| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/19/2009 | CN100531525C Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus |
| 08/19/2009 | CN100531524C Method of making mounting plates |
| 08/19/2009 | CN100531523C Nano spraying circuit board producing method and equipment and material configuration |
| 08/19/2009 | CN100531522C Screen printing apparatus and screen printing method |
| 08/19/2009 | CN100531521C Apparatus and method for controlling registration of print steps in a continuous process for the manufacture of electrochemical sensors |
| 08/19/2009 | CN100531520C Bank structure, method of forming bank structure, device, electro-optical device and electronic apparatus |
| 08/19/2009 | CN100531519C Method for deep drilling print circuit board |
| 08/19/2009 | CN100531518C Technology for auxiliary removing hole wall copper in deep drilling hole |
| 08/19/2009 | CN100531517C High-heat radiation lubricating aluminium cover plate for drilling |
| 08/19/2009 | CN100531514C Short-proof printed circuit board structure |
| 08/19/2009 | CN100531513C Connection structure of printed wiring board |
| 08/19/2009 | CN100531511C Printed circuit board with improved differential via |
| 08/19/2009 | CN100531477C Transparent window with non-transparent contact surface for a soldering bonding |
| 08/19/2009 | CN100530816C Directivity coupler |
| 08/19/2009 | CN100530625C Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same |
| 08/19/2009 | CN100530580C Repairing method for bad paster in mobile phone camera mould set |
| 08/19/2009 | CN100529871C Production method of flexible electronic device |
| 08/19/2009 | CN100528984C Palladium complexes for printing circuits |
| 08/19/2009 | CN100528568C Functional material fixing method and functional material fixing device |
| 08/19/2009 | CN100528562C Method and apparatus for supporting and clamping a substrate |
| 08/19/2009 | CN100528560C Apparatus and method for manufacturing photosensitive laminate |
| 08/19/2009 | CN100528443C Solder handling system |
| 08/18/2009 | US7577967 Flexible printed circuit for optical disk drive |
| 08/18/2009 | US7577406 Wireless transceiver for automotive vehicle |
| 08/18/2009 | US7576991 Electrical equipment for junction and method of manufacturing the same |
| 08/18/2009 | US7576288 Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards |
| 08/18/2009 | US7576141 Thermoplastic resin, radical-polymerizable compound including (meth)acryloyl groups, curing agent that generates radical by photoirradiation, liquid rubber; storage stability |
| 08/18/2009 | US7575778 Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances |
| 08/18/2009 | US7575664 Plating method |
| 08/18/2009 | US7575653 Melt-flowable materials and method of sealing surfaces |
| 08/18/2009 | US7575150 Flux composition for solder, solder paste, and method of soldering |
| 08/18/2009 | US7574794 Method of manufacturing a touch screen |
| 08/18/2009 | US7574793 Process of forming a laminate ceramic circuit board |
| 08/13/2009 | WO2009100103A2 Method of connection of flexible printed circuit board and electronic device obtained thereby |
| 08/13/2009 | WO2009099417A1 Stencils with removable backings for forming micron-sized features on surfaces and methods of making and using the same |
| 08/13/2009 | WO2009099235A1 Process for producing structure with metal film, mother die for use in the process, and structure produced by the process |
| 08/13/2009 | WO2009099065A1 Resist ink and method for manufacturing multilayer printed wiring board |
| 08/13/2009 | WO2009099047A1 Circuit wiring board manufacturing method |
| 08/13/2009 | WO2009099042A1 Method of transferring adhesive film |
| 08/13/2009 | WO2009098834A1 Manufacturing method of optical wiring printed board and optical wiring printed circuit board |
| 08/13/2009 | WO2009098421A1 Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element |
| 08/13/2009 | WO2009049266A3 Apparatus and methods for the measurement of cardiac output |
| 08/13/2009 | US20090203245 Electrical connector assembly |
| 08/13/2009 | US20090203237 Electronic assembly and method of making same |
| 08/13/2009 | US20090202949 Producing method of wired circuit board |
| 08/13/2009 | US20090202944 Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition |
| 08/13/2009 | US20090202783 Treatment of Items |
| 08/13/2009 | US20090202709 Thin line conformal coating method |
| 08/13/2009 | US20090202142 Circuit board, method for testing circuit board, and method for manufacturing circuit board |
| 08/13/2009 | US20090201654 Method and system for improving electrical performance of vias for high data rate transmission |
| 08/13/2009 | US20090201648 Contour surface cooling of electronics devices |
| 08/13/2009 | US20090201333 Palladium complexes for printing circuits |
| 08/13/2009 | US20090201325 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head |
| 08/13/2009 | US20090200866 Circuit apparatus and fabrication method for circuit apparatus |
| 08/13/2009 | US20090200779 Ignition Device, Method for Producing the Same, Gas Generator for Air Bag and Gas Generator for Seat Belt Pretensioner |
| 08/13/2009 | US20090200682 Via in via circuit board structure |
| 08/13/2009 | US20090200263 Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement |
| 08/13/2009 | US20090200074 Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
| 08/13/2009 | US20090200073 Printed wiring board with capacitor |
| 08/13/2009 | US20090200070 Cu-BASED WIRING MATERIAL AND ELECTRONIC COMPONENT USING THE SAME |
| 08/13/2009 | US20090200069 Multilayer printed wiring board |
| 08/13/2009 | US20090200064 Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport |
| 08/13/2009 | US20090199401 Method for forming cast flexible substrate and resultant substrate and electronic device |
| 08/13/2009 | US20090199400 Electronic apparatus and method of manufacturing the same |
| 08/13/2009 | US20090199399 Method for manufacturing board with built-in electronic elements |
| 08/13/2009 | DE202008004632U1 Verschlußsystem für einen Deckel eines Lötrahmens Closure system for a cover of a Lötrahmens |
| 08/13/2009 | DE19903585B4 Halbleitersensor und Halbleitersensorchip und Halbleitersensorgehäuse Semiconductor sensor and semiconductor sensor chip and semiconductor sensor housing |
| 08/13/2009 | DE102008008535A1 Einrichtung zur Fixierung eines elektronischen Bausteins wie Halbleiterelement Device for fixing an electronic device such as semiconductor element |
| 08/13/2009 | DE102004007333B4 Tablettüberführungsvorrichtung zum Überführung eines Transporttabletts, auf dem elektronische Bauelemente montiert sind Tray transfer device for transferring a transport trays are mounted on the electronic components |
| 08/13/2009 | CA2712381A1 Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element |
| 08/12/2009 | EP2088842A2 Electronics casing with a circuit board and method for producing an electronics casing |
| 08/12/2009 | EP2088841A2 Overmolded electronic assembly with metal seal ring |
| 08/12/2009 | EP2088840A2 Electronic component assembly |
| 08/12/2009 | EP2088839A1 Method of forming an electronic device on a substrate supported by a carrier and resultant device |
| 08/12/2009 | EP2088532A1 Flat data carrier |
| 08/12/2009 | EP2087942A1 Process for producing metal-film-coated substrate, metal-film-coated substrate, process for producing metallic-pattern material, and metallic-pattern material |
| 08/12/2009 | EP2087553A2 Multi-sector antenna |
| 08/12/2009 | EP1886544A4 Method and arrangement for protecting sensitive components by textile and product including said arrangement |
| 08/12/2009 | EP1869950A4 System and method for attaching a substantially three dimensional structure to a substantially two dimensional structure |
| 08/12/2009 | EP1859490B1 Composite films suitable for use in opto-electronic and electronic devices |
| 08/12/2009 | EP1716212B1 Overcoat lacquer |
| 08/12/2009 | EP1581385A4 High temperature resistant films and adhesive articles made therefrom |
| 08/12/2009 | EP1062634B1 Chip card equipped with a loop antenna, and associated micromodule |
| 08/12/2009 | CN201290203Y Hyper-back soldering furnace carrying tool |
| 08/12/2009 | CN201290202Y Wire jumper with device sticking on its surface and assembly thereof |
| 08/12/2009 | CN201290201Y Circuit board carrying tool |
| 08/12/2009 | CN201290200Y Leadless and non-welding circuit |
| 08/12/2009 | CN201290197Y Rigidity-flexible printed circuit board |
| 08/12/2009 | CN201289581Y Equipment for producing circuit board |
| 08/12/2009 | CN201287350Y Sheet material cutting jig |
| 08/12/2009 | CN101507374A Semiconductor device and multilayer wiring board |
| 08/12/2009 | CN101507373A Wiring board, semiconductor device using wiring board and their manufacturing methods |
| 08/12/2009 | CN101507372A Printed wiring board, method for manufacturing printed wiring board, and electric device |
| 08/12/2009 | CN101507058A Build-up printed wiring board substrate having a core layer that is part of a circuit |
| 08/12/2009 | CN101507057A Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| 08/12/2009 | CN101506906A Conductive bonding material and electronic device |
| 08/12/2009 | CN101506616A Inspection method and inspection device |
| 08/12/2009 | CN101506321A Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 08/12/2009 | CN101505576A Manufacturing method for multilayered rigidity and flexibility combined printed circuit board |
| 08/12/2009 | CN101505575A Flexible circuit based on PDMS biological compatibility |