| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/17/2009 | US7619867 Conformal coating enhanced to provide heat detection |
| 11/17/2009 | US7619428 Wafer level burn-in and electrical test system and method |
| 11/17/2009 | US7618843 stacking and firing; dimensional stability without delamination and warp; insulations, dielectrics, magnetism, piezoelectric; resistor thick films; semiconductor devices such as communication modules, vehicle modules |
| 11/17/2009 | US7618713 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 11/17/2009 | US7618704 Spin-printing of electronic and display components |
| 11/17/2009 | US7618561 Organic silver compound and it's preparation method, organic silver ink and it's direct wiring method |
| 11/17/2009 | US7618526 Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 11/17/2009 | US7618525 Method for electrochemical fabrication |
| 11/17/2009 | US7618281 Interconnect assemblies and methods |
| 11/17/2009 | US7617774 Method for printing an electronic circuit component on a substrate using a printing machine |
| 11/17/2009 | US7617600 Process of making an electronic circuit device having flexibility and a reduced footprint |
| 11/17/2009 | US7617597 Component placing method |
| 11/17/2009 | US7617596 Method of forming a housing for an electronic device |
| 11/17/2009 | US7617591 Method for fabricating embedded thin film resistors of printed circuit board |
| 11/16/2009 | CA2665922A1 Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coatings prepared thereby |
| 11/12/2009 | WO2009136603A1 Flex-rigid wiring board and method for manufacturing the same |
| 11/12/2009 | WO2009136557A1 Polyimide precursor, photosensitive polyimide precursor composition, photosensitive dry film, and flexible printed circuit board using those materials |
| 11/12/2009 | WO2009136414A2 Alternative means for conductor based short distance signal/data transfer |
| 11/12/2009 | WO2009135997A1 Method and arrangement comprising printed wiring board |
| 11/12/2009 | WO2009135985A1 An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof |
| 11/12/2009 | WO2009135733A1 Contacting of multipoint connectors by means of intermediate circuit boards |
| 11/12/2009 | WO2009115069A3 Method for producing circuit carriers |
| 11/12/2009 | US20090280648 Method and apparatus for 3d interconnect |
| 11/12/2009 | US20090280239 Method of manufacturing printed circuit board |
| 11/12/2009 | US20090279274 Circuit boards |
| 11/12/2009 | US20090279273 Multi-layer printed wiring board, electronic device, and fabrication method of electronic device |
| 11/12/2009 | US20090279270 Dual-channel optical navigation device |
| 11/12/2009 | US20090279269 Waterproof method for electronic device and waterproof electronic device |
| 11/12/2009 | US20090278897 Inkjet Printhead With Nozzle Chambers Each Holding Two Fluids |
| 11/12/2009 | US20090278762 Antenna Modular Sub-array Super Component |
| 11/12/2009 | US20090278265 Electronic component and resin packaging method for electronic component |
| 11/12/2009 | US20090277681 Expansion cross-connect enclosure |
| 11/12/2009 | US20090277679 Method of manufacturing PCB and PCB manufactured by the same |
| 11/12/2009 | US20090277676 In-mold decoration device and manufacturing method thereof |
| 11/12/2009 | US20090277673 PCB having electronic components embedded therein and method of manufacturing the same |
| 11/12/2009 | US20090277668 Infrared emitter with flexible Circuit board |
| 11/12/2009 | US20090277007 Method and apparatuses for printing and printed product |
| 11/12/2009 | US20090277006 Method for forming an electrical connection |
| 11/12/2009 | US20090277005 Small Form Factor PCBA Process Carrier |
| 11/12/2009 | US20090277004 Transfer product, transfer product fabrication method, and transfer product arrangement position identifying method |
| 11/12/2009 | US20090276990 Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator |
| 11/12/2009 | DE202008009018U1 Bezeichnungsschild mit Bezeichnungsträgerplatte für elektrische und elektronische Bauelemente Nameplate with marker carrier plate for electrical and electronic components |
| 11/12/2009 | DE102008021655A1 Substrat, Strahlungsquelle, Photozelle und Herstellungsverfahren Substrate radiation source, photocell and manufacturing processes |
| 11/12/2009 | DE102008021605A1 Electrical device e.g. transistor, connecting method for use with printed circuit board in vehicle, involves applying temperature level on board as part of manufacturing process for activating adhesive and connecting area of device |
| 11/12/2009 | DE102008018793B3 Anordnung in Druckkontaktausführung mit einem Leistungshalbleitermodul Arrangement in pressure contact design with a power semiconductor module |
| 11/12/2009 | DE102008001557A1 Messerleisten-Kontaktierung über Zwischenleiterplatten Male connectors contacting via intermediate-circuit boards |
| 11/12/2009 | DE10012510B4 Für Oberflächenmontage ausgelegter Verbinder und Verfahren zur Herstellung einer den Verbinder beinhaltenden Schaltungsvorrichtung Surface mount connector is laid out and the method of manufacturing a connector-containing circuit device |
| 11/12/2009 | CA2723886A1 An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof |
| 11/11/2009 | EP2117286A1 Method of manufacturing printed circuit board |
| 11/11/2009 | EP2117082A1 Electrical connection structure |
| 11/11/2009 | EP2117024A2 Waterproof method for electronic device and waterproof electronic device |
| 11/11/2009 | EP2116817A2 Connector module and meter employing the same |
| 11/11/2009 | EP2116816A2 Movement module and meter employing the same |
| 11/11/2009 | EP2116115A1 Method for the production of a pluggable connection contact on a semiconductor module and semiconductor module produced by this method |
| 11/11/2009 | EP2116114A1 Production process of printed circuits on which electronic components without leading wire are soldered |
| 11/11/2009 | EP2115819A1 Contact system |
| 11/11/2009 | EP2114608A1 Method and device for contacting, positioning and impinging a solder ball formation with laser energy |
| 11/11/2009 | EP2114579A1 Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias |
| 11/11/2009 | CN201345782Y Backing plate |
| 11/11/2009 | CN201345781Y Bubble-free sticking film pressing-in device for PCB board |
| 11/11/2009 | CN201345780Y Printed circuit board scrapping burn-out device |
| 11/11/2009 | CN201345779Y Datum hole positioning system of printed circuit board |
| 11/11/2009 | CN201343579Y Circuit board fixing bracket |
| 11/11/2009 | CN201342817Y Intermediate buffering material structure used in lamination process |
| 11/11/2009 | CN201342540Y Air extracting device of reversed flow welder |
| 11/11/2009 | CN101578929A Printed wiring board and method for manufacturing the same |
| 11/11/2009 | CN101578928A Circuit board and method for manufacturing the same |
| 11/11/2009 | CN101578696A Dynamic pad size to reduce solder fatigue |
| 11/11/2009 | CN101578555A Photocurable resin composition, cured product pattern, and printed wiring board |
| 11/11/2009 | CN101578320A Novel polyimide precursor composition, use thereof and production method thereof |
| 11/11/2009 | CN101578014A Method of manufacturing PCB and PCB manufactured by the same |
| 11/11/2009 | CN101578013A Circuit board copper plating device |
| 11/11/2009 | CN101578012A Overwelding and rewelding furnace carrier |
| 11/11/2009 | CN101578011A Producing method of wired circuit board |
| 11/11/2009 | CN101578010A Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate |
| 11/11/2009 | CN101578008A Protective structure for a circuit board and method for fabricating the same |
| 11/11/2009 | CN101577232A Method of manufacturing printed circuit board |
| 11/11/2009 | CN101577159A Film resistance structure and manufacturing method thereof |
| 11/11/2009 | CN101575488A Surface mount adhesive, mounting structure including the same, and method for producing mounting structure |
| 11/11/2009 | CN101574773A Positioning pin assembly device of printed circuit board |
| 11/11/2009 | CN101574748A Method and equipment for preventing formation of wave-soldering bridge |
| 11/11/2009 | CN101574746A Double-diamond end mill slotting method and slotting machine for carrying out same |
| 11/11/2009 | CN100559920C Rigid and flexible circuit board |
| 11/11/2009 | CN100559919C Manufacturing method of strip type macromolecular ESD protective device |
| 11/11/2009 | CN100559918C Flexible metal clad laminate and manufacturing method thereof |
| 11/11/2009 | CN100559917C Mounter device, part cartridge for the device, and method of holding and carrying substrate |
| 11/11/2009 | CN100559916C Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device |
| 11/11/2009 | CN100559915C Wired circuit board assembly |
| 11/11/2009 | CN100559914C Production method of suspension board with circuit |
| 11/11/2009 | CN100559562C Technique for efficiently patterning an underbump metallization layer using a dry etch process |
| 11/11/2009 | CN100559525C Solid-state electrolytic capacitor and mounting method therefor |
| 11/11/2009 | CN100559285C Projection exposure apparatus and method for producing a printed circuit board |
| 11/11/2009 | CN100559274C Projection exposure device |
| 11/10/2009 | US7616016 Probe card assembly and kit |
| 11/10/2009 | US7615873 Solder flow stops for semiconductor die substrates |
| 11/10/2009 | US7615709 Circuit board through-hole impedance tuning using clearance size variations |
| 11/10/2009 | US7615478 Fabrication method for electronic system modules |
| 11/10/2009 | US7615477 Method of fabricating a BGA package having decreased adhesion |
| 11/10/2009 | US7615277 Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| 11/10/2009 | US7615162 Printed wiring board and method for manufacturing the same |