Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2009
10/21/2009CN101563651A Photosensitive element
10/21/2009CN101563230A Printing system with conductive element
10/21/2009CN101563181A Device and method for selective soldering
10/21/2009CN101562953A Multilayer board and its manufacturing method
10/21/2009CN101562952A Circuit substrate, manufacture method of circuit substrate and manufacture method of circuit wafer
10/21/2009CN101562951A Circuit board and manufacture method thereof
10/21/2009CN101562950A Production method of suspension board with circuit
10/21/2009CN101562949A Manufacturing method of rigid-flexible plate
10/21/2009CN101562948A Electric connector and method for assembling same on circuit board
10/21/2009CN101562947A Welding structure and welding method
10/21/2009CN101562946A Method of manufacturing wiring circuit board
10/21/2009CN101562945A Buried line structure and manufacture method thereof
10/21/2009CN101562944A Circuit board and manufacturing technology thereof
10/21/2009CN101562943A Method for melting nickel alloy by selective ink instead of dry film
10/21/2009CN101562942A Assembling method based on die for processing PCB to improve utilization ratio of plates
10/21/2009CN101562941A Cover pore structure of printed circuit board
10/21/2009CN101562939A Flexible circuit board
10/21/2009CN101562275A Thin-film antenna composite construction and manufacture method thereof
10/21/2009CN101562170A Suspension board with circuit and production method thereof
10/21/2009CN101562169A Lamination type base plate and chip packaging structure using same
10/21/2009CN100553419C Method of mounting thumbwheel switch on printed circuit board and handheld electronic device incorporating same
10/21/2009CN100553414C Manufacturing method for multi-layer high-density interconnected printed circuit board
10/21/2009CN100553413C Ceramic multilayer substrate
10/21/2009CN100553412C Method of producing module with embedded component and module with embedded component
10/21/2009CN100553411C Multilayer printed circuit board and manufacture method
10/21/2009CN100553410C Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board and metal sheet for producing wiring board
10/21/2009CN100553409C Wiring circuit substrate
10/21/2009CN100553408C Substrate with embedded element and manufacturing method thereof
10/21/2009CN100553407C Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace
10/21/2009CN100553406C Method of forming an integrated circuit substrate
10/21/2009CN100553405C Method for making circuit board
10/21/2009CN100553404C Assembly for exposure of two-side printed circuit board and apparatus with the exposure assembly
10/21/2009CN100553403C Electronic parts mounting structure
10/21/2009CN100553402C Printed circuit board for mounting a quad flat package IC
10/21/2009CN100552936C Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
10/21/2009CN100552934C Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
10/21/2009CN100552929C Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus and wiring substrate
10/21/2009CN100552544C Exposure device and positioning method
10/21/2009CN100552542C Patterning layers comprised of spin-on ceramic films
10/21/2009CN100552439C Printed circuit board checking device
10/21/2009CN100552085C Plating material, polyamic acid solution and polyimide resin solution which are used to form the plating material, and printed wiring board using them
10/21/2009CN100551691C Method and apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
10/21/2009CN100551687C Super-thin copper foil with carrier, its manufacture method and printed wiring base plate
10/21/2009CN100551607C Printed circuit board contour processing method
10/21/2009CN100551604C Solder paste and electronic device using same
10/21/2009CN100551598C Conductive ball mounting method, and apparatus therefor
10/20/2009US7606048 Integrated circuit stacking system
10/20/2009US7604922 Reciprocating device; mercury lamps
10/20/2009US7604868 Interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; superior low temperature rapid curability and a long pot life
10/20/2009US7604835 Resist pattern for metalization; catalyst on substrate exposed to vacuum ultraviolet radiation to break carbon to carbon double bonds; washed with surfactant to clean surface before metalization
10/20/2009US7604833 Circuit elements formed on a ceramic substrate surface and conductive balls are used as electronic part terminals; using rubber buffers having a concave part to house the balls to protect them when stress is applied tothe substrate to open surface division grooves to divide the substrate; chip resistor
10/20/2009US7604154 Thermosetting flux and solder paste
10/20/2009US7604153 Forming solder balls on substrates
10/20/2009US7604152 Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
10/20/2009US7603772 Methods of fabricating substrates including one or more conductive vias
10/20/2009US7603769 Method of coupling a surface mount device
10/15/2009WO2009126544A1 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
10/15/2009WO2009125845A1 Method for manufacturing flexible wiring board
10/15/2009WO2009125752A1 Photosensitive resin composition, and photosensitive resin laminate comprising the same
10/15/2009WO2009125601A1 Flow soldering apparatus and flow soldering method
10/15/2009WO2009125550A1 Electronic part mounting apparatus, and trial application device for viscous substance
10/15/2009WO2009124522A1 Shielding device of a plug connection for a vehicle and method for the production thereof
10/15/2009US20090257617 Speaker, voice coil unit, and method of manufacturing the voice coil unit
10/15/2009US20090256820 Display device, liquid crystal display device, electronic apparatus, and display device manufacturing method
10/15/2009US20090255722 Printed circuit board having landless via hole and method of manufacturing the same
10/15/2009US20090255715 Controlling Impedance and Thickness Variations for Multilayer Electronic Structures
10/15/2009US20090255111 Multilayer printed wiring board
10/15/2009DE202009008846U1 Vorrichtung, insbesondere Druckschablone, zur Verwendung bei der Leiterplattenbestückung Device, in particular stencil for use in printed circuit board assembly
10/15/2009DE102008018886A1 Assembly part manufacturing method for use during manufacturing of e.g. micro switch, involves positioning component at another component in carrier such that former component is fastened at latter component and is separated from carrier
10/15/2009DE102008017157A1 Contact element for contacting printed circuit board in e.g. motor vehicle, has metallic foam thermally and electrically contacting printed circuit board and including metals e.g. aluminum, where contact element is deformable
10/15/2009DE102008016340B3 Verfahren und Vorrichtung zur Bearbeitung einer Leiterplatte Method and apparatus for processing a printed circuit board
10/14/2009EP2109350A1 System for creating fine lines using inkjet technology
10/14/2009EP2109349A1 Printed circuit board with a conductive connection
10/14/2009EP2109141A1 Printed circuit board with a conductive connection
10/14/2009EP2108239A1 Process for producing electrically conductive surfaces
10/14/2009EP1821586B1 Printed board and printed board manufacturing method
10/14/2009EP1678992B1 Method for reflow soldering with volume flow control
10/14/2009EP1354502B1 High frequency printed circuit board via
10/14/2009EP0828815B1 Azeotrope-like compositions and their use
10/14/2009CN201328221Y Multi-layer sheet with pliability
10/14/2009CN201328220Y Welding mold for circuit board
10/14/2009CN201328219Y Fine line structure using laser sintering technology to bond ceramic material with copper material
10/14/2009CN201328218Y Two-section shifting mechanism
10/14/2009CN201328217Y Breaking and flattening clamp
10/14/2009CN201327722Y Mobile storage card with illuminant
10/14/2009CN101558694A Method and apparatus for printing conductive inks
10/14/2009CN101557903A Flux for lead-free solder and method of soldering
10/14/2009CN101557683A Multilayer circuit board
10/14/2009CN101557682A Method for manufacturing electronic component supporting plate
10/14/2009CN101557681A Clamp for fixing base plates
10/14/2009CN101557680A Transplanting method of multiplex circuit board
10/14/2009CN101557675A Printed circuit board and wiring method thereof
10/14/2009CN101557674A High density circuit board and manufacturing method thereof
10/14/2009CN101557063A Connector module for reinforcement application
10/14/2009CN101554669A Cutting mould and shaping method of soft-hard composite circuit board
10/14/2009CN100551220C Component suction method
10/14/2009CN100551214C Side wall printing method of porcelain block
10/14/2009CN100551213C Multi-layered wiring board, fabricating method, electronic device and electronic instrument
10/14/2009CN100551212C Multilayer circuit board manufacturing method
10/14/2009CN100551211C Multilayer printed wiring board and method for manufacturing the multilayer printed wiring board
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