| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/10/2009 | US7615141 Electrochemical printer head for use in electrolytically depositing material onto substrate, the printing head comprising a plurality of electrodes, a lead connector, an electric power source, and a high electrical resistance means for controlling distribution of electrolyte to electrode channels |
| 11/10/2009 | US7614541 Method and apparatus for placing conductive balls |
| 11/10/2009 | US7614146 Method for fabricating circuit board structure |
| 11/10/2009 | US7614145 Method for manufacturing multilayer circuit board and resin base material |
| 11/10/2009 | US7614144 Component mounting apparatus |
| 11/10/2009 | US7614143 Method of manufacturing a lighting bollard assembly |
| 11/10/2009 | US7614142 Method for fabricating an interposer |
| 11/05/2009 | WO2009134493A1 System and method for stabilizing an electronic array |
| 11/05/2009 | WO2009134009A2 Electroplating substrate containing metal catalyst layer and metal seed layer, and method for producing printed circuit board using the same |
| 11/05/2009 | WO2009133969A2 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 11/05/2009 | WO2009133919A1 Bonding method and bonding apparatus |
| 11/05/2009 | WO2009133886A1 Multilayer wiring board and method for manufacturing the same |
| 11/05/2009 | WO2009133817A1 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
| 11/05/2009 | WO2009133625A1 Wiring board, process for producing the same, and process for manufacturing electronic device |
| 11/05/2009 | WO2009132861A2 Aqueous, acid bath and method for the electrolytic deposition of copper |
| 11/05/2009 | WO2009132665A1 Method for generation of metal surface structures and use of silver complex for forming surface patterns |
| 11/05/2009 | WO2009132581A1 Method for manufacturing an electro nickel and gold printed circuit board |
| 11/05/2009 | WO2009132528A1 Hole thickening plating method of pcb |
| 11/05/2009 | WO2009106114A3 Method for producing printed circuit boards comprising fitted components |
| 11/05/2009 | WO2009100103A3 Method of connection of flexible printed circuit board and electronic device obtained thereby |
| 11/05/2009 | US20090274334 Mounting Method and Holder for SMD Microphone |
| 11/05/2009 | US20090273910 Functional Unit And Method For The Production Thereof |
| 11/05/2009 | US20090273907 Circuit board and process thereof |
| 11/05/2009 | US20090273650 Printhead With Columns Extending Across Chamber Inlet |
| 11/05/2009 | US20090273429 Inductor and method for fabricating the same |
| 11/05/2009 | US20090273413 Power divider integrated circuit |
| 11/05/2009 | US20090273069 Low profile chip scale stacking system and method |
| 11/05/2009 | US20090272567 Electronic device and method for making the same |
| 11/05/2009 | US20090272566 Electrically conductive paste and multilayer ceramic substrate |
| 11/05/2009 | US20090272564 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 11/05/2009 | US20090272562 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 11/05/2009 | US20090272560 Conductive film and method of producing thereof |
| 11/05/2009 | US20090271982 Method of forming a wiring having carbon nanotube |
| 11/05/2009 | US20090271979 Circuitry for printer |
| 11/05/2009 | US20090271978 Foil Perforating Needle For Detaching A Small Die From The Foil |
| 11/05/2009 | US20090271973 Methods of Making a Radio Frequency Identification (RFID) Tags |
| 11/05/2009 | DE112007001861T9 Schaltungsmaterialien mit verbesserter Bindung, Verfahren zu deren Herstellung und daraus gebildete Artikel Circuit materials with improved binding, to processes for their preparation and articles formed therefrom |
| 11/05/2009 | DE102008021750A1 Contactlessly identifiable electronic printed circuit board for measuring device, has radio frequency identification transponder inserted into recess, and electronic component comprising connection soldered on contact surface |
| 11/05/2009 | DE102008021447A1 Verfahren zum Betreiben einer in eine Rollendruckmaschine integrierten Bearbeitungseinrichtung A method of operating an integrated in a web press processing device |
| 11/05/2009 | DE102008020924A1 Electrical and/or mechanical connections manufacturing method for gamma or X-ray detectors, involves producing elevation as seed layer, metallic column and solder layer based on substrate or electronic element |
| 11/05/2009 | DE102008018763A1 Lithografiebelichtungseinrichtung Lithography exposure device |
| 11/05/2009 | DE102004033933B4 Verfahren zum Herstellen eines Metall-Keramik-Substrates A method for producing a metal-ceramic substrate |
| 11/05/2009 | DE10061613B4 Elektrische Steckvorrichtung mit einem Halter für ein elektronisches Bauteil An electric plug connector comprising a holder for an electronic component |
| 11/04/2009 | EP2114114A1 Bimetallic nanoparticles for conductive ink applications |
| 11/04/2009 | EP2114113A1 Conductor board and method for its production |
| 11/04/2009 | EP2113749A2 Display module and meter employing the same |
| 11/04/2009 | EP2113587A1 Aqueous acidic bath and method for electroplating copper |
| 11/04/2009 | EP2113038A1 Multilayer printed wiring boards with copper filled through-holes |
| 11/04/2009 | EP1668967B1 Improved method for micro-roughening treatment of copper and mixed-metal circuitry |
| 11/04/2009 | CN201341276Y Cover plate applicable to high-speed paster processing of components |
| 11/04/2009 | CN201341275Y PCB thin board developing horizontal line traction bridge |
| 11/04/2009 | CN201340847Y High-speed die bonder for automatic image recognition of die pairs |
| 11/03/2009 | US7613010 Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| 11/03/2009 | US7612429 Chip resistor, process for producing the same, and frame for use therein |
| 11/03/2009 | US7612295 Printed wiring board and method for manufacturing the same |
| 11/03/2009 | US7612294 Electrical component having a flat mounting surface |
| 11/03/2009 | US7611982 Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
| 11/03/2009 | US7611981 Optimized circuit design layout for high performance ball grid array packages |
| 11/03/2009 | US7611818 Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board |
| 11/03/2009 | US7611754 Integrated circuits; printed circuits; light emitting diodes |
| 11/03/2009 | US7611747 insulating material having a curable norbornanes and vinyl monomeric layer, in which foreign matter having very small particle sizes within the range of 30 to 50 mu m, are minimized, without drastically changing the principal portions of existing production lines |
| 11/03/2009 | US7611599 Method for production of decorative article and decorative article produced therefrom |
| 11/03/2009 | US7611569 Electroless copper compositions |
| 10/29/2009 | WO2009132061A2 Assembly method for implantable medical device |
| 10/29/2009 | WO2009131230A1 Circuit inspection device and method for inspecting circuit |
| 10/29/2009 | WO2009131204A1 Substrate, structure for mounting surface mounting component, and electronic device |
| 10/29/2009 | WO2009131182A1 Flex-rigid wiring board and method for manufacturing the same |
| 10/29/2009 | WO2009131178A1 Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| 10/29/2009 | WO2009131091A1 Transfer film for forming circuit pattern and method for forming circuit pattern using the same |
| 10/29/2009 | WO2009130791A1 Matrix substrate manufacturing apparatus |
| 10/29/2009 | WO2009129595A1 Planar heating element for underfloor heating |
| 10/29/2009 | WO2009095347A3 Method for gluing flexible circuit boards to polymer materials for partial or complete stiffening |
| 10/29/2009 | US20090269921 Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof |
| 10/29/2009 | US20090269606 Method for forming metal film and method for forming metal pattern |
| 10/29/2009 | US20090267224 Circuit device including rotated stacked die |
| 10/29/2009 | US20090266596 Printed circuit board with embedded electronic components and methods for the same |
| 10/29/2009 | US20090266592 Circuit board and method for jointing circuit board |
| 10/29/2009 | US20090266590 Interconnect structure and method for fabricating the same |
| 10/29/2009 | US20090266589 Process for producing metal wiring board |
| 10/29/2009 | US20090266588 Multilayer printed wiring board |
| 10/29/2009 | US20090266582 Three-dimensional circuit board and its manufacturing method |
| 10/29/2009 | US20090266573 Assembly Method for Implantable Medical Device |
| 10/29/2009 | US20090266412 Solar Cell, Prefabricated Base Part for a Solar Cell and Method for Manufacturing Such a Base Part and a Solar Cell |
| 10/29/2009 | US20090265930 Printed wiring board with enhanced structural integrity |
| 10/29/2009 | US20090265929 Method of mounting electronic circuit constituting member and relevant mounting apparatus |
| 10/29/2009 | US20090265928 Circuit board and manufacturing method thereof |
| 10/29/2009 | US20090265927 Input device and its manufacturing method |
| 10/29/2009 | US20090265925 Temporarily Fixing Device |
| 10/29/2009 | DE102008024164B3 Contact unit i.e. electrical soldering pin, for solder connection to e.g. printed circuit board, has tin layer consisting of radially inner layer support made of soft tin and radially outer layer support made of glossy tin |
| 10/29/2009 | DE102008022186B3 Producing a solder joint on a strip conductor substrate, comprises subjecting a liquid solder in a hole of the strip conductor substrate, introducing a non-soldering pin in the liquid solder through the hole and then stripping the pin |
| 10/29/2009 | DE102007027877B4 Kalibriervorrichtung für einen Setzkopf für Kontaktelemente Calibration for a set head for contact elements |
| 10/29/2009 | DE10056904B4 Verbindungsanordnung Connector assembly |
| 10/29/2009 | CA2722029A1 Planar heating element for underfloor heating |
| 10/28/2009 | EP2112875A2 Thermal management system and method for electronic equipment mounted on coldplates |
| 10/28/2009 | EP2112723A2 Laser welding method |
| 10/28/2009 | EP2112717A2 Connector Device |
| 10/28/2009 | EP2111673A1 Connection device |
| 10/28/2009 | EP1554915B1 Land grid array fabrication using elastomer core and conducting metal shell or mesh |
| 10/28/2009 | EP1232540B1 Differential signal electrical connectors |
| 10/28/2009 | CN201333578Y Electromagnetic-pump liquid metal furnace system |