| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/02/2009 | CN101521066A TYCO electronics corp |
| 09/02/2009 | CN101520607A Double-faced exposure architecture and double-faced exposure method of printed circuit board |
| 09/02/2009 | CN101520559A Display panel having noise shielding structure |
| 09/02/2009 | CN101519184A Method for manufacturing application substrate through photo-thermal effect |
| 09/02/2009 | CN100536640C Process for creating holes of circuit assembly |
| 09/02/2009 | CN100536639C Welding substrate processing clamp and method for attaching the solder powder to electronic circuit substrate |
| 09/02/2009 | CN100536638C Method and device for reflow soldering with volume flow control |
| 09/02/2009 | CN100536637C Electrical contacting method |
| 09/02/2009 | CN100536636C Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials |
| 09/02/2009 | CN100536122C Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 09/02/2009 | CN100536101C Semiconductor device and method of manufacturing the same |
| 09/02/2009 | CN100536095C High density microvia substrate with high wireability |
| 09/02/2009 | CN100535754C Mask frame conveying device and exposure device |
| 09/02/2009 | CN100534699C Lead-free welding flux alloy |
| 09/01/2009 | US7583513 Apparatus for providing an integrated printed circuit board registration coupon |
| 09/01/2009 | US7583475 Rotating disk storage device and integrated wire head suspension assembly |
| 09/01/2009 | US7583309 Imaging device package camera module and camera module producing method |
| 09/01/2009 | US7583011 Package of surface-mountable electronic component |
| 09/01/2009 | US7582959 Driver module structure with flexible circuit board |
| 09/01/2009 | US7582955 Semiconductor device manufacturing method and manufacturing apparatus |
| 09/01/2009 | US7582333 Pattern forming method, pattern forming apparatus, method of manufacturing device, conductive film wiring, electro-optical device, and electronic apparatus |
| 09/01/2009 | US7582199 Plating method |
| 09/01/2009 | US7581668 Method and device for reflow soldering with volume flow control |
| 09/01/2009 | US7581667 Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachment |
| 09/01/2009 | US7581313 Component mounting method and mounter |
| 09/01/2009 | US7581312 Method for manufacturing multilayer flexible printed circuit board |
| 09/01/2009 | US7581311 Method for manufacturing a dielectric element |
| 09/01/2009 | US7581295 Piezoelectric element and method of manufacturing the same |
| 09/01/2009 | CA2628782C Method of forming antenna for radio frequency identification medium employing conductive paste, and method for mounting ic chip onto circuit on substrate |
| 08/27/2009 | WO2009105085A1 Metallized nanotube polymer composite (mnpc) and methods for making same |
| 08/27/2009 | WO2009105036A1 Method of making a multilayer substrate with embedded metallization |
| 08/27/2009 | WO2009104693A1 Solder bonding structure and soldering flux |
| 08/27/2009 | WO2009104668A1 Wiring board and semiconductor device |
| 08/27/2009 | WO2009104619A1 Method for the production of laminated ceramic electronic parts |
| 08/27/2009 | WO2009104599A1 Electronic apparatus, mounting board laminated body and method of manufacturing electronic apparatus and mounting board laminated body |
| 08/27/2009 | WO2009104506A1 Printed wiring board, electronic device and method for manufacturing electronic device |
| 08/27/2009 | WO2009104271A1 Method of regulating nickel concentration in lead-free solder containing nickel |
| 08/27/2009 | WO2009056235A3 Multilayer system comprising contact elements, and method for the production of a contact element for a multilayer system |
| 08/27/2009 | WO2007074941A8 Multilayer printed wiring board |
| 08/27/2009 | US20090214780 Negative Coefficient of Thermal Expansion Particles and Method of Forming the Same |
| 08/27/2009 | US20090212430 Carbon nanotube-based conductive connections for integrated circuit devices |
| 08/27/2009 | US20090211799 Printed wiring board and manufacturing method therefor |
| 08/27/2009 | US20090211798 Pga type wiring board and method of manufacturing the same |
| 08/27/2009 | US20090211794 Wiring board and manufacturing method therefor |
| 08/27/2009 | US20090211793 Substrate module, method for manufacturing substrate module, and electronic device |
| 08/27/2009 | US20090211792 Flexible Printed Circuit Assembly With Reduced Dielectric Loss |
| 08/27/2009 | US20090211791 Substrate formed on carrier having retaining features and resultant electronic device |
| 08/27/2009 | US20090211790 Connecting structure and connecting method, liquid ejection head and method of manufacturing same |
| 08/27/2009 | US20090211789 Method and Apparatus for Attaching a Flex Circuit to a Printed Circuit Board |
| 08/27/2009 | US20090211786 Process for producing polyimide film with copper wiring |
| 08/27/2009 | US20090211471 Support system and method for a screen printing unit |
| 08/27/2009 | US20090211355 Heated Hot-Film Air-Mass Sensor |
| 08/27/2009 | US20090211088 Circuit board having configurable ground link and with coplanar circuit and group traces |
| 08/27/2009 | US20090211087 Method and system for improving alignment precision of parts in mems |
| 08/27/2009 | US20090211086 Electronic component mounting method and eletronic component and mounting apparatus |
| 08/26/2009 | EP2094068A1 Printed wiring board and manufacturing method therefor |
| 08/26/2009 | EP2093794A2 Conductive ball mounting apparatus and conductive ball mounting method |
| 08/26/2009 | EP2093653A1 Electronic device display window touch input function-equipped protection panel |
| 08/26/2009 | EP2092813A1 Electrical printed circuit board comprising a terminal connection |
| 08/26/2009 | EP2092812A1 Method of producing conductive circuit board |
| 08/26/2009 | EP2092811A1 Wire-inscribed printed circuit board |
| 08/26/2009 | EP2092810A1 Installation for producing a circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound |
| 08/26/2009 | EP2092809A2 Method for printing electrically conductive circuits |
| 08/26/2009 | EP2092808A1 Product with internal cavities, and method, system and mould for manufacturing such a product |
| 08/26/2009 | EP2092806A2 Circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound and method for the production and use thereof |
| 08/26/2009 | EP2092560A1 Lead-free solder alloy for printed circuit board assemblies for high-temperature environments |
| 08/26/2009 | EP1644453B1 Palladium complexes for printing circuits |
| 08/26/2009 | EP1558923B1 Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors |
| 08/26/2009 | EP1514957B1 Method for manufacturing plated resin film |
| 08/26/2009 | CN201298967Y Positioning and welding tool for terminal of control board product |
| 08/26/2009 | CN201298966Y Surface mounting part |
| 08/26/2009 | CN201298965Y Automatic needle inserting device |
| 08/26/2009 | CN201298962Y Improved structure of circuit board |
| 08/26/2009 | CN201298959Y Flexible circuit board with reinforcing structure |
| 08/26/2009 | CN201295805Y Lead-free dip-soldering and tin-soldering adhesion hot-air cleaning mechanism |
| 08/26/2009 | CN201295689Y Dust collector of target hole drilling machine |
| 08/26/2009 | CN101518167A Lead(PB)-free electronic component attachment |
| 08/26/2009 | CN101518165A Conductor carrier and arrangement comprising a conductor carrier |
| 08/26/2009 | CN101517739A Solid-state imaging device |
| 08/26/2009 | CN101517724A Adhesive sheet sticking device and sticking method |
| 08/26/2009 | CN101517356A Inspecting apparatus |
| 08/26/2009 | CN101516624A Method and apparatus for clamping a substrate |
| 08/26/2009 | CN101516165A Printed wiring board and manufacturing method therefor |
| 08/26/2009 | CN101516164A Method for milling slot on printed circuit board |
| 08/26/2009 | CN101516163A Packaging method for combining screw to printed circuit board |
| 08/26/2009 | CN101516161A Projection PCB circuit board and manufacturing method thereof |
| 08/26/2009 | CN101516158A Circuit board with grounded screen |
| 08/26/2009 | CN101515576A Cof packaging structure, method of manufacturing the cof packaging structure, and method for assembling the cof packaging structure thereof |
| 08/26/2009 | CN101515556A Solder ball accommodating structure |
| 08/26/2009 | CN101514878A Heat exchange system for producing substrate |
| 08/26/2009 | CN101514456A Etching liquid and cuprum wiring forming method by using the same |
| 08/26/2009 | CN100534271C Method for producing printing-circuit board conducting hole |
| 08/26/2009 | CN100534270C Convex beating method for flexible printed circuit board |
| 08/26/2009 | CN100534269C Flexible cable for high-speed interconnect |
| 08/26/2009 | CN100534268C Circuit board with at least one electronic component |
| 08/26/2009 | CN100534267C Terminal-mounting method for printed circuit board, terminal mounting printed circuit board and electrical junction box |
| 08/26/2009 | CN100534266C Electronic component mounting apparatus |
| 08/26/2009 | CN100534265C Electronic part manufacturing method and base sheet |
| 08/26/2009 | CN100534264C Producing method of flexible wired circuit board |
| 08/26/2009 | CN100534263C Circuit board conductive lug structure and making method |