| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/30/2009 | CN101546133A Exposure device and an exposure method |
| 09/30/2009 | CN101544863A Resin composition for printed circuit board, dry film and printed circuit board |
| 09/30/2009 | CN101544784A Photocurable resin composition, dry film and cured object thereof, and printed circuit board with the same |
| 09/30/2009 | CN100546442C A making method for multi-layer flexible circuit board |
| 09/30/2009 | CN100546441C Manufacturing method of multi-layer flexible circuit board |
| 09/30/2009 | CN100546440C A multilayer circuit board and its manufacture method |
| 09/30/2009 | CN100546439C Electroplating technique for thickening mask hole cuprum of printed circuit board |
| 09/30/2009 | CN100546438C Circuit substrate and manufacturing method thereof |
| 09/30/2009 | CN100546437C Regenerating method for welding tool |
| 09/30/2009 | CN100546436C Method of sharing tin stealing bonding pad |
| 09/30/2009 | CN100546435C Forming method for resin layer of metal layer, printed wiring board and its manufacturing method |
| 09/30/2009 | CN100546434C A board stacking method pressed by flexible PCB and its board stacking structure |
| 09/30/2009 | CN100546433C Wiring board, multilayer wiring board, and method for manufacturing the same |
| 09/30/2009 | CN100546432C Flexible printed circuit board manufacturing method |
| 09/29/2009 | US7595991 Using the wave soldering process to attach motherboard chipset heat sinks |
| 09/29/2009 | US7595550 Flex-based circuit module |
| 09/29/2009 | US7595362 Polyphenylene ethers; improved chemical resistance, dielectric, low water-absorption, heat resistance, flame retardance, and mechanical properties; laminates |
| 09/29/2009 | US7595289 Hydrofluorocarbons, secondary butanol, and diemethylsulfoxide |
| 09/29/2009 | US7595228 Method for manufacturing electronic component-mounted board |
| 09/29/2009 | US7594740 Mounting arrangement for light emitting diodes |
| 09/29/2009 | US7594322 Methods of fabricating substrates including at least one conductive via |
| 09/29/2009 | US7594321 Substrate-imprinting methods |
| 09/29/2009 | US7594320 Method of manufacturing printed wiring board |
| 09/29/2009 | US7594319 Electronic-component alignment method |
| 09/29/2009 | US7594318 Multilayer circuit board with embedded components and method of manufacture |
| 09/29/2009 | US7594317 Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure |
| 09/29/2009 | US7594316 Method of manufacturing composite electronic component |
| 09/24/2009 | WO2009117734A1 Adhesion promotion of metal to laminate with a multi-functional compound haftforderung von metall zu laminaten mit einer multifunktionellen |
| 09/24/2009 | WO2009117515A2 Novel compounds advantageous in the treatment of central nervous system diseases and disorders |
| 09/24/2009 | WO2009117027A1 Electronic assemblies without solder having overlapping components |
| 09/24/2009 | WO2009116934A1 Substrate integrated waveguide |
| 09/24/2009 | WO2009116685A1 Re-releasable process film |
| 09/24/2009 | WO2009116609A1 Resin composition and cured film thereof |
| 09/24/2009 | WO2009116426A1 Electronic component and method for manufacturing the same |
| 09/24/2009 | WO2009116401A1 Photosensitive resin composition, and photosensitive element, solder resist and printed wiring board each using the composition |
| 09/24/2009 | WO2009116336A1 Screen printing plate and method for producing the same |
| 09/24/2009 | WO2009116185A1 Composite silver nanopaste, process for production thereof, method of connection and pattern formation process |
| 09/24/2009 | WO2009116182A1 Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
| 09/24/2009 | WO2009115796A1 Imaging system and method for alignment |
| 09/24/2009 | WO2009115686A2 Connection component with hollow inserts and method for making same |
| 09/24/2009 | WO2009115069A2 Method for producing circuit carriers |
| 09/24/2009 | WO2009048604A3 Robust multi-layer wiring elements and assemblies with embedded microelectronic elements |
| 09/24/2009 | WO2009030409A3 Method for producing a solar cell |
| 09/24/2009 | US20090238956 Manufacturing method of a wiring board containing a seed layer having a roughened surface |
| 09/24/2009 | US20090238954 Large area thin film capacitors on metal foils and methods of manufacturing same |
| 09/24/2009 | US20090237899 Semiconductor package with embedded magnetic component and method of manufacture |
| 09/24/2009 | US20090237895 Flexible Paddle Card For Installation On A Motherboard Of A Computing System |
| 09/24/2009 | US20090237456 Inkjet Printhead With Paddle For Ejecting Ink From One Of Two Nozzles |
| 09/24/2009 | US20090236139 Printed wiring board assembly and related methods |
| 09/24/2009 | US20090236138 Multilayer wiring board and method of manufacturing the same |
| 09/24/2009 | US20090236136 Printed circuit board assembly |
| 09/24/2009 | US20090236131 Multilayered printed circuit board and method of manufacturing the same |
| 09/24/2009 | US20090236130 Multilayered printed circuit board and method of manufacturing the same |
| 09/24/2009 | US20090236128 Printed wiring board with resin complex layer and manufacturing method thereof |
| 09/24/2009 | US20090236125 Multi-layer board and manufacturing method thereof |
| 09/24/2009 | US20090236024 Method of manufacturing wiring substrate, and method of manufacturing semiconductor device |
| 09/24/2009 | DE202008007028U1 Leiterplatte für eine Lötverbindung Circuit board for solder |
| 09/24/2009 | DE112007003001T5 Leiterplatte und Verfahren für deren Herstellung Printed circuit board and process for production thereof |
| 09/24/2009 | DE102008014822A1 Printed circuit board arrangement, has connection part provided with set of connecting sections, where connecting sections are inserted into corresponding push through openings of printed circuit boards by hot pressing |
| 09/24/2009 | DE102008014742A1 Arrangement for flip-chip-dry construction, has integrated switching circuit with multiple solder contact elements and support, on which integrated switching circuit is positioned |
| 09/24/2009 | DE102008014690A1 Verfahren zur Herstellung von Schaltungsträgern A process for producing circuit carriers |
| 09/24/2009 | DE102006012291B4 Bohrvorrichtung zum Bohren von Löchern in Leiterplatten für elektronische Geräte, Apparate und Einrichtungen Drilling apparatus for drilling holes in printed circuit boards for electronic appliances, apparatus and equipment |
| 09/23/2009 | EP2104408A1 Multilayer circuit board and motor drive circuit board |
| 09/23/2009 | EP2103661A1 Palladium Complexes For Printing Circuits |
| 09/23/2009 | EP2103373A1 Welding device for connecting solar cells |
| 09/23/2009 | EP2101996A1 Translucent panel for connecting electronic components |
| 09/23/2009 | EP2101949A1 Device and method for selective soldering |
| 09/23/2009 | CN201315705Y Printed circuit board with fastener |
| 09/23/2009 | CN201315704Y PCB board silk screen printing plate |
| 09/23/2009 | CN101543152A Method for manufacturing substrate with built-in component and substrate with built-in component |
| 09/23/2009 | CN101543151A Multilayered ceramic substrate, process for producing the multilayered ceramic substrate, and electronic component |
| 09/23/2009 | CN101543150A Multilayer-wired substrate |
| 09/23/2009 | CN101543149A Circuit board and method for manufacturing the same |
| 09/23/2009 | CN101543148A Lead terminal bonding method and printed circuit board |
| 09/23/2009 | CN101543147A Wiring board and display unit |
| 09/23/2009 | CN101543146A Image formation device, image formation method, pattern formation system, and pattern formation method |
| 09/23/2009 | CN101541145A Processing method of ultra-thin core board in manufacturing of printed circuit board or integrated circuit package substrate |
| 09/23/2009 | CN101541144A Circuit board transferring system and circuit board transferring method |
| 09/23/2009 | CN101541143A Printed circuit board and electronic device |
| 09/23/2009 | CN101541142A Surface disposed copper foil and circuit foundation plate |
| 09/23/2009 | CN101541141A Printed circuit board and method for avoiding electric short circuit |
| 09/23/2009 | CN101540435A S waveband arborization left-handed material microstrip antenna |
| 09/23/2009 | CN101540303A 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers |
| 09/23/2009 | CN101539955A Layout method for circuit design |
| 09/23/2009 | CN101538727A PCB pore point electroplating method |
| 09/23/2009 | CN101538715A Flexible circuit board etching liquid concentration control device |
| 09/23/2009 | CN101537505A Small-aperture high-density drilling method of printed circuit board |
| 09/23/2009 | CN100544576C Solder joint determination method, solder inspection method, and solder inspection device |
| 09/23/2009 | CN100544559C Via transmission lines for multilayer printed circuit boards |
| 09/23/2009 | CN100544558C 多层印刷配线板 Multilayer printed wiring board |
| 09/23/2009 | CN100544557C Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
| 09/23/2009 | CN100544556C Multilayer printed circuit board and manufacture method thereof |
| 09/23/2009 | CN100544555C Multilayer printed circuit board and method for its manufacturing |
| 09/23/2009 | CN100544554C Encapsulation method of dual base board electronic module for the radio communication |
| 09/23/2009 | CN100544553C Method and device for fixing element on substrate |
| 09/23/2009 | CN100544552C Method and apparatus for mounting a component |
| 09/23/2009 | CN100544551C Method for producing conductive pattern material |
| 09/23/2009 | CN100544550C Manufacturing method of circuit board encapsulated by accumulation circuit |
| 09/23/2009 | CN100544549C Auxiliary designing system and method for circuit board |
| 09/23/2009 | CN100544543C Printed circuit board substrate and method for constructing same |