| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/24/2009 | US7622183 Multilayer printed wiring board with filled viahole structure |
| 11/24/2009 | US7621043 Device for making an in-mold circuit |
| 11/24/2009 | US7621042 Method for mounting electronic components on a substrate |
| 11/24/2009 | US7621041 Methods for forming multilayer structures |
| 11/24/2009 | US7621039 Component mounting apparatus with pivotable transfer mechanism |
| 11/24/2009 | CA2247442C Method for isolating ultrafine and fine particles and resulting particles |
| 11/23/2009 | CA2666037A1 Photochemical synthesis of metallic nanoparticles for ink applications |
| 11/19/2009 | WO2009140524A2 Tin-silver compound coating on printed circuit boards |
| 11/19/2009 | WO2009140050A2 Electronic assemblies without solder and method for their design, prototyping, and manufacture |
| 11/19/2009 | WO2009139745A1 Application of viscous material by means of stationary printing head |
| 11/19/2009 | WO2009139728A1 Method and apparatus for integrated circuit inspection |
| 11/19/2009 | WO2009139372A1 Inductor element, integrated circuit device, and three-dimensionally packaged circuit device |
| 11/19/2009 | WO2009139354A1 Ceramic substrate, functional ceramic substrate, probe card and method for manufacturing ceramic substrate |
| 11/19/2009 | WO2009139272A1 Multilayer ceramic substrate and method for producing the same |
| 11/19/2009 | WO2009139121A1 Electronic component |
| 11/19/2009 | US20090285981 Method in the fabrication of a ferroelectric memory device |
| 11/19/2009 | US20090284952 Light emitting apparatus, display apparatus and method for manufacturing light emitting apparatus |
| 11/19/2009 | US20090284943 Wiring board, method for manufacturing the same, and semiconductor package |
| 11/19/2009 | US20090284942 Semiconductor device and fabrication method thereof |
| 11/19/2009 | US20090284937 Electric Circuitry Arrangement |
| 11/19/2009 | US20090284935 Structure and manufacturing process for circuit board |
| 11/19/2009 | US20090283315 High density package substrate and method for fabricating the same |
| 11/19/2009 | US20090283314 Wired circuit board and producing method thereof |
| 11/19/2009 | US20090283312 Printed wiring board and method for manufacturing the same |
| 11/19/2009 | US20090283311 Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module, and electronic information device |
| 11/19/2009 | US20090283305 Tin-silver compound coating on printed circuit boards |
| 11/19/2009 | US20090283302 Printed circuit board and manufacturing method thereof |
| 11/19/2009 | US20090283301 Multilayer wiring board and method for manufacturing the same |
| 11/19/2009 | US20090283300 Flex Circuit with Single Sided Routing and Double Sided Attach |
| 11/19/2009 | US20090283299 Component-embedded printed circuit board, method of manufacturing the same, and electronic apparatus including the same |
| 11/19/2009 | DE202009012063U1 Stufenschablone für den technischen Siebdruck Levels stencil for screen printing technology |
| 11/19/2009 | DE112007003258T5 Laserlötvorrichtung Laserlötvorrichtung |
| 11/19/2009 | DE102009013866A1 Electrical strip conductor carrier and fiber opto-electronic component arrangement, has solder connection element moved away from base connection section such that base connection section has distance for strip conductor carrier |
| 11/19/2009 | DE102008027761A1 Electronic component comprises semiconductor module and printed circuit board which is arranged above semiconductor module, where electrically conductive spring element is provided between semiconductor module and printed circuit board |
| 11/19/2009 | DE102008023882A1 Druckbare Zusammensetzung auf Basis von Silberpartikeln zur Erzeugung elektrisch leitfähiger Beschichtungen Printable composition based on silver particles for forming electrically conductive coatings |
| 11/19/2009 | DE102008017435A1 Method for manufacturing antenna unit for vehicles, involves pressurizing plastic foil with electrically conductive paste, and laminar plastic foil is made of ductile material and undergoes shaping after pressurization |
| 11/19/2009 | DE10154884C5 Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten Device for the transport of flexible flat material, especially printed circuit boards |
| 11/18/2009 | EP2120522A1 Method for the production of laminated ceramic electronic parts |
| 11/18/2009 | EP2120521A1 A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof |
| 11/18/2009 | EP2120520A2 Flexible film and display device including the same |
| 11/18/2009 | EP2120519A1 Electrical interconnect structure and process thereof and circuit board structure |
| 11/18/2009 | EP2120518A2 Circuit substrate and light emitting diode package |
| 11/18/2009 | EP2120517A1 A mutual connection structure between multi-layer boards and manufacturing method thereof |
| 11/18/2009 | EP2120516A1 Flexible printed wiring board |
| 11/18/2009 | EP2120515A1 Structure and manufacturing process for circuit board |
| 11/18/2009 | EP2119812A1 Composite material for electric and electronic components, electric and electronic components, and method for manufacturing composite material for electric and electronic components |
| 11/18/2009 | EP2119747A1 Printable compound based on silver particles for the creation of electrical conducting coatings |
| 11/18/2009 | EP2119330A1 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board |
| 11/18/2009 | EP2119328A1 Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor |
| 11/18/2009 | EP2119327A1 Method for removing a part of a planar material layer and multilayer structure |
| 11/18/2009 | EP1484119B1 Printed circuit board recycle method and apparatus thereof |
| 11/18/2009 | EP1292022B1 Saw device and method of manufacture thereof |
| 11/18/2009 | EP1170983B1 Circuit forming board and method of manufacturing circuit forming board |
| 11/18/2009 | CN201349368Y Chip element dodging double-opening type spout |
| 11/18/2009 | CN201349367Y Positioning device for pasting FPC board |
| 11/18/2009 | CN201349366Y Liquid removing device of base plate horizontal wet process |
| 11/18/2009 | CN201349365Y PCB printing machine |
| 11/18/2009 | CN201349049Y Soft printing type vehicle antenna module of multi-band integration |
| 11/18/2009 | CN101584259A Multilayer body, method for producing substrate, substrate and semiconductor device |
| 11/18/2009 | CN101584258A Method for the production of structured, electrically conductive surfaces |
| 11/18/2009 | CN101584257A Standardized electronics housing having modular contact partners |
| 11/18/2009 | CN101583647A Thermosetting resin composition |
| 11/18/2009 | CN101583489A Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies |
| 11/18/2009 | CN101583456A Laser soldering device |
| 11/18/2009 | CN101583250A Method for processing through hole of printed circuit board, printed circuit board and communication equipment |
| 11/18/2009 | CN101583249A Method of inspecting solder paste for printing and a device thereof |
| 11/18/2009 | CN101583248A Cold-connecting method of components |
| 11/18/2009 | CN101583247A Waterproof method for electronic device and waterproof electronic device |
| 11/18/2009 | CN101583246A Printed circuit board cleaning machine |
| 11/18/2009 | CN101583245A Manufacture method for conductive member pattern |
| 11/18/2009 | CN101583244A Method for manufacturing circuit board |
| 11/18/2009 | CN101583243A Wired circuit board and producing method thereof |
| 11/18/2009 | CN101583242A Device and method for delivering material |
| 11/18/2009 | CN101583241A Method for assembling heat sink on circuit board and radiating circuit substrate manufactured by method |
| 11/18/2009 | CN101583239A Component-embedded printed circuit board, manufacture method thereof and electronic apparatus containing the same |
| 11/18/2009 | CN101583238A Flexible film and display device including the same |
| 11/18/2009 | CN101583237A Multi-layer printed wiring board, electronic device and manufacture method thereof |
| 11/18/2009 | CN101583236A Circuit board and fixing method for plug-in type element applying to same |
| 11/18/2009 | CN101583235A Circuit board and fixing method for part without electrical properties applying to same |
| 11/18/2009 | CN101582384A Semiconductor through-electrode forming method |
| 11/18/2009 | CN101581884A Intaglio printing plate, production method for intaglio printing plate, production method for electronic substrate, and production method for display device |
| 11/18/2009 | CN101581841A Printed circuit board and liquid crystal display device having the same |
| 11/18/2009 | CN101581757A Test system and test method |
| 11/18/2009 | CN101580956A Method and device for gold finger galvanizing cylinder to automatically input current |
| 11/18/2009 | CN101580657A Ink and method for manufacturing conductive wires by ink |
| 11/18/2009 | CN101579971A Method of separating a scraper and a paste, and a screen printing device thereof |
| 11/18/2009 | CN101579753A Display device and method for expansion state of a substrate |
| 11/18/2009 | CN100562226C Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| 11/18/2009 | CN100562225C Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board |
| 11/18/2009 | CN100562224C Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method |
| 11/18/2009 | CN100562223C Method of manufacturing substrate for circuit board and smart label having the substrate |
| 11/18/2009 | CN100562222C A method for removing sensitization film in flexible printed circuit board |
| 11/18/2009 | CN100562221C Manufacture method for soft and hard composite board |
| 11/18/2009 | CN100562220C Circuit board dampening device and film pressing system with the same |
| 11/18/2009 | CN100562219C Circuit board film pressing device and method |
| 11/18/2009 | CN100562218C Casing structure with dismountable interface module |
| 11/18/2009 | CN100562214C Printed circuit board with improved hole |
| 11/18/2009 | CN100562212C Insulation structure for high thermal condition and its manufacturing method |
| 11/18/2009 | CN100562210C Circuit board combination |
| 11/18/2009 | CN100560262C Jet type welding apparatus |