| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/26/2009 | CN100534262C Film hole forming device and method |
| 08/26/2009 | CN100534261C Plate fitted resin molded article and method of molding it |
| 08/26/2009 | CN100534260C Connection structure for printed wiring board |
| 08/26/2009 | CN100534259C Printed wiring board and method for mounting component on the printed wiring board |
| 08/26/2009 | CN100534258C Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor |
| 08/26/2009 | CN100533694C Intermetallic spring structure |
| 08/26/2009 | CN100533603C Insulated conductive particles and an anisotropic conductive film containing the particles |
| 08/26/2009 | CN100533483C Systems and methods for detecting defects in printed solder paste |
| 08/26/2009 | CN100532449C Flexible printed circuit coating film and its preparing method |
| 08/26/2009 | CN100532087C Layer structure, its making method and its application |
| 08/26/2009 | CN100532059C Method and device for forming modularized electronic component and modularized electronic component |
| 08/25/2009 | US7580558 Screen printing apparatus |
| 08/25/2009 | US7580326 Optical pickup actuator preventing short circuit by minimizing unwanted contact between components |
| 08/25/2009 | US7580269 Apparatus for supplying power to a semiconductor device using a capacitor DC shunt |
| 08/25/2009 | US7579857 Electrical contact device of probe card |
| 08/25/2009 | US7579693 Mounting structure of ball grid array |
| 08/25/2009 | US7579553 Front-and-back electrically conductive substrate |
| 08/25/2009 | US7579308 Etching with organic ammonium compound and/or oxoammonium compound, water, and solvent |
| 08/25/2009 | US7579269 Microelectronic spring contact elements |
| 08/25/2009 | US7579251 Aerosol deposition process |
| 08/25/2009 | US7579074 A gold-coated or -impregnated substrate; aqueous gold colloid solution of a phase transfer agent, 4-dimethylaminopyridine and stabilizer, sodium 2-mercaptoethanesulfonic acid; environmentally friendly; storage stability; gloss; heat resistance; antiagglomerants; ink jet printing; catalysts; circuits |
| 08/25/2009 | US7579069 Multilayer; joining layers with different thermal expansion |
| 08/25/2009 | US7578888 Substrates, after laser structuring, are brought into contact with solution of wetting agents and compositions that support the cleaning before metallization; leads to sufficient removal of the unintentionally deposited metal seeds without having lasting damaging effect on surface |
| 08/25/2009 | US7578582 Inkjet nozzle chamber holding two fluids |
| 08/25/2009 | US7578224 Punching device and punching die for it |
| 08/25/2009 | US7578056 Method of coating contacts on a surface of a flip chip |
| 08/22/2009 | CA2654063A1 Navigation tool socket for a wireless communication device |
| 08/20/2009 | WO2009102519A1 Method and apparatus for applying an accurate print pressure during production |
| 08/20/2009 | WO2009101948A1 Etching method |
| 08/20/2009 | WO2009101874A1 Process for producing circuit wiring board |
| 08/20/2009 | WO2009101723A1 Method for manufacturing substrate with built-in electronic component |
| 08/20/2009 | WO2009101249A1 A method for improving electrical conductivity and adhesion of an electrical coupling formed in a metal foil conductor, a component binding adhesive, an electrically conductive paste and an electrically conductive coating |
| 08/20/2009 | WO2009084929A3 A multilayer film for dry film resist |
| 08/20/2009 | WO2009046468A3 Method and device for positioning and aligning an object relatively to or with a substrate and use thereof |
| 08/20/2009 | US20090209030 Thermal Cycler |
| 08/20/2009 | US20090207575 Oc2 oriented connections 2 |
| 08/20/2009 | US20090206960 High Voltage Isolation Dual Capacitor Communication System |
| 08/20/2009 | US20090206958 High Voltage Isolation Semiconductor Capacitor Digital Communication Device and Corresponding Package |
| 08/20/2009 | US20090206471 Electronic parts packaging structure and method of manufacturing the same |
| 08/20/2009 | US20090205953 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
| 08/20/2009 | US20090205862 Printed circuit board and manufacturing method thereof |
| 08/20/2009 | US20090205860 Wiring substrate, manufacturing method thereof and semiconductor package |
| 08/20/2009 | US20090205859 Method of manufacturing printed wiring board with built-in electronic component |
| 08/20/2009 | US20090205857 Printed wiring board and method for producing the same |
| 08/20/2009 | US20090205854 Printed circuit board for a package and manufacturing method thereof |
| 08/20/2009 | US20090205852 Circuit board and manufacturing method thereof |
| 08/20/2009 | US20090205204 Process for the production of a circuit portion on a substrate |
| 08/20/2009 | US20090205203 Method of mounting electronic components |
| 08/20/2009 | US20090205202 Method of manufacturing printed wiring board with built-in electronic component |
| 08/20/2009 | DE10220924B4 Sensorschaltungsmodul und elektronische Vorrichtung unter Verwendung desselben The same sensor circuit module and electronic device using |
| 08/20/2009 | DE102009008118A1 Verfahren zum Herstellen eines elektrischen Kontakts auf einer Leiterplatte A method of manufacturing an electrical contact on a printed circuit board |
| 08/20/2009 | DE102005008491B4 Leistungs-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Power semiconductor device and process for their preparation |
| 08/20/2009 | DE102004062381B4 Vorrichtung zum Umschalten eines Laserstrahls, Laserbearbeitungsvorrichtung Device for switching of a laser beam, the laser machining apparatus |
| 08/19/2009 | EP2091311A1 Wiring board and its manufacturing method |
| 08/19/2009 | EP2091310A1 Method and apparatus for simultaneous inspection and cleaning of a stencil |
| 08/19/2009 | EP2091309A2 Producing Method of Wired Circuit Board |
| 08/19/2009 | EP2091307A1 Circuit board connection structure and circuit board |
| 08/19/2009 | EP2091106A2 Retaining member, electric component and electric device |
| 08/19/2009 | EP2091078A1 Electronic component for surface mounting |
| 08/19/2009 | EP2090911A1 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
| 08/19/2009 | EP2090145A2 Use of silane compositions for the production of multilayer laminates |
| 08/19/2009 | EP2089728A1 An electric sensor web, system and a method for its manufacture |
| 08/19/2009 | EP1973742B8 Material jet system |
| 08/19/2009 | EP1259967B1 Coil assembly with a circuit board and a coil body |
| 08/19/2009 | CN201294713Y Peeling machine for IC element |
| 08/19/2009 | CN201294680Y Microwave high-frequency multi-layer circuit board |
| 08/19/2009 | CN201294679Y Superficial treatment structure of power amplifier module substrate |
| 08/19/2009 | CN201294678Y PCB batten clip |
| 08/19/2009 | CN201294181Y Film switch drop-out line |
| 08/19/2009 | CN201291319Y PCB board-splitting tool |
| 08/19/2009 | CN101513156A Electronic component mounting system and electronic component mounting method |
| 08/19/2009 | CN101513144A Printed wiring board |
| 08/19/2009 | CN101513143A Copulae structure and joioning method, wiring board and making method thereof |
| 08/19/2009 | CN101513142A Electronic component placing apparatus and electronic component mounting method |
| 08/19/2009 | CN101513141A Manufacturing method of soldered circuit board |
| 08/19/2009 | CN101513140A Device for mounting electronic component, and method |
| 08/19/2009 | CN101513139A Method and apparatuses for printing and printed product |
| 08/19/2009 | CN101512840A Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
| 08/19/2009 | CN101512758A Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor device |
| 08/19/2009 | CN101512723A Device for wetting bumps of a semiconductor chip with a liquid substance |
| 08/19/2009 | CN101512437A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| 08/19/2009 | CN101512326A Substrate inspecting apparatus |
| 08/19/2009 | CN101512325A Board appearance inspection method and device |
| 08/19/2009 | CN101511900A Epoxy resin composition for printed circuit board, resin composition Chinese varnish, preforming material, metal-coating lamination body, printed circuit board and multi-layer printed circuit board |
| 08/19/2009 | CN101511161A Solder printing inspection apparatus and component mounting system |
| 08/19/2009 | CN101511153A Electronics casing with a circuit board and method for producing an electronics casing |
| 08/19/2009 | CN101511151A Method for processing blind hole of PCB |
| 08/19/2009 | CN101511150A Gold plating technique for secondary line of PCB board |
| 08/19/2009 | CN101511149A Producing method of wired circuit board |
| 08/19/2009 | CN101511148A Method for preparing resonant cavity integrated on PCB |
| 08/19/2009 | CN101511147A Physical design for four-layer soft and hard combined board |
| 08/19/2009 | CN101510515A Circuit board, manufacturing method thereof and chip packaging structure |
| 08/19/2009 | CN101508062A Lead-free solder alloy |
| 08/19/2009 | CN101508051A Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| 08/19/2009 | CN101508048A Reflow system |
| 08/19/2009 | CN100531549C Component mounting apparatus |
| 08/19/2009 | CN100531529C Printed circuit board with embedded capacitors therein and manufacturing process thereof |
| 08/19/2009 | CN100531528C 多层印刷配线板 Multilayer printed wiring board |
| 08/19/2009 | CN100531527C Printed circuit board mask hole electroplating molding process |
| 08/19/2009 | CN100531526C Metal photo-etching product and production method therefor |