| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/23/2009 | CN100544541C Method for producing circular inclined light lighting device and flexible circuit base board |
| 09/23/2009 | CN100543983C Method of manufacturing a circuit board layer on substrate surface |
| 09/23/2009 | CN100543884C Method for producing an electrical conductor element and electric conductor element |
| 09/23/2009 | CN100543752C Printed circuit board return route check method and printed circuit board pattern design CAD device |
| 09/23/2009 | CN100543195C Electroplating on composite substrates |
| 09/23/2009 | CN100542692C Coating metal particles |
| 09/22/2009 | US7593208 Multi-functional energy conditioner |
| 09/22/2009 | US7592276 Woven electronic textile, yarn and article |
| 09/22/2009 | US7592250 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
| 09/22/2009 | US7591969 Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained |
| 09/22/2009 | US7591921 heat decaying polymer containing a polyoxyalkylene resin as the principal ingredient formed by crosslinking a crosslinkable group containing hydrolyzing silyl group, an epoxy group, an acid anhydride group, a carboxyl group, a hydroxyl group; a decomposition promoter (SnO2 ) |
| 09/22/2009 | US7591069 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 09/22/2009 | US7591068 Board positioning method |
| 09/22/2009 | CA2399041C Printed circuit board |
| 09/17/2009 | WO2009113797A2 Production method for a circuit board using a gas column |
| 09/17/2009 | WO2009113602A1 Method for manufacturing a resin substrate and a resin substrate |
| 09/17/2009 | WO2009113475A1 Glass ceramic composition, glass ceramic sinter and laminated type ceramic electronic component |
| 09/17/2009 | WO2009113396A1 Method of treating surface of copper and method of treating surface of printed wiring board |
| 09/17/2009 | WO2009113380A1 Method for smoothing electrode, method for producing ceramic substrate and ceramic substrate |
| 09/17/2009 | WO2009113312A1 Semiconductor device design system, semiconductor device manufacturing method, semiconductor device, and substrate bonding device |
| 09/17/2009 | WO2009113202A1 Flexible wiring board, and its manufacturing method |
| 09/17/2009 | WO2009112658A2 Thermal safety device |
| 09/17/2009 | WO2009094537A3 Nanoscale metal paste for interconnect and method of use |
| 09/17/2009 | US20090234605 Power supply noise analysis method, system and program for electronic circuit board |
| 09/17/2009 | US20090234602 Power supply noise analysis method, apparatus and program for electronic circuit board |
| 09/17/2009 | US20090233467 Circuit board connector assembly and method for assembling such an assembly |
| 09/17/2009 | US20090233466 Surface-mounted circuit board module and process for fabricating the same |
| 09/17/2009 | US20090233461 Method of Manufacturing a Printed Circuit Board |
| 09/17/2009 | US20090233120 Laminate and Process for Producing the Same |
| 09/17/2009 | US20090233098 Cerium oxide nanoparticles |
| 09/17/2009 | US20090232972 Method for the production of a metal-ceramic substrate |
| 09/17/2009 | US20090231822 Device, in particular intelligent power module with planar connection |
| 09/17/2009 | US20090231816 System and method of preventing damage to metal traces of flexible printed circuits |
| 09/17/2009 | US20090231798 Method and housing for memory module including battery backup |
| 09/17/2009 | US20090230196 Rfid tag and method of fabricating an rfid tag |
| 09/17/2009 | US20090230171 Device for mounting electric component |
| 09/17/2009 | US20090229876 Flexible wiring board and method of manufacturing same |
| 09/17/2009 | US20090229872 Electronic component built-in board, manufacturing method of electronic component built-in board, and semiconductor device |
| 09/17/2009 | US20090229870 Block copolymerized polyimide ink composition for printing |
| 09/17/2009 | US20090229867 Method for manufacturing a printed circuit board element as well as a printed circuit board element |
| 09/17/2009 | US20090229860 Green sheet for multi-layered electronics parts and manufacturing method for green chip using the same |
| 09/17/2009 | US20090229762 Manufacturing method of boards, mold-releasing sheet, manufacturing apparatus for board |
| 09/17/2009 | US20090229122 Analyte sensors and methods |
| 09/17/2009 | US20090229121 Method for manufacturing multilayer printed circuit boards |
| 09/17/2009 | US20090229120 Bump forming method and bump forming apparatus |
| 09/17/2009 | US20090229118 Electronics Assembly Machine with Wireless Communication Nozzle |
| 09/17/2009 | DE102008013408A1 Shuntwiderstand mit Messschaltung Shunt resistor with measuring circuit |
| 09/17/2009 | DE102004019878B4 Verfahren zur Herstellung einer Haftschicht auf einer Kupferoberfläche durch Abscheiden einer Zinnlegierung und daraus gebildetes schichtförmiges Produkt A process for producing an adhesive layer on a copper surface by depositing a tin alloy and formed therefrom layered product |
| 09/16/2009 | EP2101556A2 Light transmitting electromagnetic wave shielding film and plasma display panel using the shielding film |
| 09/16/2009 | EP2101552A2 Electronic device and on-vehicle module |
| 09/16/2009 | EP2101551A1 Piezoelectric Oscillator and a method of manufacturing the same |
| 09/16/2009 | EP2101406A1 Piezoelectric Oscillator and a method of manufacturing the same |
| 09/16/2009 | EP2100690A1 Flux for lead-free solder and method of soldering |
| 09/16/2009 | EP2100486A1 Method of producing conductive circuit board |
| 09/16/2009 | EP2099954A1 Device and method for electroplating |
| 09/16/2009 | EP2099612A1 Printing system with conductive element |
| 09/16/2009 | EP2099580A1 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
| 09/16/2009 | EP1725978B1 Polymeric film substrate for use in radio-frequency responsive tags |
| 09/16/2009 | EP1603722B1 Breaking device for separating ceramic printed circuit boards |
| 09/16/2009 | EP1576536B1 A tamper-indicating rfid antenna |
| 09/16/2009 | EP1345481B1 Reflow soldering apparatus and reflow soldering method |
| 09/16/2009 | EP1207730B1 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
| 09/16/2009 | CN201312447Y Multilayer circuit board |
| 09/16/2009 | CN201312446Y Outflow quarto-type kettle spout |
| 09/16/2009 | CN201312445Y Cylindrical independent kettle spout |
| 09/16/2009 | CN201312444Y Combined-type kettle spout with flanges on side |
| 09/16/2009 | CN201312443Y Avoiding kettle spout with tin-blocking plate inside |
| 09/16/2009 | CN201312442Y Boss lateral tin-spilling kettle spout |
| 09/16/2009 | CN201312441Y Inflow double-opening kettle spout |
| 09/16/2009 | CN201312440Y Plug-type shortened kettle spout |
| 09/16/2009 | CN201312439Y Fixed plug-type kettle spout |
| 09/16/2009 | CN201312438Y Single-opening avoiding-type kettle spout |
| 09/16/2009 | CN201312437Y Concave double-side opening kettle spout with tin-blocking plates |
| 09/16/2009 | CN201312436Y Double-side opening kettle spout with tin-blocking plate |
| 09/16/2009 | CN201312435Y Lateral tin-spilling temperature compensation kettle spout |
| 09/16/2009 | CN201312434Y Tin-spilling kettle spout with flanges on lateral surface |
| 09/16/2009 | CN201312433Y L-shaped upflow kettle spout with flange |
| 09/16/2009 | CN201312432Y Fixed kettle opening of kettle spout |
| 09/16/2009 | CN201312431Y Fixed-type shortened kettle spout |
| 09/16/2009 | CN201312430Y Fixed-type kettle spout |
| 09/16/2009 | CN201312429Y Fixed plug-type kettle spout with outside block |
| 09/16/2009 | CN201312428Y Fixed-type lengthened kettle spout with flange |
| 09/16/2009 | CN201312427Y Ground block element avoiding sheet kettle spout |
| 09/16/2009 | CN201312426Y Ground block element avoiding concave-shaped kettle spout |
| 09/16/2009 | CN201312425Y L-shaped upflow side-stream kettle spout |
| 09/16/2009 | CN201312424Y Combined part type kettle spout |
| 09/16/2009 | CN201312423Y Double-side straddle part avoiding-type kettle spout |
| 09/16/2009 | CN201312422Y Double-opening part avoiding-type kettle spout |
| 09/16/2009 | CN201312421Y Combined in-row-plugged kettle opening |
| 09/16/2009 | CN201312420Y Single-row-plugged kettle opening |
| 09/16/2009 | CN201312419Y Chip element avoiding single-opened kettle opening |
| 09/16/2009 | CN201312418Y Chip element avoiding closed type kettle opening |
| 09/16/2009 | CN201312417Y Single-opened and full-closed type kettle opening |
| 09/16/2009 | CN201312416Y Outside block plug-type kettle opening |
| 09/16/2009 | CN201312415Y Single-side straddle type part avoiding-type kettle opening |
| 09/16/2009 | CN201312414Y Plug-type kettle opening |
| 09/16/2009 | CN201312413Y Plug-type short kettle opening with flange |
| 09/16/2009 | CN201312412Y Lengthened inserting-type kettle opening with resisting sides |
| 09/16/2009 | CN201312411Y Single-opened and semi-closed kettle opening |
| 09/16/2009 | CN201312410Y Inside-flow and full-opened type kettle opening |