| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/05/2009 | CN100524674C Circuit connection method |
| 08/05/2009 | CN100524673C Manufacturing method of film substrate and manufacturing method of semiconductor component, display device and electronic device using the substrate |
| 08/05/2009 | CN100524587C Method and apparatus for correcting minute graphics defect of plane substrate |
| 08/05/2009 | CN100523898C LSI package provided with interface module and method of mounting the same |
| 08/05/2009 | CN100523370C Heat-resistant synthetic fiber sheet |
| 08/05/2009 | CN100523309C Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method |
| 08/05/2009 | CN100523305C System and method for electrolytic plating |
| 08/05/2009 | CN100522643C Printing of organometallic compounds to form conductive traces |
| 08/05/2009 | CN100522611C Screen printing device mask overlap mounting method, and screen printing device |
| 08/05/2009 | CN100522608C Device for step-wise lamination of steps |
| 08/05/2009 | CN100522445C Solder-dross mixture separation method and apparatus |
| 08/05/2009 | CN100522444C Soldering tin connecting device |
| 08/05/2009 | CN100522442C Soldering method, soldering device, bonding method, bonding device, and nozzle unit |
| 08/04/2009 | US7570494 Structure of flexible printed circuit board |
| 08/04/2009 | US7570492 Apparatus for venting an electronic control module |
| 08/04/2009 | US7570491 Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| 08/04/2009 | US7569920 Electronic component having at least one vertical semiconductor power transistor |
| 08/04/2009 | US7569474 Method and apparatus for soldering modules to substrates |
| 08/04/2009 | US7569473 Methods of forming semiconductor assemblies |
| 08/04/2009 | US7569418 Methods for securing packaged semiconductor devices to carrier substrates |
| 08/04/2009 | US7569334 Method of manufacturing for conductive pattern substrate |
| 08/04/2009 | US7569282 blackened surface with a uniform hue, no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, high in transmittance, for a plasma display panel; 1st and 2nd layer of of Cu, a Cu-Co alloy, a Co- Ni alloy and a Cu-Co-Ni alloy, 3rd layer of Co, Ni, In or alloy |
| 08/04/2009 | US7569271 Polyimide based compositions comprising doped polyaniline and methods and compositions relating thereto |
| 08/04/2009 | US7569250 Method, system, and apparatus for protective coating a flexible circuit |
| 08/04/2009 | US7569177 Method of producing ceramic multilayer substrates, and green composite laminate |
| 08/04/2009 | US7569162 electrically conductive passte including Cu powder, a glass frit, and acrylic resin vehicle, wherein an inorganic component such as alumina, which is not sintered at a sintering temperature capable of sintering the ceramic layer in the firing step, disposed on particle surfaces of the metal powder |
| 08/04/2009 | US7568788 Printhead with barrier at chamber inlet |
| 08/04/2009 | US7568610 Method of soldering electronic component having solder bumps to substrate |
| 08/04/2009 | US7568284 Components insertion method |
| 08/04/2009 | US7568281 Substrate accommodating tray pallet and substrate transfer system |
| 08/04/2009 | CA2511148C Spark gap apparatus and method for electrostatic discharge protection |
| 07/30/2009 | WO2009094537A2 Nanoscale metal paste for interconnect and method of use |
| 07/30/2009 | WO2009094024A1 Electronic device with connection bumps |
| 07/30/2009 | WO2009094005A1 Circuit board configuration |
| 07/30/2009 | WO2009093442A1 Method for manufacturing substrate for mounting component thereon, and substrate for mounting component thereon |
| 07/30/2009 | WO2009093343A1 Multilayer wiring board and its manufacturing method |
| 07/30/2009 | WO2009093248A1 Manufacture of a smart card |
| 07/30/2009 | WO2009015834A3 Electrical connection device, particularly for a motor vehicle, connecting an electrical component to a support element and method of mounting an electrical component on a support element. |
| 07/30/2009 | WO2006073295A9 Anti-static spacer for high temperature curing process of flexible printed circuit board |
| 07/30/2009 | US20090191731 High density connector and method of manufacture |
| 07/30/2009 | US20090191730 Electronic apparatus and method of manufacturing electronic apparatus |
| 07/30/2009 | US20090191701 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 07/30/2009 | US20090191329 Surface treatment process for circuit board |
| 07/30/2009 | US20090189949 Method for arranging print head chips |
| 07/30/2009 | US20090188804 Plating method |
| 07/30/2009 | US20090188712 Flexible Multilayer Printed Circuit Assembly with Reduced EMI Emissions |
| 07/30/2009 | US20090188711 Ground straddling in pth pinfield for improved impedance |
| 07/30/2009 | US20090188710 System and method for forming filled vias and plated through holes |
| 07/30/2009 | US20090188708 Printed wiring board and method for producing the same |
| 07/30/2009 | US20090188703 Multilayer wiring board and method of manufacturing the same |
| 07/30/2009 | US20090188701 Inorganic powder, resin composition filled with the powder and use thereof |
| 07/30/2009 | DE19743737B4 Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte A method for forming a wire bonding electrode on a thick layer printed circuit board |
| 07/30/2009 | DE102008020327A1 Component or bond connection unit fixing method for use in circuit arrangement e.g. semiconductor arrangement, involves applying force on contact surface, such that component or connection units is fixed to surface with reaction forces |
| 07/30/2009 | DE102008006647A1 Foil connector for use with connections of e.g. heater, has solder fixed to solder pad by using screen printing and provided for fixing and electrical connection to connections of glass pane, and soldering paste or wire soldered on solder |
| 07/30/2009 | DE102008006495A1 Circuit carrier i.e. standard flame retardant four printed circuit board, for air-conditioning system of motor vehicle, has copper thick film increasing current feed properties and applied on copper thin film by thermal spraying of metal |
| 07/30/2009 | DE102008006390A1 Verfahren zur Verklebung von flexiblen Leiterplatten mit Polymermaterialien zur partiellen oder vollständigen Versteifung A process for bonding flexible printed circuit boards with polymeric materials for partial or complete stiffening |
| 07/30/2009 | DE102008005748A1 Power electronic module comprises cooling body which has number of cooling channels for cooling medium, where ceramic layer is provided on lower side and upper side of cooling body |
| 07/30/2009 | DE102008005747A1 Power electronics module for use with radiator box of vehicle in automotive engineering, has plates connected among each other and sink connected with layers, where one layer comprises component based on low-temperature connection process |
| 07/30/2009 | DE102008005587A1 Electrically and/or thermally conducting structure i.e. conducting path, manufacturing method for radio-frequency identification transponder, involves applying electrically and/or thermally conducting material on plastic substrate |
| 07/30/2009 | CA2652107A1 Solder void reduction on circuit boards |
| 07/29/2009 | EP2083470A1 Electronic component with surface installation with precisely positioned electric connection |
| 07/29/2009 | EP2083296A2 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
| 07/29/2009 | EP2083295A2 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
| 07/29/2009 | EP2083294A2 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
| 07/29/2009 | EP2082825A1 Wiring board having a hole with a metal wiring formed therein, and method for producing the same |
| 07/29/2009 | EP2082631A1 A coating method and the coating formed thereby |
| 07/29/2009 | EP2082630A1 Method for forming solder layer on printed-wiring board and slurry discharge device |
| 07/29/2009 | EP2082629A2 Methods of patterning a material on polymeric substrates |
| 07/29/2009 | EP2081729A2 Materials for use with interconnects of electrical devices and related methods |
| 07/29/2009 | EP1987707B1 Method for producing a layer on a moulding |
| 07/29/2009 | EP1943888B1 A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
| 07/29/2009 | EP1839467A4 Anti-static spacer for high temperature curing process of flexible printed circuit board |
| 07/29/2009 | EP1567302A4 Laser trimming of resistors |
| 07/29/2009 | CN201282598Y Stereo circuit board |
| 07/29/2009 | CN201282597Y Jig of tin furnace |
| 07/29/2009 | CN201282596Y Water-proof, moistureproof and insect prevention electromagnetic stove circuit board |
| 07/29/2009 | CN201278629Y Garden tool capable of detaching and replacing workpiece |
| 07/29/2009 | CN101496458A Method for fixing an electrical or electronic component, in particular a printed circuit board, in a housing and fixing element therefor |
| 07/29/2009 | CN101496457A Inspection method, inspection processing system, processing device therein, and inspection device therein |
| 07/29/2009 | CN101494957A Method and substrate for producing multi-layer circuit board |
| 07/29/2009 | CN101494956A Method for preparing soft hard combined board |
| 07/29/2009 | CN101494955A Method f or printing ripping blue glue on gold finger tin-spraying plate |
| 07/29/2009 | CN101494954A Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| 07/29/2009 | CN101494953A Double-layer method flexibility two-side coated copper plate for multilayer flexibility printed circuit |
| 07/29/2009 | CN101494211A Semiconductor device and circuit board |
| 07/29/2009 | CN101491853A Soldering method and electronic circuit board and electronic apparatus using the soldering method |
| 07/29/2009 | CN100521905C Support pin identifying method and device, screen printing device and surface installation machine |
| 07/29/2009 | CN100521889C Horizontal component retention socket |
| 07/29/2009 | CN100521886C Electronic control module for a removable connector and methods of assembling same |
| 07/29/2009 | CN100521883C Method of manufacturing multilayer printed wiring board |
| 07/29/2009 | CN100521882C Method of manufacturing multilayer printed wiring board |
| 07/29/2009 | CN100521881C Method for producing rigid and flexible printed circuit board |
| 07/29/2009 | CN100521880C Method for providing a layer, wiring substrate, elector-optical device, and electronic equipment |
| 07/29/2009 | CN100521879C Method for making layers and wiring board made thereby |
| 07/29/2009 | CN100521878C Method for producing multilayer printed wiring board |
| 07/29/2009 | CN100521877C Manufacturing method for electronic controller |
| 07/29/2009 | CN100521876C Method for processing a thin film substrate |
| 07/29/2009 | CN100521875C Pattern forming configuration and pattern forming method, device and electro-optic device, and electronic equipment |
| 07/29/2009 | CN100521874C Method and equipment for disassembling components entirely from waste circuit board |
| 07/29/2009 | CN100521873C Method and equipment for disassembling circuit board using contacted impact |