Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2009
09/09/2009CN101528006A Bifacial circuit board surface assembly process
09/09/2009CN101528005A Conductive circuit production process
09/09/2009CN101528004A Supporting frame and material frame provided with same
09/09/2009CN101528003A Method for laying out via hole
09/09/2009CN101528002A Method for manufacturing a printed-wiring board having resistive element inside
09/09/2009CN101528001A Flexible printed circuit board and manufacturing method for the same
09/09/2009CN101528000A Novel printed circuit board weld pad
09/09/2009CN101526299A Dewatering device for flexible circuit board
09/09/2009CN101525745A Metal surface treatment agent and printed wiring board with protecting film formed thereby
09/09/2009CN100539814C Method for manufacturing multilayer printed wiring board
09/09/2009CN100539813C Method for producing circuit-forming board and material for producing circuit-forming board
09/09/2009CN100539812C Printed-wiring board and electronic device
09/09/2009CN100539811C Method for fastly recovering circuit board, clamping and cutting circuit board block and circuit base plate
09/09/2009CN100539810C Method and device for aligning a substrate and a printing screen during solder paste printing
09/09/2009CN100539809C Method and system for delivering material onto a substrate
09/09/2009CN100539808C Method for forming printing inspection data
09/09/2009CN100539807C Backup board for machining process
09/09/2009CN100539106C Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/09/2009CN100538937C Method for manufacturing multilayer electronic component
09/09/2009CN100538919C Circuit protection device
09/09/2009CN100538451C Liquid crystal display device with improved the printed circuit board error quantity
09/09/2009CN100538347C Automatic optical detection system of membrane type or belt type printed circuit board and processing method thereof
09/09/2009CN100537689C Anisotropic conductive adhesive sheet and coupling structure
09/09/2009CN100537676C Formation of self-assembled monolayers
09/09/2009CN100537250C Electron interconnecting component element and its shaping method
09/09/2009CN100537232C Process for forming a patterned thin film structure for in-mold decoration
09/08/2009US7586758 Integrated circuit stacking system
09/08/2009US7586755 Electronic circuit component
09/08/2009US7586577 Display, method of manufacturing display and apparatus for manufacturing display
09/08/2009US7586198 Innerlayer panels and printed wiring boards with embedded fiducials
09/08/2009US7586047 Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component
09/08/2009US7585699 Semiconductor package board using a metal base
09/08/2009US7585549 Method of applying a pattern of particles to a substrate
09/08/2009US7585541 Printed wiring board and method for manufacturing the same
09/08/2009US7585540 Method for manufacturing wiring substrate
09/08/2009US7585049 Method of making an inkjet printhead
09/08/2009US7584537 Method for making a microcircuit card
09/08/2009US7584536 Process for precise alignment of packaging caps on a substrate
09/08/2009US7584535 Method of manufacturing multi-layer wiring board
09/03/2009WO2009108304A1 Methods and compositions for ink jet deposition of conductive features
09/03/2009WO2009108030A2 Printed circuit board and method of manufacturing the same
09/03/2009WO2009107760A1 Process for producing multilayer printed wiring board
09/03/2009WO2009107747A1 Wiring board and probe card
09/03/2009WO2009107357A1 Solder connecting method, electronic device and method for manufacturing same
09/03/2009WO2009107346A1 Circuit board, and circuit board manufacturing method
09/03/2009WO2009107342A1 Method for manufacturing electronic component module
09/03/2009WO2009107085A2 Led lamp and method for its design
09/03/2009WO2009106114A2 Method for producing printed circuit boards comprising fitted components
09/03/2009WO2009074264A3 Solder connection element
09/03/2009US20090222132 Paste dispenser and method for controlling the same
09/03/2009US20090221446 Polymer Replicated Interdigitated Electrode Array for (Bio) Sensing Applications
09/03/2009US20090221103 Fabrication method of semiconductor integrated circuit device
09/03/2009US20090220738 Conductive paste and multilayer printed wiring board using the same
09/03/2009US20090220683 Method of manufacturing electronic part and electronic part
09/03/2009US20090219720 Lighting
09/03/2009US20090219115 Resonant Element and Method for Manufacturing the Same
09/03/2009US20090219045 Testbed for testing electronic circuits and components
09/03/2009US20090218896 Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor
09/03/2009US20090218677 Board-on-chip type substrates with conductive traces in multiple planes, semiconductor device packages including such substrates, and associated methods
09/03/2009US20090218124 Method of filling vias with fusible metal
09/03/2009US20090218121 Method for manufacturing printed circuit board, printed circuit board, and electronic apparatus
09/03/2009US20090218118 Board and manufacturing method for the same
09/03/2009US20090218117 Flexible printed circuit board and manufacturing method for the same
09/03/2009US20090217522 Process for producing multilayer printed wiring board
09/03/2009US20090217521 Display substrate, method of manufacturing the same and display device having the same
09/03/2009US20090217520 Method for forming solder lumps on printed circuit board substrate
09/03/2009US20090217519 Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line
09/03/2009US20090217518 Device-incorporated substrate and method of manufacturing thereof as well as printed circuit board and method of manufacturing thereof
09/03/2009US20090217517 Laser-based technique for the transfer and embedding of electronic components and devices
09/03/2009US20090217516 Method for Producing Optoelectronic Components, and Products Produced Thereby
09/03/2009US20090217515 Electronic component production method and electronic component production equipment
09/03/2009DE102009004192A1 Elektronikkarte mit einer Leiterplatte und einem von der Leiterplatte getragenen Bauteil Electronic card with a circuit board and a raised from the PCB component
09/03/2009DE102008011248A1 Verfahren zur Herstellung von Leiterplatten mit bestückten Bauelementen Process for the preparation of printed circuit boards fitted with components
09/03/2009DE102008010160A1 Leiterplattenanordnung und elektrisches Anschlussmodul Printed circuit board assembly and electrical connection module
09/02/2009EP2096905A1 Process for mounting electronic and/or electro-optical devices on an electronic board
09/02/2009EP2096493A1 Photosensitive element
09/02/2009EP2096473A1 Optical/electrical mixture mounting board and method for producing the same
09/02/2009EP2095698A1 Method for the production of vias and conductor tracks
09/02/2009EP2094905A1 Heating fabric and method for fabricating the same
09/02/2009EP1785505B1 Barrier film for flexible copper substrate and sputtering target for forming barrier film
09/02/2009EP1499549B1 Sheeted roll
09/02/2009EP1294443B1 Microcurrent therapy device
09/02/2009CN201303467Y Head mechanism of profiled component inserter
09/02/2009CN201303466Y Fast machining mold for off-line circuit substrate
09/02/2009CN101524008A Component crimping apparatus control method, component crimping apparatus, and measuring tool
09/02/2009CN101524007A Method for producing structured electrically conductive surfaces
09/02/2009CN101524006A Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
09/02/2009CN101524005A An etching or plating process and resist ink
09/02/2009CN101521998A Brush-throwing machine for removing protruding ink at two ends of conducting hole of printed circuit board and removing method thereof
09/02/2009CN101521997A Method for processing grading connecting finger
09/02/2009CN101521996A Copper foil of a plated circuit, surface treating method and electroplating apparatus for producing the copper foil
09/02/2009CN101521995A Method for manufacturing circuit board module of optical indicator device
09/02/2009CN101521994A Reflow soldering shield jig for flexible circuit board
09/02/2009CN101521993A Single surface-mount device and method
09/02/2009CN101521992A Method for forming solder performs on welding spots of a circuit substrate and flip-chip method
09/02/2009CN101521991A Manufacturing method of circuit board with selectively plated copper and tin
09/02/2009CN101521990A Elongated light stripe and method for manufacturing elongated flexible circuit board
09/02/2009CN101521987A Printed circuit board, method for forming frame ground for printed circuit board, and electronic device
09/02/2009CN101521983A PCB board, mould, LED display device and preparing methods thereof
09/02/2009CN101521982A PCB board, mould, LED display device and preparing methods thereof