| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/28/2009 | CN101569249A An electronic device and method of assembling an electronic device |
| 10/28/2009 | CN101569248A Method of producing conductive circuit board |
| 10/28/2009 | CN101569247A Methods of patterning a deposit metal on a substrate |
| 10/28/2009 | CN101569246A Printed wiring board and process for producing the same |
| 10/28/2009 | CN101569245A Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
| 10/28/2009 | CN101569059A Multi-sector antenna |
| 10/28/2009 | CN101568882A Photosensitive resin composition and layered product |
| 10/28/2009 | CN101568867A Optical/electrical mixture mounting board and method for producing the same |
| 10/28/2009 | CN101568229A Welding method of light emitting diode |
| 10/28/2009 | CN101568228A Electronic component, circuit substrate and circuit device |
| 10/28/2009 | CN101568227A Circuit board, manufacturing method thereof, and joint box using circuit board |
| 10/28/2009 | CN101568226A Multi-layer flexible printed circuit board and method of manufacturing the same |
| 10/28/2009 | CN101568224A Circuit board and electronic device having circuit board |
| 10/28/2009 | CN101567482A Anti-human body miniaturized electronic label and producing method thereof |
| 10/28/2009 | CN101567357A Electronic device provided with wiring board, and wiring board for such electronic device |
| 10/28/2009 | CN101567356A Circuit board structure and manufacture method thereof |
| 10/28/2009 | CN101567326A Printed circuit board and method for forming same |
| 10/28/2009 | CN101567015A Collocation method of elements on circuit board and computer readable recording medium |
| 10/28/2009 | CN101566451A Tin-wave width measuring tool |
| 10/28/2009 | CN101564931A Substrate positioning device and method, substrate processing device and method |
| 10/28/2009 | CN101564781A Welding tool for internal storage groove |
| 10/28/2009 | CN100556249C Jack process of printed circuit board |
| 10/28/2009 | CN100556248C Laser processing bearing device of flexible circuit board |
| 10/28/2009 | CN100556247C Method for manufacturing circuit board with built-in electronic components |
| 10/28/2009 | CN100556246C Wiring board manufacturing method |
| 10/28/2009 | CN100556245C Wiring board member for forming multilayer printed circuit board, method for producing same, and multilayer printed circuit board |
| 10/28/2009 | CN100556244C Multi-layer ceramic substrate, and electronic device using the same |
| 10/28/2009 | CN100556243C High-wide-band impedance matching transmitting hole |
| 10/28/2009 | CN100556242C Method for manufacturing separate LED circuitboard |
| 10/28/2009 | CN100556241C Method for mounting carrier belt and programmable read-only memory |
| 10/28/2009 | CN100556240C Integrated electromechanical arrangement and method of production |
| 10/28/2009 | CN100556239C Method and device for removing substrate solder |
| 10/28/2009 | CN100556238C Method for welding electronic part on base board |
| 10/28/2009 | CN100556237C Method for continuously producing flexible printed circuit board |
| 10/28/2009 | CN100556236C Power module structure, and solid state relay using the same |
| 10/28/2009 | CN100556235C Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus |
| 10/28/2009 | CN100556234C Hybrid electronic component and method for manufacturing the same |
| 10/28/2009 | CN100556233C Method for manufacturing an electronic module and an electronic module |
| 10/28/2009 | CN100556228C Printed wiring board |
| 10/28/2009 | CN100556227C Microelectronic substrates with thermally conductive pathways and methods of making same |
| 10/28/2009 | CN100555738C Composite via structures and filters in multilayer printed circuit boards |
| 10/28/2009 | CN100555625C Image sensor module, method of manufacturing the same, and camera module using the same |
| 10/28/2009 | CN100555620C Interconnect structures with engineered dielectrics with nanocolumnar porosity and its manufacture method |
| 10/28/2009 | CN100555619C Substrate surface processing structure and method for production thereof |
| 10/28/2009 | CN100555609C 混合集成电路装置及其制造方法 Hybrid integrated circuit device and manufacturing method thereof |
| 10/28/2009 | CN100555590C Electronic device manufacturing method |
| 10/28/2009 | CN100555420C System and method for improving lead wire coupling of hard disk drive actuator |
| 10/28/2009 | CN100554527C Electrolytic copper foil with low roughness surface and process for producing the same |
| 10/28/2009 | CN100554335C Resin composition for appearance inspection of printed circuit board |
| 10/28/2009 | CN100554138C Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body |
| 10/28/2009 | CN100553847C Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
| 10/27/2009 | USRE40947 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| 10/27/2009 | US7610168 Pass/fail judgment device, pass/fail judgment program, pass/fail judgment method, and multivariate statistics analyzer |
| 10/27/2009 | US7609527 Electronic module |
| 10/27/2009 | US7608788 Plating buss and a method of use thereof |
| 10/27/2009 | US7608477 Process for substrate incorporating component |
| 10/27/2009 | US7608295 Heat resistance, chemical resistance, waterproofing; curing, cyclization polyamic acids |
| 10/27/2009 | US7608203 Metallic colloidal solution and inkjet-use metallic ink |
| 10/27/2009 | US7607223 Electro-fluidic interconnect attachment |
| 10/27/2009 | US7607222 Method of manufacturing an electronic component package |
| 10/27/2009 | US7607221 Method of making an electronic device housing |
| 10/22/2009 | WO2009128369A1 Photosensitive resin composition and layered object obtained therewith |
| 10/22/2009 | WO2009128336A1 Connector, manufacture method for connector and anisotropic conductive film to be used therein |
| 10/22/2009 | WO2009127780A1 Wiring board and method for manufacturing the same |
| 10/22/2009 | WO2009127637A1 Reflow solder furnace and method for reflow soldering |
| 10/22/2009 | WO2009127201A2 Illumination apparatus |
| 10/22/2009 | WO2009091219A3 Printed circuit board installation method |
| 10/22/2009 | US20090264028 Joint structure, joining method, wiring board and method for producing the same |
| 10/22/2009 | US20090263986 Spring interconnect structures |
| 10/22/2009 | US20090263939 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 10/22/2009 | US20090262411 Manufacturing of curved electrochromic devices |
| 10/22/2009 | US20090262362 Interferometer for overlay measurements |
| 10/22/2009 | US20090262163 Inkjet nozzle incorporating piston actuator |
| 10/22/2009 | US20090261483 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device |
| 10/22/2009 | US20090260868 Printed circuit board and method of manufacturing the same |
| 10/22/2009 | US20090260867 Printed circuit board substrate and method for manufacturing printed circuit boards using same |
| 10/22/2009 | US20090260866 Wiring board and method for manufacturing the same |
| 10/22/2009 | US20090260860 Flexible printed circuit board |
| 10/22/2009 | US20090260859 Flexible printed circuit board |
| 10/22/2009 | US20090260231 Device to check and correct the position of plates for electronics and related method |
| 10/22/2009 | US20090260230 Method for manufacturing electronic parts module |
| 10/22/2009 | US20090260229 Method for manufacturing electronic parts module |
| 10/22/2009 | US20090260228 Process for the vertical interconnection of 3d electronic modules by vias |
| 10/22/2009 | DE102008018939A1 Structured electrically conductive metal layers producing method for use during production of electronic circuit utilized for e.g. smart label, involves removing solvent from connection and transferring connection into layer |
| 10/22/2009 | DE102008017152A1 Method for the production of an electric and/or mechanical connection between contact positions of a printed circuit board and a contact partner, comprises producing the connection through laser welding |
| 10/21/2009 | EP2111087A2 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
| 10/21/2009 | EP2111086A1 Method of manufacturing wiring circuit board |
| 10/21/2009 | EP2110709A1 Lithography exposure device |
| 10/21/2009 | EP1637131B1 Cataplasm base and cataplasm using the same |
| 10/21/2009 | EP1436605B1 Method of fabricating a substrate |
| 10/21/2009 | EP1167029B1 Printing plate, and printing method using the same |
| 10/21/2009 | EP0997935B1 Printed wiring board |
| 10/21/2009 | CN201332546Y FPC flat cable welding machine |
| 10/21/2009 | CN201332545Y Sheet-assembling platform with weighing device |
| 10/21/2009 | CN201332544Y Automatic alignment system for circuit board implantation |
| 10/21/2009 | CN201332537Y Electrostatic eliminating device for PP plate cutting equipment |
| 10/21/2009 | CN201331726Y Industrial computer full-length main board |
| 10/21/2009 | CN201329325Y Aluminium oxide powder flume with mechanical liquid level detection device |
| 10/21/2009 | CN101563963A Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
| 10/21/2009 | CN101563962A Printed substrate through which very strong currents can pass and corresponding production method |