| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/12/2009 | CN101504491A Optical contraposition apparatus for joint of circuit apparatus and substrates, and system having the same |
| 08/12/2009 | CN101502917A Positioning and deformation-correcting method for ultraviolet laser cutting of flexible printed circuit board |
| 08/12/2009 | CN100527923C Multilayer ceramic substrate, method for making the same, and composite green sheet for making multilayer ceramic substrate |
| 08/12/2009 | CN100527059C Touch panel and electronic device display window protection panel using the same |
| 08/12/2009 | CN100526901C Probe card for probing wafers with raised contact elements |
| 08/12/2009 | CN100526517C Electroplating liquid |
| 08/12/2009 | CN100526450C Detergent and cleaning method using the same |
| 08/12/2009 | CN100525983C Laser machining method and laser machining apparatus |
| 08/11/2009 | US7573725 Optimizing power delivery and signal routing in printed circuit board design |
| 08/11/2009 | US7573718 Spacer, printed circuit board, and electronic equipment |
| 08/11/2009 | US7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 08/11/2009 | US7572984 Electronic module with dual connectivity |
| 08/11/2009 | US7572671 Stacked module systems and methods |
| 08/11/2009 | US7572533 Flat panel direct methanol fuel cell and method of making the same |
| 08/11/2009 | US7572515 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 08/11/2009 | US7572503 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler |
| 08/11/2009 | US7572500 Method of manufacturing circuit-forming board and material of circuit-forming board |
| 08/11/2009 | US7572481 Pattern forming method and pattern forming apparatus |
| 08/11/2009 | US7572351 Process for producing wiring circuit board |
| 08/11/2009 | US7572343 Metal matrix with dispersed surface treated metal oxides; mixing |
| 08/11/2009 | US7571540 Production method of suspension board with circuit |
| 08/11/2009 | US7571539 Component verification method and apparatus |
| 08/11/2009 | CA2345829C Process to manufacture tight tolerance embedded elements for printed circuit boards |
| 08/06/2009 | WO2009097301A1 Method for forming a thin layer of particulate on a substrate |
| 08/06/2009 | WO2009096507A1 Resin composition and multilayer resin film employing the same |
| 08/06/2009 | WO2009096438A1 Method for electroconductive pattern formation |
| 08/06/2009 | WO2009096326A1 Ceramic multilayer substrate manufacturing method, and ceramic multilayer substrate |
| 08/06/2009 | WO2009096292A1 Layered product of photosensitive resin |
| 08/06/2009 | WO2009096243A1 Electronic component and method of mounting the same |
| 08/06/2009 | WO2009096216A1 Electronic part mounting structure, electronic part mounting method, and electronic part mounting substrate |
| 08/06/2009 | WO2009095559A2 Method for making a component having an electronic function |
| 08/06/2009 | WO2009095347A2 Method for gluing flexible circuit boards to polymer materials for partial or complete stiffening |
| 08/06/2009 | US20090196980 Electrical device with teeth joining layers and method for making the same |
| 08/06/2009 | US20090196979 Inkjet printing process for circuit board |
| 08/06/2009 | US20090196009 Semiconductor module, wiring board , and wiring method |
| 08/06/2009 | US20090195998 Printed circuit board and method of manufacturing the same |
| 08/06/2009 | US20090195997 Printed circuit board and method of manufacturing the same |
| 08/06/2009 | US20090194831 Integrated cavity in pcb pressure sensor |
| 08/06/2009 | US20090194321 Printed circuit board and method of manufacturing the same |
| 08/06/2009 | US20090193652 Scalable subsystem architecture having integrated cooling channels |
| 08/06/2009 | DE19736962B4 Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben Arrangement comprising a carrier substrate for power components and a heat sink and method for manufacturing the same |
| 08/06/2009 | DE102009005691A1 Elektrisch leitfähige Schicht, Laminat, welches diese verwendet und Herstellungsverfahren dafür Electrically conductive layer, laminate, which uses them and processes for its preparation |
| 08/06/2009 | DE102009003381A1 Elektronische Vorrichtung und Verfahren zur Herstellung der elektronischen Vorrichtung Electronic device and method of manufacturing the electronic device |
| 08/06/2009 | DE102008007749A1 Thermisch aktivier- und härtbare Klebefolie insbesondere für die Verklebung von elektronischen Bauteilen und flexiblen gedruckten Leiterbahnen Thermally activatable and hardenable adhesive film particularly for bonding electronic components and flexible printed conductor tracks |
| 08/06/2009 | DE102006033448B4 Eine Vorrichtung zum Löten eines Bauteils an eine Platine A device for soldering a component to a circuit board |
| 08/05/2009 | EP2086300A1 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 08/05/2009 | EP2086299A1 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 08/05/2009 | EP2086298A1 Solder void reduction on circuit boards |
| 08/05/2009 | EP2086296A2 Printed circuit board and method of manufacturing the same |
| 08/05/2009 | EP2085983A1 Electronic device with external terminals and method of production of the same |
| 08/05/2009 | EP2084949A1 Circuit board with regional flexibility |
| 08/05/2009 | EP2084786A1 Method of connecting circuit boards and connected structure |
| 08/05/2009 | EP2084324A1 Flexible printed conductive fabric and method for fabricating the same |
| 08/05/2009 | EP2022133A4 Module, filter, and antenna technology for millimeter waves multi-gigabits wireless systems |
| 08/05/2009 | EP2006909A9 Heat dissipating wiring board and method for manufacturing same |
| 08/05/2009 | EP1806036A4 Packaging and manufacturing of an integrated circuit |
| 08/05/2009 | EP1671524A4 Electrical circuit apparatus and method for assembling same |
| 08/05/2009 | EP1663513A4 Deposition and patterning process |
| 08/05/2009 | EP1372368B1 Radiating fin and radiating method using the radiating fin |
| 08/05/2009 | CN201286198Y FPC friction board carrier |
| 08/05/2009 | CN201286197Y Carrier for printed circuit board |
| 08/05/2009 | CN201286196Y Printed substrate for circuit board |
| 08/05/2009 | CN201286194Y Flexible multi-layer printed circuit board |
| 08/05/2009 | CN201286193Y Needle dot type FPC board clamp |
| 08/05/2009 | CN201283494Y Device for riveting fixture |
| 08/05/2009 | CN101502191A Wiring board and its manufacturing method |
| 08/05/2009 | CN101502190A Process for improving the adhesion of polymeric materials to metal surfaces |
| 08/05/2009 | CN101501830A Method for producing an electric functional layer on a surface of a substrate |
| 08/05/2009 | CN101501444A Soldering inspection method, soldering method, and soldering apparatus |
| 08/05/2009 | CN101500745A Bonding material, bonded portion and circuit board |
| 08/05/2009 | CN101500744A Cream solder and method of soldering electronic part |
| 08/05/2009 | CN101500739A Screen printing head, system and method |
| 08/05/2009 | CN101500376A Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin |
| 08/05/2009 | CN101500375A Electroconductive layer, laminate using the same, and producing processes thereof |
| 08/05/2009 | CN101500374A Control tool |
| 08/05/2009 | CN101500371A Circuit board and its producing method |
| 08/05/2009 | CN101499567A Device for electric contacting of the wire ends of an electric coil |
| 08/05/2009 | CN101498002A Surface-treating agent for metal and printed wiring substrate |
| 08/05/2009 | CN100525602C Electronic component mounting system and electronic component mounting method |
| 08/05/2009 | CN100525599C Module heat dissipating structure and control device using the same |
| 08/05/2009 | CN100525591C Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus |
| 08/05/2009 | CN100525590C Process for manufacturing a wiring substrate |
| 08/05/2009 | CN100525589C A manufacturing method of formation of circuit board electricity connection end |
| 08/05/2009 | CN100525588C Method of forming solder resist pattern |
| 08/05/2009 | CN100525587C Insulating pattern and method of forming the same |
| 08/05/2009 | CN100525586C Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened |
| 08/05/2009 | CN100525585C Manufacturing methods and electroless plating apparatus for manufacturing wiring circuit boards |
| 08/05/2009 | CN100525584C Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device |
| 08/05/2009 | CN100525583C Transmission line with a transforming impedance and solder lands |
| 08/05/2009 | CN100525582C Method of forming circuit pattern on printed circuit board |
| 08/05/2009 | CN100525581C Method for manufacturing the lamination porcelain base board |
| 08/05/2009 | CN100525580C Component-embedded substrate and method of manufacturing the same |
| 08/05/2009 | CN100525579C Circuit board and method for producing the same |
| 08/05/2009 | CN100525578C Method for increasing a routing density for a circuit board and such a circuit board |
| 08/05/2009 | CN100524951C Connection member and mount assembly and production method of the same |
| 08/05/2009 | CN100524849C Surface-mountable, radiation-emitting component and method for the production thereof |
| 08/05/2009 | CN100524724C Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
| 08/05/2009 | CN100524718C Structure and making method of the base plate integrating the embedded parts |
| 08/05/2009 | CN100524707C Underfill film for printed wiring assemblies |
| 08/05/2009 | CN100524677C Screen printing apparatus and heave forming method |