| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/16/2009 | CN201312409Y Inside-opened and full-flow type convex kettle opening |
| 09/16/2009 | CN201312408Y Spilling tin kettle opening with top-opened convex plate |
| 09/16/2009 | CN201312407Y Weld part |
| 09/16/2009 | CN101536620A Method for forming solder layer on printed-wiring board and slurry discharge device |
| 09/16/2009 | CN101536619A Manufacturing process: how to construct constraining core material into printed wiring board |
| 09/16/2009 | CN101536617A Circuit board connection structure and circuit board |
| 09/16/2009 | CN101534613A Method for manufacturing circuit board with offset structure |
| 09/16/2009 | CN101534612A Resistance welding superposition technology for PCB thick copper lines |
| 09/16/2009 | CN101534611A Method for manufacturing printed circuit board, printed circuit board, and electronic apparatus |
| 09/16/2009 | CN101534610A Built-in capacitor element circuit board and manufacture method thereof |
| 09/16/2009 | CN101534609A Circuit structure of circuit board and method for manufacture same |
| 09/16/2009 | CN101534608A Manufacturing method of flexible circuit board |
| 09/16/2009 | CN101534607A Routing substrate and production method thereof |
| 09/16/2009 | CN101534606A Method for producing copper-clad laminate |
| 09/16/2009 | CN101534605A Method for manufacturing high frequency copper-clad plate |
| 09/16/2009 | CN101534604A Surface-mount circuit board piece module and preparation method thereof |
| 09/16/2009 | CN101534603A Conductor used in flexible substrate, method for producing conductor, and flexible substrate |
| 09/16/2009 | CN101534600A Printed circuit board |
| 09/16/2009 | CN101534599A LED radiating substrate and manufacturing method thereof |
| 09/16/2009 | CN101533887A Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| 09/16/2009 | CN101533824A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 09/16/2009 | CN101533823A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 09/16/2009 | CN101533426A Power supply noise analysis method, system and program for electronic circuit board |
| 09/16/2009 | CN101533425A Power supply noise analysis apparatus, method and program for electronic circuit board |
| 09/16/2009 | CN101533325A Double-sided touch sensitive panel and flex circuit bonding |
| 09/16/2009 | CN101533221A Light-sensitive composition, light-sensitive film, light-sensitive laminated body, permanent pattern forming method and printing circuit board |
| 09/16/2009 | CN100542384C Method for processing printed circuit board |
| 09/16/2009 | CN100542383C Printed circuit board having fine pattern and manufacturing method thereof |
| 09/16/2009 | CN100542382C Method for producing printed wiring board |
| 09/16/2009 | CN100542381C Crimp jointing method of flexible circuit and filling layer special for said method |
| 09/16/2009 | CN100542380C Electronic component mounting method, and circuit board and circuit board unit used therein |
| 09/16/2009 | CN100542379C Substrate with embedded element and manufacturing method thereof |
| 09/16/2009 | CN100542378C Method and device for producing printed circuit board for economizing agentia and reducing pollution |
| 09/16/2009 | CN100542376C Multilayer ceramic substrate and its manufacturing method |
| 09/16/2009 | CN100542375C Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 09/16/2009 | CN100541950C Electric junction box and its assembling process |
| 09/16/2009 | CN100541916C Interconnect structure and method for connecting buried signal lines to electrical devices |
| 09/16/2009 | CN100541770C Elastic electroconductive resin and electronic device |
| 09/16/2009 | CN100540494C Crystallized glass complex and sintered crystallized glass used in circuit board |
| 09/16/2009 | CN100540318C Image-recording apparatus and method |
| 09/16/2009 | CN100540206C Solder and mounted article using same |
| 09/15/2009 | US7590357 Optical module having small stray capacitance and stray inductance |
| 09/15/2009 | US7589398 Embedded metal features structure |
| 09/15/2009 | US7589282 Wiring board and a semiconductor device using the same |
| 09/15/2009 | US7588965 Stencil and method for depositing material onto a substrate |
| 09/15/2009 | US7588710 Used for forming a pattern (a hyperfine pattern, a micro pattern, and the like) on a substrate (a silicon substrate, a ceramic substrate, a metal layer, a polymer layer and the like) in a manufacturing process of an integrated circuit or electronic device; gas permeability, high strength, flexibility |
| 09/15/2009 | US7587803 Method for assembling a camera module |
| 09/15/2009 | CA2375739C Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 09/11/2009 | WO2009111660A1 System and method of preventing damage to metal traces of flexible printed circuits |
| 09/11/2009 | WO2009110414A1 Method for forming bump |
| 09/11/2009 | WO2009110364A1 Copper surface treatment agent and surface treatment method |
| 09/11/2009 | WO2009110355A1 Mounting structure and method for manufacturing same |
| 09/11/2009 | WO2009110338A1 Method for producing ceramic substrate and ceramic substrate |
| 09/11/2009 | WO2009110286A1 Electronic component and method for manufacturing the same |
| 09/11/2009 | WO2009110259A1 Method for manufacturing multilayer printed wiring board |
| 09/11/2009 | WO2009110258A1 Multilayer printed wiring board and a method for manufacturing multilayer printed wiring board |
| 09/11/2009 | WO2009109391A1 Non-etching non-resist adhesion composition and method of preparing a work piece |
| 09/11/2009 | WO2008072930A3 Sheets for drilling |
| 09/10/2009 | US20090227153 Grouped element transmission channel link with pedestal aspects |
| 09/10/2009 | US20090227136 Mounting structure for surface mounted device and method of firmly mounting surface mounted device |
| 09/10/2009 | US20090225526 System and method for mounting shielded cables to printed circuit board assemblies |
| 09/10/2009 | US20090224785 Providing an electrically conductive wall structure adjacent a contact structure of an electronic device |
| 09/10/2009 | US20090224028 Selective soldering apparatus with jet wave solder jet and nitrogen preheat |
| 09/10/2009 | US20090223710 Method of Forming Solid Vias in a Printed Circuit Board |
| 09/10/2009 | US20090223709 Printed circuit board having adaptable wiring lines and method for manufacturing the same |
| 09/10/2009 | US20090223708 Coaxial connector mounted circuit board |
| 09/10/2009 | US20090223707 Mutual capacitance and magnetic field distribution control for transmission lines |
| 09/10/2009 | US20090223706 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby |
| 09/10/2009 | US20090223046 Method of manufacturing wiring board and method of manufacturing semiconductor package |
| 09/10/2009 | US20090223045 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby |
| 09/10/2009 | US20090223044 Method of manufacturing printed circuit board |
| 09/10/2009 | US20090223043 Test probe card space transformer |
| 09/10/2009 | DE102008013226A1 High-tensile solder connection manufacturing method for measuring instrument, involves assembling printed circuit board with surface mount device component in such manner that contact area of connection lies laminarly on soldering paste |
| 09/10/2009 | DE102008011394A1 Method for assembling electronic components of assembly building group on plastic carrier substrate, involves providing bond pad in area adjacent to contact area or in contact area with fastening recess |
| 09/10/2009 | DE102004056466B4 Wärmeisolierungselement für eine Schaltungsanordnung Heat insulation element for a circuit arrangement |
| 09/09/2009 | EP2099269A1 Solderable elastic electric contact terminal |
| 09/09/2009 | EP2099268A1 Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate |
| 09/09/2009 | EP2099267A1 Method for manufacturing metallized ceramic substrate chip |
| 09/09/2009 | EP2099120A2 Power converter |
| 09/09/2009 | EP2098562A1 Light-activatable polymer compositions |
| 09/09/2009 | EP2098104A1 An electronic device and method of assembling an electronic device |
| 09/09/2009 | EP2098103A1 A surface-mountable waveguide arrangement |
| 09/09/2009 | EP2097246A1 Method and apparatus for making partially coated products |
| 09/09/2009 | EP1761951A4 Lead solder indicator and method |
| 09/09/2009 | EP1232677B1 Flip chip package, circuit board thereof and packaging method thereof |
| 09/09/2009 | CN201307973Y Circuit board assembly structure for fastening board bodies through pressing manner |
| 09/09/2009 | CN201307972Y PCB board via-hole oil plugging device |
| 09/09/2009 | CN201307971Y Laminating fixture |
| 09/09/2009 | CN101530014A Multilayer printed wiring board and method for manufacturing the same |
| 09/09/2009 | CN101530013A Electronic circuit board |
| 09/09/2009 | CN101530012A Method of packaging a device using a dielectric layer |
| 09/09/2009 | CN101530011A Method for manufacturing metallized ceramic substrate chip |
| 09/09/2009 | CN101530010A Methods of patterning a material on polymeric substrates |
| 09/09/2009 | CN101530009A Support board for perforation processing and method of perforation processing |
| 09/09/2009 | CN101530008A Support board for perforation processing and method of perforation processing |
| 09/09/2009 | CN101528011A Manufacturing method for interconnected multilayer circuit board by copper cylinder method |
| 09/09/2009 | CN101528010A Method for manufacturing circuit structure |
| 09/09/2009 | CN101528009A Method for manufacturing circuit structure |
| 09/09/2009 | CN101528008A Circuit board and manufacturing method thereof |
| 09/09/2009 | CN101528007A Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof |