| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/02/2009 | US20090166059 Circuit board and process thereof |
| 07/02/2009 | US20090166056 Contact member, connecting method of the contact member, and socket |
| 07/02/2009 | US20090165296 Patterns of conductive objects on a substrate and method of producing thereof |
| 07/02/2009 | US20090165295 Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates |
| 07/02/2009 | DE102007063282A1 Verfahren zur Herstellung eines elektrischen Leiters durch Auftragen zumindest einer Paste, insbesondere Dickschichtpaste A process for producing an electric conductor by applying at least one paste, in particular thick-film paste |
| 07/02/2009 | DE102007062202A1 Beschreibung Verfahren zur Kontaktierung einer starren Leiterplatte mit einem Kontaktpartner und Anordnung aus starrer Leiterplatte und Kontaktpartner Description method for contacting a rigid printed circuit board with a contact partner and assembly of rigid PCB and Partners |
| 07/02/2009 | DE102007061942A1 Schaltungsträger, Verfahren zur Herstellung eines Schaltungsträgers sowie Bondverfahren Circuit substrate, method of manufacturing a circuit substrate and bonding method |
| 07/01/2009 | EP2076106A2 Multilayer wiring board and method of manufacturing the same |
| 07/01/2009 | EP2076105A2 High frequency circuit unit |
| 07/01/2009 | EP2076104A2 Flexible film and display device comprising the same |
| 07/01/2009 | EP2076103A2 Flexible film and display device comprising the same |
| 07/01/2009 | EP2076102A2 Flexible film and display device comprising the same |
| 07/01/2009 | EP2076100A1 Wire-written circuit board or board with etched circuit routes |
| 07/01/2009 | EP2076099A1 Stacked foil sheet device |
| 07/01/2009 | EP2075802A1 Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film |
| 07/01/2009 | EP2073973A2 Patterned printing plates and processes for printing electrical elements |
| 07/01/2009 | EP1682957B1 A method for generating a jetting program |
| 07/01/2009 | EP1665913B1 Method and system for creating fine lines using ink jet technology |
| 07/01/2009 | EP1645013B8 Component for a printed circuit board |
| 07/01/2009 | EP1613481A4 Organic silver compound and it's preparation method, organic silver ink and it's direct wiring method |
| 07/01/2009 | CN201267059Y Fixing device for pressfitting of multilayer circuit board |
| 07/01/2009 | CN201267058Y Composite circuit board |
| 07/01/2009 | CN201267057Y Surface patch type circulator |
| 07/01/2009 | CN201267056Y Off-line combined tool-smelting module |
| 07/01/2009 | CN101473707A Electrode bonding method and part mounting apparatus |
| 07/01/2009 | CN101472408A Multilayer wiring board and method of manufacturing the same |
| 07/01/2009 | CN101472407A Wiring substrate and manufacturing method thereof |
| 07/01/2009 | CN101472406A Method for manufacturing wiring substrate |
| 07/01/2009 | CN101472405A Multi-layer circuit board and manufacturing method thereof |
| 07/01/2009 | CN101472404A Multi-layer circuit board and manufacturing method thereof |
| 07/01/2009 | CN101472403A Printed circuit board and method for producing the same |
| 07/01/2009 | CN101472402A Soldering apparatus and soldering method |
| 07/01/2009 | CN101472401A Reflow furnace |
| 07/01/2009 | CN101472400A Printed wiring board unit and method of making the same |
| 07/01/2009 | CN101472399A Inner buried type circuit board and method for producing the same |
| 07/01/2009 | CN101472398A Multilayer flexible printed circuit board and method of manufacturing the same |
| 07/01/2009 | CN101472397A Method for correcting line length and readable storage media for computer |
| 07/01/2009 | CN101472396A Tool and method for drawing incising line of circuit board wiring diagram |
| 07/01/2009 | CN101472395A Layout method capable of avoiding position-placed superimpose of throughhole and element words identification |
| 07/01/2009 | CN101472394A Contraposition device |
| 07/01/2009 | CN101472393A Stamping mold for flexible circuit board |
| 07/01/2009 | CN100508721C Substrate operating system |
| 07/01/2009 | CN100508707C Electrical circuit apparatus and method for assembling same |
| 07/01/2009 | CN100508701C Hybrid multilayer substrate and preparation method thereof |
| 07/01/2009 | CN100508700C Process for manufacturing a wiring substrate |
| 07/01/2009 | CN100508699C Method of manufacturing printed circuit board having landless via hole |
| 07/01/2009 | CN100508698C Ceramic circuit board, method for making the same, and power module |
| 07/01/2009 | CN100508697C Technique for placing connectors on printing circuit board |
| 07/01/2009 | CN100508696C Electronic component mounting method and electronic component mounting structure |
| 07/01/2009 | CN100508695C Method and system for inspecting substrate for mounting components and method of producing substrate for mounting components |
| 07/01/2009 | CN100508694C Method for forming finely porous metal thin film through jet ink technique |
| 07/01/2009 | CN100508693C Image forming method and device, manufacture of device, conductive film layout, photoelectric device and electronic machine |
| 07/01/2009 | CN100508692C Method of fabricating printed circuit board having thin core layer |
| 07/01/2009 | CN100508145C Chip-embedded modular circuit board |
| 07/01/2009 | CN100507982C Dial module, its manufacturing process and meter employing that dial module |
| 06/30/2009 | US7554795 Electronic component |
| 06/30/2009 | US7554179 Multi-leadframe semiconductor package and method of manufacture |
| 06/30/2009 | US7554039 Electronic device |
| 06/30/2009 | US7553890 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 06/30/2009 | US7553512 Applying flowable precursor composition to organic substrate wherein precursor comprises molecular precursor to conductive phase and powder of insulating material, heating substrate to convert molecular precursor to conductive phase |
| 06/30/2009 | US7553457 Chemical processing apparatus for manufacturing circuit substrates |
| 06/30/2009 | US7553401 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
| 06/30/2009 | US7553375 Fabrication of functional device mounting board making use of inkjet technique |
| 06/30/2009 | US7553165 Spring interconnect structures |
| 06/30/2009 | US7553001 Inkjet printhead with laterally reciprocating paddle |
| 06/30/2009 | US7552531 Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit |
| 06/30/2009 | US7552530 Method of manufacturing a PCB having improved cooling |
| 06/30/2009 | US7552529 Method for assembling electronic circuits |
| 06/30/2009 | US7552525 Method for the production of a circuit board element |
| 06/30/2009 | CA2302957C Circuit chip connector and method of connecting a circuit chip |
| 06/25/2009 | WO2009079216A1 Conductive adhesive precursor, method of using the same, and article |
| 06/25/2009 | WO2009079214A1 Methods of fluxless micro-piercing of solder balls, and resulting devices |
| 06/25/2009 | WO2009078448A1 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution |
| 06/25/2009 | WO2009078409A1 Circuit connecting material and structure for connecting circuit member |
| 06/25/2009 | WO2009078380A1 Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate |
| 06/25/2009 | WO2009077684A1 Method for making an electric interconnection between two conducting layers |
| 06/25/2009 | WO2009077043A1 Improvements in or relating to circuit arrangements and associated apparatus and methods |
| 06/25/2009 | WO2006130721A3 Printable semiconductor structures and related methods of making and assembling |
| 06/25/2009 | US20090164146 Reflow Process Evaluation Device and Reflow Process Evaluation Method |
| 06/25/2009 | US20090162974 Semiconductor package board using a metal base |
| 06/25/2009 | US20090162622 Composition of a solder, and method of manufacturing a solder connection |
| 06/25/2009 | US20090161330 Chip carrier and fabrication method |
| 06/25/2009 | US20090161319 Electronic Circuit Arrangement and Method for Producing an Electronic Circuit Arrangement |
| 06/25/2009 | US20090160910 Inkjet printhead with heater element close to drive circuits |
| 06/25/2009 | US20090159327 Printed wiring board and manufacturing method of printed wiring board |
| 06/25/2009 | US20090159324 Printed circuit board and method of producing the same |
| 06/25/2009 | US20090159320 Low Cost High Frequency Device Package and Methods |
| 06/25/2009 | US20090159318 Printed circuit board and manufacturing method thereof |
| 06/25/2009 | US20090159316 Wiring substrate and method of manufacturing the same |
| 06/25/2009 | US20090158581 Process for Making a Multilayer Circuit Device Having Electrically Isolated Tightly Spaced Electrical Current Carrying Traces |
| 06/25/2009 | DE102008030101A1 Lötanschlusselement Solder connection |
| 06/25/2009 | DE102007062944A1 Electronic component/circuit i.e. organic electronic component/circuit, for use in e.g. radio-frequency identification tag, has regions of carrier substrate and pattern like layer made of inorganic or organic material and spaced from layer |
| 06/25/2009 | DE102007062443A1 Applicator for applying a flux to a solder site comprises a flux container having a flux level which is controlled by a dosing valve above a level sensor and a horizontally and vertically moving flux stamp |
| 06/25/2009 | DE102007062359A1 Fixing element i.e. hollow cylinder, for attachment of surface-mount device component in printed circuit board, has screw element pivoted into interference section causing axial thrust force application of expansion section during turning |
| 06/25/2009 | DE102007062166A1 Electronic component contacting method for electronic circuit carrier, involves changing compound in irradiation region of laser by irradiation with laser such that compound is conductive and contacting of component takes place |
| 06/25/2009 | DE102007059794A1 Stencil for screen printing method, has plane stencil body with stencil thickness, where individual carrier net is provided at scraper side and at opposite substrate side through layout recesses till specified depth |
| 06/25/2009 | DE102005033691B4 Verfahren zur Herstellung einer Basisplatte für eine Schaltungsbaugruppe, Basisplatte für eine Schaltungsbaugruppe, und Verwendung der Basisplatte für eine Schaltungsbaugruppe A process for preparing a base plate for a circuit board, base plate for a circuit package, and use of base plate for a circuit package |
| 06/25/2009 | DE102004019877B4 Haftschicht zum Kleben von Harz auf eine Kupferoberfläche Adhesive layer for bonding resin on a copper surface |
| 06/24/2009 | EP2073615A1 Method for selectively coating a surface with fluid |
| 06/24/2009 | EP2073614A2 Contact and connecting device |