Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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06/24/2009 | EP2073613A2 Flexible film and display device comprising the same |
06/24/2009 | EP2073316A1 Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles |
06/24/2009 | EP2073261A1 Ceramic substrate component and electronic component using the same |
06/24/2009 | EP2073258A2 Conductive ball mounting method and surplus ball removing apparatus |
06/24/2009 | EP2073134A1 Processing method, processing device, program and computer readable storage medium |
06/24/2009 | EP2073133A1 Electric information processing method for cad system, device thereof, program, and computer-readable storage medium |
06/24/2009 | EP2072639A1 Method for adhesion promotion between the nickel and nickel alloy layer and another metal or a dielectric, such as in the manufacture of lead frames for semiconductor devices |
06/24/2009 | EP1698215A4 Method of manufacturing an electrical component |
06/24/2009 | EP1082732B1 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
06/24/2009 | CN201263255Y Welding spot pin stent of printed circuit board |
06/24/2009 | CN201263254Y Carrying tool for printed circuit board |
06/24/2009 | CN201263253Y Carrying tool for pony size printed circuit board |
06/24/2009 | CN101467503A Submount for electronic components |
06/24/2009 | CN101466208A Wiring substrate and method of manufacturing the same |
06/24/2009 | CN101466207A Circuit board and preparation method thereof |
06/24/2009 | CN101466206A Method for electroplating conductive hole of printed circuit board |
06/24/2009 | CN101466205A Circuit board and preparation method thereof |
06/24/2009 | CN101466204A Fluxing agent recovery apparatus |
06/24/2009 | CN101466203A Reflow soldering apparatus |
06/24/2009 | CN101466202A Method for manufacturing printed circuit board using base material of high thermal conductivity suitable for being inserted into non-surface component |
06/24/2009 | CN101466201A Device for discarding and blowing printed circuit board |
06/24/2009 | CN101466200A Device for carrying soft board |
06/24/2009 | CN101466199A Method for forming blind hole of circuit board using laser |
06/24/2009 | CN101466198A Method for correcting radio frequency circuit of printed circuit board |
06/24/2009 | CN100506009C Release process film |
06/24/2009 | CN100505992C Vacuum and lamination dry film method for multiple layers flexible circuit board |
06/24/2009 | CN100505991C Method for manufacturing printed wiring board and printed wiring board |
06/24/2009 | CN100505990C Method for manufacturing double-sided printed circuit board |
06/24/2009 | CN100505989C Process for manufacturing a wiring board having a via hole |
06/24/2009 | CN100505988C Bonding method between shielding layer of print circuit board and supporting material |
06/24/2009 | CN100505987C Method for improving the line precision in the etching technology |
06/24/2009 | CN100505986C Substrate processing device |
06/24/2009 | CN100505985C Method for forming a pattern |
06/24/2009 | CN100505984C Circuit board manufacturing method |
06/24/2009 | CN100505983C Circuit board manufacturing method |
06/24/2009 | CN100505982C Method for controlling cutting tools of forming / drilling machine for printing circuit board |
06/24/2009 | CN100505979C Wired circuit board holding sheet and production method thereof |
06/24/2009 | CN100505977C Multilayer printed circuit board and its manufacture method |
06/24/2009 | CN100505426C Connector chip manufacturing method |
06/24/2009 | CN100505416C Method for forming RF ceramic block filters |
06/24/2009 | CN100505195C Method for forming solid conductive via hole of integrated circuit packaging base plate |
06/24/2009 | CN100505124C Film capacitor, built-in high-density assembled substrate thereof and method for making said film capacitor |
06/24/2009 | CN100504601C Manufacturing method of thick film member pattern and manufacture method of image forming device |
06/24/2009 | CN100504423C Low-intensity magnetic field sensor using printed circuit board manufacture technology and its manufacture method |
06/24/2009 | CN100503718C Compositions with polymers for advanced materials |
06/24/2009 | CN100503133C Weld grease |
06/23/2009 | US7551768 Image recognition apparatus and method for surface discrimination using reflected light |
06/23/2009 | US7551454 Thin-film assembly and method for producing said assembly |
06/23/2009 | US7551325 Multifunctional apparatus |
06/23/2009 | US7550513 Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material |
06/23/2009 | US7550321 Substrate having a functionally gradient coefficient of thermal expansion |
06/23/2009 | US7549719 Method for the printing of homogeneous electronic material with a multi-ejector print head |
06/23/2009 | US7549566 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method |
06/23/2009 | US7549222 Method of producing wiring board |
06/23/2009 | US7549221 Mounting method of electronic components |
06/23/2009 | US7549220 Method for making a multilayer circuit |
06/18/2009 | WO2009075770A1 Improved insulating layer for rigid printed circuit boards |
06/18/2009 | WO2009075520A1 A method for fabricating blackened conductive patterns |
06/18/2009 | WO2009075213A1 Printed wiring board, method for manufacturing electronic component, insulating resin material, and method for manufacturing printed wiring board |
06/18/2009 | WO2009075212A1 Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board |
06/18/2009 | WO2009075206A1 Process for producing ceramic molded product |
06/18/2009 | WO2009074564A1 Parts made of electrostructural composite material |
06/18/2009 | WO2009074264A2 Solder connection element |
06/18/2009 | US20090155832 Apparatus and Method for Improved Optical Detection of Particles in Fluid |
06/18/2009 | US20090154182 Overmolded circuit board and method |
06/18/2009 | US20090154131 Conductive connecting pin and package substrate |
06/18/2009 | US20090154127 PCB Embedded Electronic Elements Structure And Method Thereof |
06/18/2009 | US20090154113 Thermal energy storage for mobile computing thermal management |
06/18/2009 | US20090154040 Memory card with electrostatic discharge protection and manufacturing method thereof |
06/18/2009 | US20090153619 Inkjet nozzle arrangement |
06/18/2009 | US20090153453 Flat Display Panel and Assembly Process of Driver Components in Flat Display Panel |
06/18/2009 | US20090153282 Electronic component and production method thereof |
06/18/2009 | US20090153163 Circuit board having bypass pad |
06/18/2009 | US20090152023 Hybrid touch panel and method making thereof |
06/18/2009 | US20090151998 Electromagnetic wave shielding wiring circuit forming method and electromagnetic wave shielding sheet |
06/18/2009 | US20090151993 Shielded cable interface module and method of fabrication |
06/18/2009 | US20090151990 Multilayer wiring board and method of making the same |
06/18/2009 | US20090151988 Flexible printed circuit board and method of manufacturing the same |
06/18/2009 | US20090151986 Method of manufacturing wiring board, wiring board, and semiconductor device |
06/18/2009 | US20090151985 Method of dicing a circuit board sheet and package circuit board |
06/18/2009 | US20090151984 Composite resin molded article, laminate, multi-layer circuit board, and electronic device |
06/18/2009 | US20090151968 Device for the High-Speed Drilling of Printed Circuit Boards |
06/18/2009 | US20090151161 Electron-emitting device manufacturing apparatus, solution including metal micro-particles, electron-emitting device, and image displaying apparatus |
06/18/2009 | US20090151160 Method of manufacturing printed circuit board |
06/18/2009 | US20090151158 Technique for laminating multiple substrates |
06/18/2009 | US20090151157 Method for Manufacturing Conductive Contact Holder |
06/18/2009 | US20090151156 Method of manufacturing a circuit board assembly for a controller |
06/18/2009 | US20090151154 System for uniform structuring of substrates |
06/18/2009 | US20090151150 Manufacturing method for a card and card obtained by said method |
06/18/2009 | DE202009003700U1 Kühlmodul für Leiterplatten und flächige Güter Cooling module for printed boards and flat goods |
06/18/2009 | DE19743767B4 Verfahren zum Herstellen eines Halbleiterchip-Gehäuses mit einem Halbleiterchip für Oberflächenmontage sowie ein daraus hergestelltes Halbleiterchip-Gehäuse mit Halbleiterchip A method of manufacturing a semiconductor die package with a semiconductor chip for surface mounting as well as a product manufactured therefrom semiconductor chip package with the semiconductor chip |
06/18/2009 | DE19706983B4 Oberflächenanbringungseinheit und Wandleranordnungen unter Verwendung der Oberflächenanbringungseinheit Surface mounting unit and transducer assemblies using the surface mounting unit |
06/18/2009 | DE112007001519T5 Verfahren zum Herstellen eines leitfähigen Materials A method for producing a conductive material |
06/18/2009 | DE102008058749A1 Verfahren zur Herstellung einer Leiterplattenbaugruppe für eine Steuereinheit A method of manufacturing a circuit board assembly for a control unit |
06/18/2009 | DE102008044315A1 Holder for keeping components in position while they are soldered on to circuit board has threaded connector at top of sleeve, connector having longitudinal bore which acts as guide for pressure component at base |
06/17/2009 | EP2071907A1 Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
06/17/2009 | EP2071591A1 Etching liquid for conductive polymer and method for patterning conductive polymer |
06/17/2009 | EP2071278A1 Inspecting apparatus |
06/17/2009 | EP2071057A2 Electroplating Bronze |
06/17/2009 | EP2071000A1 Adhesive tape |