| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/17/2009 | EP2070961A1 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board |
| 06/17/2009 | EP2070400A1 Distortion-tolerant processing |
| 06/17/2009 | EP2070399A2 Printed substrate through which very strong currents can pass and corresponding production method |
| 06/17/2009 | EP2069842A1 Illumination devices and methods for making the same |
| 06/17/2009 | EP2004908B1 Method for applying a metal on a substrate |
| 06/17/2009 | EP2004907B1 Method for applying a metal on paper |
| 06/17/2009 | EP1847162B1 Method and machine for manufacturing electrical circuits |
| 06/17/2009 | EP1606982B1 Method for electrically and mechanically connecting two printed boards |
| 06/17/2009 | EP1382232B1 Protection of conductive connection by electrophoresis coating and structure formed therewith |
| 06/17/2009 | EP1027723B1 Method of forming an electric capacitor |
| 06/17/2009 | CN201260273Y Tin spraying clip for circuit board |
| 06/17/2009 | CN201260272Y Single panel detection through-hole dust suction apparatus |
| 06/17/2009 | CN101460020A Multilayered flexible circuit board |
| 06/17/2009 | CN101460019A Production method for circuit construction of circuit board |
| 06/17/2009 | CN101460018A Printed circuit board, manufacturing method and radio-frequency apparatus thereof |
| 06/17/2009 | CN101460017A Thru-hole electroplating method for printed circuit board |
| 06/17/2009 | CN101460016A Method of manufacturing a circuit board assembly for a controller |
| 06/17/2009 | CN101460015A Method and apparatus for mounting at least two types of electronic components |
| 06/17/2009 | CN101460014A Direct copper coating metallization manufacturing process for substrate |
| 06/17/2009 | CN101460013A Composite article for functional resin and metal foil and multilayered printed circuit board manufacturing method using the same |
| 06/17/2009 | CN101460012A Stereoscopic circuit board forming device and forming method |
| 06/17/2009 | CN101460011A Circuit board manufacturing method and circuit board |
| 06/17/2009 | CN101460010A Silica gel board used for circuit board compressing and compressing method using the board |
| 06/17/2009 | CN100502621C Connection structure of inner conductor and multilayer substrate |
| 06/17/2009 | CN100502620C Resin distributing device |
| 06/17/2009 | CN100501983C 半导体芯片封装 The semiconductor chip package |
| 06/17/2009 | CN100501960C Lead solder indicator and method |
| 06/17/2009 | CN100501955C Solder composition and method of bump formation therewith |
| 06/16/2009 | US7548798 Paste dispenser and method for controlling the same |
| 06/16/2009 | US7547850 Semiconductor device assemblies with compliant spring contact structures |
| 06/16/2009 | US7547669 Contains choline hydroxide; for removal of residues, photoresists, organic anti-reflective coatings and gap-fill and sacrificial polymers from surfaces; corrosion resistance |
| 06/16/2009 | US7547479 Tin-coated printed circuit boards with low tendency to whisker formation |
| 06/16/2009 | US7547233 Capacitor unit |
| 06/16/2009 | US7546682 Methods for repairing circuit board having defective pre-soldering bump |
| 06/16/2009 | US7546681 Manufacturing method for wiring circuit substrate |
| 06/16/2009 | US7546675 Method and system for manufacturing a wireless communication device |
| 06/16/2009 | CA2464570C Circuit board assembly for welding power supply |
| 06/16/2009 | CA2284978C Conductive paste |
| 06/11/2009 | WO2009072603A1 Method and apparatus for drawing pattern |
| 06/11/2009 | WO2009072531A1 Multilayer wiring board having cavity section |
| 06/11/2009 | WO2009072482A1 Module with built-in component and method for manufacturing the same |
| 06/11/2009 | WO2009072221A1 Electronic equipment obtained by soldering with lead-free jointing material |
| 06/11/2009 | WO2009072182A1 Circuit board and electronic device |
| 06/11/2009 | WO2009072164A1 Substrate and semiconductor device |
| 06/11/2009 | WO2009071387A1 Printed circuit board comprising contact pins connected thereto |
| 06/11/2009 | WO2009071363A1 Method for the production of a circuit board layer (circuit plane) for a particularly multi-layer circuit board (ceramic substrate) |
| 06/11/2009 | WO2009070946A1 Rollers for transporting thin substrate and chemical treatment method using the same |
| 06/11/2009 | WO2009053255A3 Interconnect device having high component density |
| 06/11/2009 | WO2003024164A3 Clip for replaceable surface mounted devices |
| 06/11/2009 | WO2002078781A3 Method and apparatus for providing hermetic electrical feedthrough |
| 06/11/2009 | US20090149975 Systems for Predicting Sporting Success Conditions |
| 06/11/2009 | US20090149034 Semiconductor module and method of manufacturing the same |
| 06/11/2009 | US20090145766 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| 06/11/2009 | US20090145652 Printed wiring board and its manufacturing method |
| 06/11/2009 | US20090145650 Screen mask, method for printing conductive bonding material, mounting method of mounting devices, and mounting substrate |
| 06/11/2009 | US20090145649 Multi-layered wiring substrate, method for producing the same, and semiconductor device |
| 06/11/2009 | US20090145645 Interconnection element with posts formed by plating |
| 06/11/2009 | US20090145642 Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module |
| 06/11/2009 | US20090145641 Combining discrete electronic elements with printed electronic circuits |
| 06/11/2009 | US20090145640 Conductive pattern formation ink, method of forming conductive pattern, conductive pattern and wiring substrate |
| 06/11/2009 | US20090145635 Wiring substrate, manufacturing method of the same, and electronic component device |
| 06/11/2009 | US20090145629 Micromachine and Method for Manufacturing the Same |
| 06/11/2009 | US20090145222 Electronic device including two electronic components connected with each other and output terminal and method of manufacturing same |
| 06/11/2009 | US20090144972 Circuit board and process for fabricating the same |
| 06/11/2009 | US20090144970 Fabricating an array of mems parts on a substrate |
| 06/11/2009 | CA2707243A1 Roller group for transporting thin substrate and method for performing chemical treatment by using the same |
| 06/10/2009 | EP2068606A1 Junction structure, method of joining, wiring board and process for producing the same |
| 06/10/2009 | EP2068605A1 Printed wiring board and method for manufacturing the same |
| 06/10/2009 | EP2068604A2 Screen-printable encapsulants based on soluble polybenzoxazoles |
| 06/10/2009 | EP2068603A2 Large electronic component dampening fixation |
| 06/10/2009 | EP2067561A1 Dispensing solder for mounting semiconductor chips |
| 06/10/2009 | EP2067391A1 Substrate-penetrating electrical connections |
| 06/10/2009 | EP2067390A2 Method for producing an arrangement of optoelectronic components, and arrangement of optoelectronic components |
| 06/10/2009 | EP1282343B1 Method of producing multilayer circuit boards |
| 06/10/2009 | DE112007001868T5 Glaskeramikzusammensetzung, gesinterter Glaskeramikkörper und elektronische Komponente aus monolithischer Keramik Glass ceramic composition sintered ceramic body and electronic component of monolithic ceramics |
| 06/10/2009 | DE112007001859T5 Glaskeramikzusammensetzung, Glaskeramiksinterkörper und keramisches Mehrschicht-Elektronikbauteil Glass ceramic composition, glass ceramic sintered body and ceramic multi-layer electronic component |
| 06/10/2009 | DE10301682B4 Temperaturbelastbarer Shunt-Widerstand und Verfahren zur Herstellung eines solchen Shunt-Widerstandes Temperature-duty shunt resistor and method for producing such a shunt resistor |
| 06/10/2009 | DE102005013599B4 Verfahren zum Reparaturlöten vielpoliger Miniatur-Steckverbinder A method of repair soldering multi-pole miniature connectors |
| 06/10/2009 | DE10084137B4 Abschirmbehälter mit sich verjüngenden Wandenden zur Oberflächenmontage, und Funktelefone, in welchen dieser eingebaut ist Shielding with tapered wall ends for surface mounting, and cellular phones, in which it is installed |
| 06/10/2009 | CN201256492Y Oblique angle tin spraying rack |
| 06/10/2009 | CN201256491Y Binding template used in SMT printing process |
| 06/10/2009 | CN201256490Y Heat tolerant tray for printed circuit board wave peak and reflow soldering |
| 06/10/2009 | CN201256489Y Heating platform for SMT welding production line |
| 06/10/2009 | CN201256488Y Heavy industry welding tool |
| 06/10/2009 | CN201256487Y Surface cleaning assistant rack for area reduced printed circuit board |
| 06/10/2009 | CN101453839A Printed circuit board and making method thereof |
| 06/10/2009 | CN101453838A Manufacturing method for circuit board |
| 06/10/2009 | CN101453837A Hole electricity conduction method for printed circuit board |
| 06/10/2009 | CN101453836A Printed wiring board, air conditioner, and method of soldering printed wiring board |
| 06/10/2009 | CN101453835A Transformer, method and device for capacitor integration package |
| 06/10/2009 | CN101453834A Resistance repair construction for current sensing component and manufacturing method thereof |
| 06/10/2009 | CN101453833A Stitching apparatus and method for printed circuit board and reinforced board |
| 06/10/2009 | CN101453832A Method for manufacturing hollowed-out board |
| 06/10/2009 | CN100499969C Module with built-in circuit component and method for producing the same |
| 06/10/2009 | CN100499968C Connection substrate, multilayer wiring board using the connection substrate, substrate for semiconductor package, semiconductor package, and methods for manufacturing them |
| 06/10/2009 | CN100499967C Bonded assemblied printing steel board and producing process applied to the surface of non-extended leg electronic parts |
| 06/10/2009 | CN100499966C Control device of circuit board hole blower knife and its control method |
| 06/10/2009 | CN100499965C Process for producing wiring circuit board |
| 06/10/2009 | CN100499964C Etching reactive tank |
| 06/10/2009 | CN100499963C Wiring board provided with a resistor and process for manufacturing the same |