| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/21/2009 | US7563987 Electronic parts packaging structure and method of manufacturing the same |
| 07/21/2009 | US7563564 Method of forming flexible electronic circuits |
| 07/21/2009 | US7563513 waterborne reactive graded mixed metal Zr:Si sol-gel; stable oxide surface covalently bonded on titanium and aluminum alloy; corrosion resistance, impact resistance over wide temperature range; adhesion; Conversion coating; nontoxic; spraying rather than immersion for easy maintenance |
| 07/21/2009 | US7563487 laminating a porous film made of polytetrafluoroethylene with elasticity suitable for elastic recovery and used as a base film, adhering conductive metal by electroless plating at plural positions of the base film; use in the burn-in test of semiconductor devices |
| 07/21/2009 | US7563352 Method and conveyorized system for electorlytically processing work pieces |
| 07/21/2009 | US7563315 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates |
| 07/21/2009 | US7563149 Sheet for manufacturing plasma display apparatus and method for manufacturing plasma display |
| 07/21/2009 | US7562806 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device |
| 07/21/2009 | US7562804 Methods for manufacturing optical modules using lead frame connectors |
| 07/21/2009 | US7562446 Method for manufacturing substrate with cavity |
| 07/21/2009 | US7562445 Method of manufacture of an identification wristband construction |
| 07/21/2009 | US7562444 Method for manufacturing a CPU cooling assembly |
| 07/21/2009 | US7562436 Deposition defined trackwidth for very narrow trackwidth CPP device |
| 07/21/2009 | US7562428 Manufacturing an ink jet head |
| 07/16/2009 | WO2009088363A1 A method of depth routing an electronic layup and apparatus for effecting such a method |
| 07/16/2009 | WO2009088000A1 Wiring board, semiconductor device and method for manufacturing wiring board and semiconductor device |
| 07/16/2009 | WO2009087845A1 Multilayer ceramic substrate, method for manufacturing multilayer ceramic substrate and method for suppressing warpage of multilayer ceramic substrate |
| 07/16/2009 | WO2009087839A1 Method for manufacturing ceramic electronic component and ceramic electronic component |
| 07/16/2009 | WO2009087838A1 Process for producing ceramic molded product |
| 07/16/2009 | WO2009087113A1 Method of mounting an electrical component having at least two electrical connection pins on a support element having at least two holes, and electrical connection between an electrical component and a support element |
| 07/16/2009 | WO2009087035A1 Electronic component and method for producing such an electronic component |
| 07/16/2009 | US20090181560 S&p3 cww2 connectors with wipe |
| 07/16/2009 | US20090181227 Formation of Conductive Metal Regions on Substrates |
| 07/16/2009 | US20090181183 Stabilized Metal Nanoparticles and Methods for Depositing Conductive Features Using Stabilized Metal Nanoparticles |
| 07/16/2009 | US20090181164 Oxidation-Free Copper Metallization Process Using In-situ Baking |
| 07/16/2009 | US20090180266 Differential pair inversion for reduction of crosstalk in a backplane system |
| 07/16/2009 | US20090180260 Memory module, method for manufacturing a memory module and computer system |
| 07/16/2009 | US20090180011 Miniaturized imaging module construction technique |
| 07/16/2009 | US20090179230 Wiring Substrate, Semiconductor Device and Manufacturing Method Thereof |
| 07/16/2009 | US20090178904 Switch having a complementary diode unit |
| 07/16/2009 | US20090178840 Pcb and manufacturing method thereof |
| 07/16/2009 | US20090178838 Circuit board having an electrodeposited coating on a conductive core within a via and method of making same |
| 07/16/2009 | US20090178836 Wiring board for semiconductor device |
| 07/16/2009 | US20090178835 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 07/16/2009 | US20090178830 Printed circuit board and component package having the same |
| 07/16/2009 | US20090178828 Heat dissipating wiring board and method for manufacturing same |
| 07/16/2009 | US20090178420 Icemaker Control Module |
| 07/16/2009 | US20090178276 Method for forming circuit in making printed circuit board |
| 07/16/2009 | US20090178275 Silicon Carrier Including An Integrated Heater For Die Rework And Wafer Probe |
| 07/16/2009 | US20090178274 Methods of manufacturing printed circuit boards with stacked micro vias |
| 07/16/2009 | US20090178273 Method of making circuitized assembly including a plurality of circuitized substrates |
| 07/16/2009 | DE202009006254U1 Verbindungselement für elektrische Leiter mit einer Leiterplatte Connection element for electric conductors with a printed circuit board |
| 07/16/2009 | DE102008059130A1 Anordnung mit einem Shuntwiderstand und einem Verfahren zur Herstellung einer Anordnung mit einem Shuntwiderstand Arrangement comprising a shunt resistor and a method for producing an arrangement with a shunt resistor |
| 07/16/2009 | DE102008003372A1 Two/three-dimensional multi-layer circuit carrier producing method for e.g. automobile industry, involves applying layer of strip conductor and dielectric layer on topmost dielectric layer alternatively |
| 07/16/2009 | DE102007053513B3 Füllanlage Filling station |
| 07/16/2009 | DE102005045350B4 Druckschablone eines SMT-Prozesses Stencil of an SMT process |
| 07/15/2009 | EP2079292A2 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method |
| 07/15/2009 | EP2079291A1 Printed circuit board and method of manufacturing printed circuit board |
| 07/15/2009 | EP2078607A1 Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile polymer and method of synthesizing the same, composition containing nitrile polymer, and layered product |
| 07/15/2009 | EP1792526B1 Electronic device provided with an integrated heat spreader |
| 07/15/2009 | EP1623056B1 Method and device for coating a substrate |
| 07/15/2009 | EP1048757B1 Plating method and apparatus |
| 07/15/2009 | CN201274613Y PCB composite board with multiple electric source |
| 07/15/2009 | CN201274612Y PCB composite board with fixing apparatus |
| 07/15/2009 | CN201274611Y Assistant tool |
| 07/15/2009 | CN201274610Y 回流焊治具 Reflow Fixture |
| 07/15/2009 | CN101485238A Ball grid array (BGA) connection system and related method and ball socket |
| 07/15/2009 | CN101483980A Combined surface processing method for firm-flexible combined circuit board |
| 07/15/2009 | CN101483979A Electronic circuit module |
| 07/15/2009 | CN101483978A Method of repair of electronic device and repair system |
| 07/15/2009 | CN101483977A Circuit board and manufacturing method thereof |
| 07/15/2009 | CN101483976A Method for manufacturing flexible substrate and flexible substrate punching device |
| 07/15/2009 | CN101483080A Anisotropic conductive adhesive sheet and coupling structure |
| 07/15/2009 | CN100515167C Copper foil having blackened surface or layer |
| 07/15/2009 | CN100515163C Multi-layer board manufacturing method |
| 07/15/2009 | CN100515162C Printed circuit board and method of manufacturing the same |
| 07/15/2009 | CN100515161C Common rolled separation board |
| 07/15/2009 | CN100515160C Method for removing peripheral metal residues of base board |
| 07/15/2009 | CN100514767C Method of plating circuit board contact and manufacturing printed circuit board and materials |
| 07/15/2009 | CN100514617C Circuit base board, mounting structure for semiconductor device with bumps, and electro-optic device |
| 07/15/2009 | CN100514501C Insulated conductive particles and anisotropic conductive adhesive film containing the particles |
| 07/15/2009 | CN100514046C Image recognition apparatus and image recognition method |
| 07/15/2009 | CN100513644C Etchant and replenishment solution therefor, and etching method and method for producing wiring board using them |
| 07/15/2009 | CN100513507C Adhesive for circuit connection |
| 07/15/2009 | CN100513485C Silicon rubber composition for electrode circuit protection, electrode circuit protection material and electric, electronic parts |
| 07/15/2009 | CN100513038C Composite reactive multilayer foil |
| 07/14/2009 | US7560819 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 07/14/2009 | US7560810 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 07/14/2009 | US7560153 Insert-molded article and a production method for insert-molded article |
| 07/14/2009 | US7559144 Method for making an inkjet head |
| 07/14/2009 | US7559139 Method for manufacturing a probe unit |
| 07/14/2009 | US7559138 Method for replacing defective PCB from PCB panel |
| 07/14/2009 | US7559131 Method of making a radio frequency identification (RFID) tag |
| 07/14/2009 | CA2648536A1 Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
| 07/14/2009 | CA2507313C Surface mountable clip suitable for use in a mobile communication device |
| 07/09/2009 | WO2009086219A1 Multi-metamaterial-antenna systems with directional couplers |
| 07/09/2009 | WO2009086146A2 Plated dielectric frame with integrated connector |
| 07/09/2009 | WO2009086100A1 Patterning a thick film paste in surface features |
| 07/09/2009 | WO2009085941A1 Power combiners and dividers based on composite right and left handed metamaterial structures |
| 07/09/2009 | WO2009085004A1 Method of producing a microstructured product |
| 07/09/2009 | WO2009084958A1 Stacked foil sheet device |
| 07/09/2009 | WO2009084929A2 A multilayer film for dry film resist |
| 07/09/2009 | WO2009084635A1 Aqueous coating agent for electronic component |
| 07/09/2009 | WO2009084540A1 Metal-clad substrate, and method for production thereof |
| 07/09/2009 | WO2009084412A1 Method for manufacturing double layer copper clad laminated board, and double layer copper clad laminated board |
| 07/09/2009 | WO2009084337A1 Process for producing metal film, primer composition, metal film and use of the metal film |
| 07/09/2009 | WO2009083505A1 Method for producing an electrical conductor by applying at least one paste, in particular thick-film paste |
| 07/09/2009 | US20090176029 Printer and Method for Manufacturing Electronic Circuits and Displays |
| 07/09/2009 | US20090175012 Press fit passive component |
| 07/09/2009 | US20090175010 Method of repair of electronic device and repair system |