| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/29/2009 | CN100521872C Method and device for holding sheet-like workpiece |
| 07/29/2009 | CN100521871C Method of manufacturing electrical parts |
| 07/29/2009 | CN100521869C Nanoparticle filled underfill |
| 07/29/2009 | CN100521868C Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 07/29/2009 | CN100521866C Flexible copper-coated laminated board and mfg. method |
| 07/29/2009 | CN100521470C Surface mounted power supply circuit apparatus and method for manufacturing the same |
| 07/29/2009 | CN100521262C Light emitting assembly |
| 07/29/2009 | CN100521167C Method for producing mixed integrated circuit apparatus |
| 07/29/2009 | CN100521001C Multilayer ceramic electronic component and mounting structure and method for the same |
| 07/29/2009 | CN100520539C Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| 07/29/2009 | CN100519630C Active energy line cured resin, optical solidified and thermosetting resin composition containing the resin and condensate thereof |
| 07/29/2009 | CN100519211C Method and device for printing printed material |
| 07/29/2009 | CN100519185C Printing screens, frames therefor and printing screen units |
| 07/29/2009 | CN100519067C Gripper for holding a piece to be machined in a grinding machine |
| 07/29/2009 | CN100519012C Metal nano particle dispersion liquid capable of being sprayed in fine particle form and being applied in laminated state |
| 07/28/2009 | US7567313 Bezel design for surface mount display modules |
| 07/28/2009 | US7566836 Potting shell |
| 07/28/2009 | US7566834 Wiring board and semiconductor package using the same |
| 07/28/2009 | US7566635 Substrate dividing method |
| 07/28/2009 | US7566113 Inkjet nozzle incorporating serpentine actuator |
| 07/28/2009 | US7565738 Method for manufacturing circuit device |
| 07/28/2009 | US7565737 Manufacturing method of package substrate |
| 07/28/2009 | US7565736 Process for manufacturing printed circuit boards and a machine for this purpose |
| 07/23/2009 | WO2009092064A2 Electrically conductive adhesive |
| 07/23/2009 | WO2009091461A2 Liquid cleaning apparatus for cleaning printed circuit boards |
| 07/23/2009 | WO2009091460A2 Circuit board having an electrodeposited coating on a conductive core within a via and method of making same |
| 07/23/2009 | WO2009091219A2 Printed circuit board installation method |
| 07/23/2009 | WO2009090879A1 Three-dimensional wiring board |
| 07/23/2009 | WO2009090878A1 Multilayer printed wiring board and mounting body using the same |
| 07/23/2009 | WO2009090867A1 Resist material and laminate |
| 07/23/2009 | WO2009090808A1 Reduced-pressure heater, its heating method, and electronic product manufacturing method |
| 07/23/2009 | WO2009090798A1 Flux creeping-up preventive composition for solder, electronic member for solder coated with the composition, method for soldering the member, and electrical appliance |
| 07/23/2009 | WO2009090776A1 Semiconductor device and process for producing the same |
| 07/23/2009 | WO2009090717A1 Circuit board and method for mounting electronic component on printed board |
| 07/23/2009 | WO2009090693A1 Circuit board module and electronic apparatus |
| 07/23/2009 | WO2009090015A1 Device for stabilizing the hold of an electric component |
| 07/23/2009 | US20090186302 Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern |
| 07/23/2009 | US20090186169 Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods |
| 07/23/2009 | US20090185393 Light source module, method of fabricating the same, and display device having the light source module |
| 07/23/2009 | US20090185357 Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
| 07/23/2009 | US20090185352 High performance power device |
| 07/23/2009 | US20090184784 Reference Plane Voids with Strip Segment for Improving Transmission Line Integrity over Vias |
| 07/23/2009 | US20090184727 Space Transformer, Manufacturing Method of the Space Transformer and Probe Card Having the Space Transformer |
| 07/23/2009 | US20090184726 Probe card and method of manufacturing the same |
| 07/23/2009 | US20090184420 Post bump and method of forming the same |
| 07/23/2009 | US20090184090 Thin-film assembly and method for producing said assembly |
| 07/23/2009 | US20090184000 Electrochemical Sensor System Using a Substrate With at Least One Aperture and Method of Making the Same |
| 07/23/2009 | US20090183904 Printed wiring board and method for producing the same |
| 07/23/2009 | US20090183366 Method for manufacturing circuit forming substrate |
| 07/23/2009 | US20090183365 Method for assembling lens module with image sensor |
| 07/23/2009 | US20090183364 Method of connecting a series of integrated devices utilizing flexible circuits in a semi-stacking configuration |
| 07/23/2009 | DE112007002269T5 Elektronische Schaltplatte Electronic circuit board |
| 07/23/2009 | DE112007002127T5 System zum Montieren elektronischer Bauteile und Verfahren zum Montieren elektronischer Bauteile The electronic component mounting system and method for mounting electronic components |
| 07/23/2009 | DE112007002115T5 Vorrichtung zum Aufsetzen elektronischer Bauteile und Verfahren zum Montieren elektronischer Bauteile A device for placing electronic components and electronic component mounting method |
| 07/23/2009 | DE10301510B4 Verfahren zur Herstellung eines Verkleinerten Chippakets Process for the preparation of a reduced chip package |
| 07/23/2009 | DE10297047B4 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly |
| 07/23/2009 | DE102006022290B4 Heizer mit integriertem Temperatursensor auf Träger Heater with integrated temperature sensor carrier |
| 07/23/2009 | DE102006018731B4 Verfahren zur Herstellung von Leiterplatten mit Durchkontaktierungen und Vorrichtung zur Durchführung des Verfahrens Process for the preparation of printed circuit boards with vias and apparatus for carrying out the method |
| 07/23/2009 | DE102005047106B4 Leistungshalbleitermodul und Verfahren zur Herstellung The power semiconductor module and process for preparing |
| 07/23/2009 | CA2711649A1 Circuit board having an electrodeposited coating on a conductive core within a via and method of making same |
| 07/22/2009 | EP2081419A2 Printed circuit board and method of manufacturing printed circuit board |
| 07/22/2009 | EP2081222A1 Circuit connection structure |
| 07/22/2009 | EP2081204A2 Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
| 07/22/2009 | EP2080822A1 Direct plating method and solution for palladium conductor layer formation |
| 07/22/2009 | EP2080818A2 Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
| 07/22/2009 | EP2007179A9 Multilayer circuit board having cable portion and method for manufacturing same |
| 07/22/2009 | EP1884150B1 Improved printed circuit board assembly |
| 07/22/2009 | EP1723837B1 Method and apparatus for simultaneous inspection and cleaning of a stencil |
| 07/22/2009 | CN201278611Y Protection cover for socket connector |
| 07/22/2009 | CN101491166A Method for producing electrically conductive surfaces on a carrier |
| 07/22/2009 | CN101489360A Electronic apparatus |
| 07/22/2009 | CN101489359A Method for avoiding solder bridge |
| 07/22/2009 | CN101489358A Element surface mounting method for flexible circuit board |
| 07/22/2009 | CN101489357A Component assembling method for flexible circuit board |
| 07/22/2009 | CN101489356A Circuit board and production method thereof |
| 07/22/2009 | CN101489355A Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle |
| 07/22/2009 | CN101489354A Device and method for forming a three-dimensional circuit board |
| 07/22/2009 | CN101489353A Design method for board dimension |
| 07/22/2009 | CN101489352A Production method for printed circuit heat radiation board |
| 07/22/2009 | CN101488466A Fabrication method of semiconductor integrated circuit device |
| 07/22/2009 | CN100518484C System and method for rapid alignment and accurate placement of electronic components on a printed circuit board |
| 07/22/2009 | CN100518452C 印刷电路板及其制造方法 The method of manufacturing a printed circuit board and |
| 07/22/2009 | CN100518451C Method for producing a multilayer printed wiring board |
| 07/22/2009 | CN100518450C Method for producing substrates |
| 07/22/2009 | CN100518449C Process for producing multilayer printed wiring board and multilayer printed wiring board |
| 07/22/2009 | CN100518448C A manufacturing method of via-hole of circuit board |
| 07/22/2009 | CN100518447C A method for implementing coupler integration into a printed circuit board |
| 07/22/2009 | CN100518446C Method for manufacturing printed circuit board with thin film capacitor embedded therein |
| 07/22/2009 | CN100518445C Method for fabricating thin film pattern, and device manufacturing method |
| 07/22/2009 | CN100518444C Method for forming through-hole that utilizes lazer drill |
| 07/22/2009 | CN100518443C Planar resistance heating element and manufacturing method thereof |
| 07/22/2009 | CN100518442C Wiring method and system |
| 07/22/2009 | CN100518441C Method for realizing reutilization in printed circuit board design |
| 07/22/2009 | CN100518432C Substrate, method of manufacturing multi-layer substrate, and satellite broadcasting reception apparatus |
| 07/22/2009 | CN100517708C Hybrid integrated circuit device |
| 07/22/2009 | CN100516851C Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat |
| 07/22/2009 | CN100516159C 抛光组合物及抛光方法 Polishing composition and polishing method |
| 07/21/2009 | US7564131 Semiconductor package and method of making a semiconductor package |
| 07/21/2009 | US7564116 Printed circuit board with embedded capacitors therein and manufacturing process thereof |
| 07/21/2009 | US7563990 Electronic product, a body and a method of manufacturing |