Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2009
10/06/2009US7599190 High-frequency module, and method of producing same
10/06/2009US7598621 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
10/06/2009US7598124 System and method to increase die stand-off height
10/06/2009US7598008 configuring a multiple channel imaging head; produce a color filter; reduce the visual banding occurring at swath boundaries; no boundary occur within a visible portion of an imaged feature
10/06/2009US7597933 Coating a plastic substrate with a fluid containing a conductive metal powder and pressure-treating; polishing the coating to prevent dust from forming; electroless- or electrodeposition to plate and fix the image; labels; markings; shields to protect from electromagnetic waves
10/06/2009US7597561 Method and system for batch forming spring elements in three dimensions
10/06/2009US7596864 Stacked module connector
10/06/2009US7596863 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
10/06/2009US7596862 Method of making a circuitized substrate
10/06/2009CA2529430C Biosensor and method of making
10/01/2009WO2009119877A1 Method of manufacturing wiring board, method of manufacturing optoelectric composite member, and method of manufacturing optoelectric composite board
10/01/2009WO2009119875A1 Component-incorporating wiring board
10/01/2009WO2009119745A1 Wiring board, semiconductor package and method of fabricating wiring board
10/01/2009WO2009119680A1 Printed wiring board and method for producing the same
10/01/2009WO2009119600A1 Method for manufacturing wiring board and wiring board
10/01/2009WO2009119598A1 Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board, and semiconductor device
10/01/2009WO2009119562A1 Multilayer printed wiring board
10/01/2009WO2009119457A1 Beam processing apparatus, beam processing method, and beam processing substrate
10/01/2009WO2009119324A1 Anisotropic conductive film, joined structure and method for producing the same
10/01/2009WO2009119199A1 Method for producing multilayer ceramic substrate and composite sheet
10/01/2009WO2009119198A1 Process for producing ceramic substrate
10/01/2009WO2009119077A1 Electronic circuit board and power line communication device using the same
10/01/2009WO2009119046A1 Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
10/01/2009WO2009119027A1 Method for producing rigid-flex circuit board, and rigid-flex circuit board
10/01/2009WO2009118999A1 Semiconductor device, multilayer wiring board and method for manufacturing semiconductor device
10/01/2009WO2009118976A1 Ink-jet ink composition for etching resist
10/01/2009WO2009118950A1 Method for manufacturing multilayer printed wiring board
10/01/2009WO2009118935A1 Flex-rigid wiring board and method for manufacturing the same
10/01/2009WO2009118925A1 Circuit board having built-in electronic parts and its manufacturing method
10/01/2009WO2009118468A2 Connection component provided with inserts comprising compensating blocks
10/01/2009WO2009118455A1 Method for manufacturing laminated circuit board
10/01/2009WO2009118249A1 Method for the production of an electronic assembly
10/01/2009WO2009117991A1 Component carrier for electrical/electronic components and associated manufacturing method
10/01/2009WO2009117979A1 Method and device for machining a printed circuit board
10/01/2009WO2009086146A3 Plated dielectric frame with integrated connector
10/01/2009US20090248343 Apparatus, method and program for design validity verification of electronic circuit board with regard to power supply noise suppression
10/01/2009US20090246988 Contact structure and forming method thereof and connecting structure thereof
10/01/2009US20090246911 Substrate for mounting electronic components and its method of manufacture
10/01/2009US20090246358 Conductive silver dispersions and uses thereof
10/01/2009US20090246357 Method of forming circuits on circuit board
10/01/2009US20090244865 Method for manufacturing multilayer printed wiring board
10/01/2009US20090244850 Thermal interface material for combined reflow
10/01/2009US20090243781 Method of manufacturing a conductor circuit, and a coil sheet and laminated coil
10/01/2009US20090243763 Transmission line and a method for production of a transmission line
10/01/2009US20090243076 Electronic system modules and method of fabrication
10/01/2009US20090242506 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
10/01/2009US20090242411 Polyimide-metal laminated body and polyimide circuit board
10/01/2009US20090242262 Multi-layer wiring board and method of manufacturing the same
10/01/2009US20090242261 Printed wiring board and associated manufacturing methodology
10/01/2009US20090242259 Printed circuit board and method of manufacturing the same
10/01/2009US20090242258 Electronic device package with connection terminals including uneven contact surfaces
10/01/2009US20090242252 Method for Manufacturing A Multilayer Printed Wiring Board for Providing an Electronic Component Therein
10/01/2009US20090242251 Embedded printed circuit board and manufacturing method thereof
10/01/2009US20090242247 Package substrate and die spacer layers having a ceramic backbone
10/01/2009US20090242246 Printed circuit board and method for manufacturing same
10/01/2009US20090242243 Printed circuit board and method for fabricating a printed circuit board
10/01/2009US20090242242 Electronic component mounting board, method for manufacturing the same and electronic circuit unit
10/01/2009US20090242241 Flex-rigid wiring board and method of manufacturing same
10/01/2009US20090242239 process for preparing a heatsink system and heatsink system obtainable by said process
10/01/2009US20090242236 Method of forming conductive tracks
10/01/2009US20090241538 Electronic Device Including Circuit Board with Radiating Member, Hydraulic Unit Including the Electronic Device, and Method of Fixing the Radiating Member to the Circuit Board
10/01/2009US20090241334 Metallization forming method
10/01/2009US20090241333 Method for manufacturing printed circuit board having different thicknesses in different areas
10/01/2009US20090241332 Circuitized substrate and method of making same
10/01/2009DE102009014582A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
09/2009
09/30/2009EP2104750A2 Method and device for spraying on particularly a conductor, electric component comprising a conductor, and metering device
09/30/2009EP1486105B1 Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board
09/30/2009CN201319703Y Flexible and rigid composite circuit board structure
09/30/2009CN201319702Y Tin wave height testing device of wave crest brazing furnace
09/30/2009CN201319701Y Tinning steel mesh
09/30/2009CN201319700Y Tinning steel mesh for surface attachment of ball grid array structure integrated circuits
09/30/2009CN201319699Y Tinning steel mesh for surface attachment of ball grid array structure integrated circuits
09/30/2009CN201319698Y Steel mesh transforming frame
09/30/2009CN201319697Y Feeding auxiliary device
09/30/2009CN201319696Y Printed circuit board (PCB) carrier
09/30/2009CN101548588A Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier
09/30/2009CN101548587A Method for printing electrically conductive circuits
09/30/2009CN101547574A Base plate of a circuit board and a preparing method of a circuit board with a misalignment structure
09/30/2009CN101547573A Method for manufacturing circuit board with offset structure
09/30/2009CN101547572A Multilayer wiring board, multilayer wiring board unit, and electronic device
09/30/2009CN101547571A Multilayer flexible printed wiring plate and manufacturing method thereof
09/30/2009CN101547570A Method for balancing stress of multi-layer substrate and multi-layer substrate
09/30/2009CN101547569A Technology for processing semi-hole of PCB board
09/30/2009CN101547568A Method for printing black soldermask on PCB board
09/30/2009CN101547567A Method for producing conductive circuit
09/30/2009CN101547566A Positioning and assembling method for printed circuit board machine board
09/30/2009CN101547565A Guidance tool of circuit board
09/30/2009CN101547564A Pasting device
09/30/2009CN101547563A Closed loop backdrilling system
09/30/2009CN101547562A Closed loop backdrilling system
09/30/2009CN101547561A Closed loop backdrilling system
09/30/2009CN101547560A Repairing binding method for printed circuit board finished product with multi-plate typesetting
09/30/2009CN101547559A Flexible copper clad laminate
09/30/2009CN101547554A Multi-functional flexible conductor circuit board and production method thereof
09/30/2009CN101547552A Printed circuit board
09/30/2009CN101547551A Printed circuit board and method for fabricating a printed circuit board
09/30/2009CN101546759A Method for manufacturing an electronic module and an electronic module
09/30/2009CN101546745A Chip interconnect swizzle mechanism
09/30/2009CN101546740A Embedded printed circuit board and manufacturing method thereof
09/30/2009CN101546353A Apparatus, method and program for design validity verification of electronic circuit board with regard to power supply noise suppression