional unit and functional unit
06/04/2009DE102005048492B4 Elektrisches Modul Electrical module
06/03/2009EP2066161A1 Method for manufacturing substrate with built-in component and substrate with built-in component
06/03/2009EP2066160A2 Wiring board and electronic component device
06/03/2009EP2066159A1 Method of providing conductive structures in a multi-foil system and multi-foil system comprising same
06/03/2009EP2066158A2 Multilayer, thermally-stabilized substrate structures
06/03/2009EP2065101A1 Varnishing machine
06/03/2009EP2064930A2 Electronic component mounting structure
06/03/2009EP2064017A2 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
06/03/2009EP1695360A4 Printed circuit embedded capacitors
06/03/2009EP1661147A4 Fabrication of thick film electrical components
06/03/2009EP1491077B2 Control device
06/03/2009EP1303898A4 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
06/03/2009EP1141776B1 Method for patterning thin films
06/03/2009CN201252686Y PCB composite board used for an LED
06/03/2009CN201252685Y Storage rack for placing roll banding used for clearing away foreign matter on surface of object
06/03/2009CN201252684Y Printing circuit board internal layer manual lithography machine
06/03/2009CN201252683Y Fixing device of printed circuit board
06/03/2009CN201252682Y Clamping device of printed circuit board
06/03/2009CN201252681Y Conveying locating device for high density interconnecting laminated plate
06/03/2009CN201252680Y Anti-deviation-and-tearing circuit board locating pin
06/03/2009CN201252679Y Device for positioning or guiding an object corresponding to a substrate or together with a substrate
06/03/2009CN101449635A Multilayer module with case
06/03/2009CN101449634A Component internally installed wiring plate and its manufacturing method
06/03/2009CN101449633A Process for producing copper wiring polyimide film, and copper wiring polyimide film
06/03/2009CN101448375A Flexible printed circuit board of large capacity signal transmission medium
06/03/2009CN101448374A Multilayer printed wiring board, method for manufacturing buildup printed wiring board, and electronic apparatus
06/03/2009CN101448373A Method for improving electromagnetic band gap architecture and multilayer board architecture applying same
06/03/2009CN101448372A Hot dip coating tin technology for preventing approach legs of SMT parts from bridging
06/03/2009CN101448371A Welding method for preventing scaling powder from entering into surface mounting component and circuit wafer thereof
06/03/2009CN101448370A Circuit board module, electric device, and method for producing the circuit board module
06/03/2009CN101448369A Fixture for soldering circuit baseplate
06/03/2009CN101448368A Method of coupling and rapidly fixing photoelectric detector and PCB plate thereof
06/03/2009CN101448367A Printed circuit board for combining thick film resistor and thin film circuit and manufacturing method thereof
06/03/2009CN101448366A Anti-welding processing method of printed circuit board
06/03/2009CN101448365A Method for manufacturing metal circuit board for plastic rack
06/03/2009CN101448364A Method for producing small-pore-diameter copper-plated through hole on ceramic substrate
06/03/2009CN101448360A Multi-layer printed circuit board
06/03/2009CN100496202C 部件安装装置 Component mounting apparatus
06/03/2009CN100496196C Multilayer printed circuit board and test body for printed wiring board
06/03/2009CN100496195C Mulitilayer circuit board, resin base material, and its production method
06/03/2009CN100496194C Pattern forming system, pattern forming method, and electronic apparatus
06/03/2009CN100496193C Wiring technique for a electronic control unit
06/03/2009CN100496192C Method and device for desoldering and separating device in printed circuit board liquid state heat-conducting medium
06/03/2009CN100495826C Press-fit terminal, printed circuit board connection device, and electrical connection box
06/03/2009CN100495824C Anisotropic conductive film and method for producing the same
06/03/2009CN100495673C Plasma processing method and method for fabricating electronic component module using the same
06/03/2009CN100495192C Camera module using a printed circuit board having step part
06/03/2009CN100495130C Bonding method of flexible film and display bonded thereby
06/02/2009US7543316 Antenna designs for radio frequency identification tags
06/02/2009US7542242 FPC with via holes with filler being welded to suspension and drive apparatus
06/02/2009US7541823 Circuit board checker and circuit board checking method
06/02/2009US7541294 Semiconductor package and semiconductor package mounting method
06/02/2009US7541278 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment