| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/09/2009 | US20090175008 Electrical connection interfaces and methods for adjacently positioned circuit components |
| 07/09/2009 | US20090175000 Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same |
| 07/09/2009 | US20090174974 Embedded type multifunctional integrated structure for integrating protection components and method for manufacturing the same |
| 07/09/2009 | US20090174499 Dielectric Waveguide Device, Phase Shifter, High Frequency Switch, and Attenuator Provided with Dielectric Waveguide Device, High Frequency Transmitter, High Frequency Receiver, High Frequency Transceiver, Radar Device, Array Antenna, and Method of Manufacturing Dielectric Waveguide Device |
| 07/09/2009 | US20090174083 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same |
| 07/09/2009 | US20090174060 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 07/09/2009 | US20090173795 Card type information device and method for manufacturing same |
| 07/09/2009 | US20090173532 Wiring board having a non-through hole with a vent hole |
| 07/09/2009 | US20090173531 Printed circuit board and manufacturing method thereof |
| 07/09/2009 | US20090173530 Interposer and method for manufacturing interposer |
| 07/09/2009 | US20090173529 Circuit structure and fabrication method thereof |
| 07/09/2009 | US20090173526 Electrical Component with a Sensor Element, Method for the Encapsulation of a Sensor Element, and Method for Production of a Plate Arrangement |
| 07/09/2009 | US20090173524 Dual density printed circuit board isolation planes and method of manufacture thereof |
| 07/09/2009 | US20090173523 Multilayer build-up wiring board |
| 07/09/2009 | US20090173517 Solder wire construction |
| 07/09/2009 | DE4443424B4 Anordnungen aus einem mehrschichtigen Substrat und einem Leistungselement und Verfahren zu ihrer Herstellung Arrays of a multi-layer substrate and a power element and process for their preparation |
| 07/09/2009 | DE112007002073T5 Vorrichtung zum Montieren elektronischer Bauteile und Verfahren zum Montieren elektronischer Bauteile An apparatus for mounting electronic components and electronic component mounting method |
| 07/09/2009 | DE102008060797A1 Verbesserte Isolierschicht für steife Leiterplatten Improved insulation of rigid printed circuit boards |
| 07/09/2009 | DE102007063388A1 Method for producing solder contact on contact element at outer side of electrical or electronic component, involves applying solder in form of solder droplet on surface of printed circuit board using dispenser |
| 07/08/2009 | EP2077703A1 Printed circuit board and method of manufacturing printed circuit board |
| 07/08/2009 | EP2077581A1 Solid-state imaging device |
| 07/08/2009 | EP2077065A1 Use of an adhesive composition for die-attaching high power semiconductors |
| 07/08/2009 | EP1969908B1 Electric device comprising a lubricated joint point and method for lubricating said type of joint point |
| 07/08/2009 | EP1824638A4 Pb free solder alloy |
| 07/08/2009 | EP1336329B1 Printed circuit board assembly and method of producing it |
| 07/08/2009 | CN201270626Y Improved construction for PCB pre-pressing |
| 07/08/2009 | CN101480116A Circuit board, electronic device and method for manufacturing circuit board |
| 07/08/2009 | CN101480115A Improved process for pressureless constrained sintering of low temperature co-fired ceramic with surface circuit patterns |
| 07/08/2009 | CN101480114A Printed circuit board, printed circuit board unit, and electronic apparatus |
| 07/08/2009 | CN101480113A Jet solder tank |
| 07/08/2009 | CN101478862A Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
| 07/08/2009 | CN101478861A Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device |
| 07/08/2009 | CN101478860A Steel sheet reinforced pasting tool in flexible circuit board manufacturing process and manufacturing process |
| 07/08/2009 | CN101478089A Connector chip and its manufacturing method |
| 07/08/2009 | CN100512607C Method for manufacture of laminated ceramic substrate and multilayer ceramic substrate |
| 07/08/2009 | CN100512606C Multilayer ceramic substrate and method for manufacture thereof |
| 07/08/2009 | CN100512605C Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and printed circuit substrate |
| 07/08/2009 | CN100512604C Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board |
| 07/08/2009 | CN100512603C Method for manufacturing double-sided printed glass board |
| 07/08/2009 | CN100512602C Adhesive and adhered thin film |
| 07/08/2009 | CN100512601C Elements preparing method for surface mounting machine and the surface mounting machine |
| 07/08/2009 | CN100512600C Method for mfg. radiation circuit board |
| 07/08/2009 | CN100512599C Board for printed wiring and printed wiring board |
| 07/08/2009 | CN100512598C Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device |
| 07/08/2009 | CN100512597C Method for manufacturing circuit board |
| 07/08/2009 | CN100512595C Copper foil for printed-circuit board |
| 07/08/2009 | CN100512594C Preferential ground and via exit structures for printed circuit boards |
| 07/08/2009 | CN100512593C High frequency printed circuit board via VIA |
| 07/08/2009 | CN100511853C Small array contact with precision working range |
| 07/08/2009 | CN100511608C Metal mask plate |
| 07/08/2009 | CN100511509C Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same |
| 07/08/2009 | CN100511490C Conductive materials with electrical stability for use in electronics devices |
| 07/08/2009 | CN100510723C Component mounting board inspecting apparatus |
| 07/08/2009 | CN100510174C Electroless gold plating solution |
| 07/08/2009 | CN100509984C Film-shaped adhesive for circuit connection |
| 07/08/2009 | CN100509983C Adhesive for circuit connection |
| 07/08/2009 | CN100509982C Adhisive for circuit connection |
| 07/08/2009 | CN100509981C Adhesive for circuit connection |
| 07/08/2009 | CN100509951C Thermoset resin composition and multi-layer printed circuit board using the resin composition |
| 07/08/2009 | CN100509257C Use of lead-free solder ball in producing tin soldering projection and the tin soldering projection thereof |
| 07/08/2009 | CN100509254C Composition of a solder, and method of manufacturing a solder connection and a product obtained thereof |
| 07/08/2009 | CN100509250C Photo-thermal induced diffusion method |
| 07/08/2009 | CN100509176C Method and apparatus for detecting a liquid spray pattern |
| 07/07/2009 | US7557596 Test assembly including a test die for testing a semiconductor product die |
| 07/07/2009 | US7557450 Wiring substrate and electronic parts packaging structure |
| 07/07/2009 | US7557304 Printed circuit board having closed vias |
| 07/07/2009 | US7556913 Forming film from organometallic compound by combustion; forming resin on surface of substrate; absorption ; washing |
| 07/07/2009 | US7556719 Comprising conductor layer, insulating layer located adjacent to conductor layer, and terminal portion formed by conductor layer exposed by opening insulating layer, forming thin metal film on surface of insulating layer and surface, the removing; prevents electrostatic damage |
| 07/07/2009 | US7556190 Method and device for mounting electric component |
| 07/07/2009 | US7555836 Method of making lithographic contact elements |
| 07/07/2009 | US7555835 Fabricating a monolithic microwave integrated circuit |
| 07/07/2009 | US7555831 Method of validating component feeder exchanges |
| 07/02/2009 | WO2009082005A1 Surface reactive support body, wiring board that uses same, and fabrication method therefor |
| 07/02/2009 | WO2009081929A1 Mounted board and method for manufacturing the same |
| 07/02/2009 | WO2009081925A1 Layered photosensitive-resin product |
| 07/02/2009 | WO2009081889A1 Copper foil for printed wiring board |
| 07/02/2009 | WO2009081882A1 Multilayer printed board and method for manufacturing the same |
| 07/02/2009 | WO2009081853A1 Method for manufacturing multilayer wiring board |
| 07/02/2009 | WO2009081685A1 Component mounting board and method for manufacturing same |
| 07/02/2009 | WO2009081648A1 Method for manufacturing element mounting substrate |
| 07/02/2009 | WO2009081610A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board |
| 07/02/2009 | WO2009081518A1 Semiconductor device and multilayer wiring board |
| 07/02/2009 | WO2009081474A1 Repair method and repair jig |
| 07/02/2009 | WO2009080571A1 Method for producing an antenna system |
| 07/02/2009 | WO2009080540A1 Method for contacting a rigid circuit board to a contact partner and arrangement of a rigid circuit board and contact partner |
| 07/02/2009 | WO2009080087A1 A method for producing an antenna structure for an rfid device, and a dry toner for use in producing such antenna structure |
| 07/02/2009 | US20090170245 Electronic apparatus manufacturing method |
| 07/02/2009 | US20090170240 Optimized Circuit Design Layout for High Performance Ball Grid Array Packages |
| 07/02/2009 | US20090169730 Method of forming conductors at low temperatures using metallic nanocrystals and product |
| 07/02/2009 | US20090168432 Light-emitting element mounting substrate, light source, lighting device, display device, traffic signal, and method of manufacturing light-emitting element mounting substrate |
| 07/02/2009 | US20090168368 Discrete electronic component and related assembling method |
| 07/02/2009 | US20090168366 Thin multi-chip flex module |
| 07/02/2009 | US20090168363 Thin multi-chip flex module |
| 07/02/2009 | US20090166903 Molded waveguides |
| 07/02/2009 | US20090166892 Circuit board for semiconductor package having a reduced thickness, method for manufacturing the same, and semiconductor package having the same |
| 07/02/2009 | US20090166653 Incorporating reflective layers into led systems and/or components |
| 07/02/2009 | US20090166080 Multilayer wiring board and method of manufacturing the same |
| 07/02/2009 | US20090166077 Wiring board and method of manufacturing the same |
| 07/02/2009 | US20090166072 Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same |
| 07/02/2009 | US20090166061 PCB strip, PCB strip assembly device using the PCB strip, a method of using the PCB strip assembly device, and a method of fabricating a PCB strip |