| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/02/2009 | CN100566515C Double layer film, production method of double layer film, production method of printing circuit board |
| 12/02/2009 | CN100566514C Printed wiring board and its manufacture method, method of detecting rising level of electrically-conductive body |
| 12/02/2009 | CN100566513C Through hole welding technology for mobile phone camera module image sensor |
| 12/02/2009 | CN100566512C Circuit board |
| 12/02/2009 | CN100566511C Method for embedding a component in a base and forming a contact |
| 12/02/2009 | CN100566510C Pattern transferring material, its manufacturing method, wiring substrate manufactured by using the same |
| 12/02/2009 | CN100566509C Method of forming film pattern, device, method of manufacturing device, electro-optical device |
| 12/02/2009 | CN100566508C Printed board drilling method and printed board machining apparatus |
| 12/02/2009 | CN100566507C Electronic device and method of manufacturing thereof |
| 12/02/2009 | CN100566506C Embedded resistor devices |
| 12/02/2009 | CN100566505C Double layer flexible board and method for manufacturing the same |
| 12/02/2009 | CN100566017C Dielectric assembly and process for manufacturing the assembly |
| 12/02/2009 | CN100566014C Edge plated transmission line |
| 12/02/2009 | CN100565870C Coupler module and its manufacture method |
| 12/02/2009 | CN100565827C Solder bumps formation using solder paste with shape retaining attribute after uv irradiation |
| 12/02/2009 | CN100565728C Manufacture method of laminated ceramic electronic parts |
| 12/02/2009 | CN100565715C Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 12/02/2009 | CN100565196C Apparatus and method for detecting defect and apparatus and method for extracting wire area |
| 12/02/2009 | CN100564612C Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 12/02/2009 | CN100564594C Immersion plating of silver |
| 12/02/2009 | CN100563895C Reflow furnace |
| 12/01/2009 | US7626273 Low profile stacking system and method |
| 12/01/2009 | US7626248 Semiconductor package with a controlled impedance bus |
| 12/01/2009 | US7625640 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same |
| 12/01/2009 | US7625633 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods |
| 12/01/2009 | US7625099 LED lighting array for a portable task lamp |
| 12/01/2009 | US7624502 Method for producing circuit-forming board and material for producing circuit-forming board |
| 12/01/2009 | US7624501 Method of manufacturing multilayer wiring board |
| 12/01/2009 | US7624499 Flexible circuit having an integrally formed battery |
| 12/01/2009 | US7624497 Component recognition apparatus for chip mounter |
| 12/01/2009 | CA2368372C Ultraviolet curable silver composition and related method |
| 12/01/2009 | CA2352138C Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device |
| 11/28/2009 | CA2632592A1 Conductive ink formulations |
| 11/26/2009 | WO2009143206A1 Method for continuous sintering on indefinite length webs |
| 11/26/2009 | WO2009142592A1 Electronic device and component protection during manufacture |
| 11/26/2009 | WO2009142497A1 Providing a plastic substrate with a metallic pattern |
| 11/26/2009 | WO2009142280A1 Paired low-characteristic impedance power source line and ground line structure |
| 11/26/2009 | WO2009142126A1 Catalyst-imparting liquid for solder plating |
| 11/26/2009 | WO2009141929A1 Wiring board and method for manufacturing the same |
| 11/26/2009 | WO2009141928A1 Printed wiring board and method for manufacturing the same |
| 11/26/2009 | WO2009141927A1 Printed wiring board and method for manufacturing the same |
| 11/26/2009 | WO2009141551A2 Electroplating composition and process for coating a semiconductor substrate using said composition |
| 11/26/2009 | WO2009141488A1 Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for rf applications |
| 11/26/2009 | WO2009141211A1 Printing process for integrating an rfid transponder into packages |
| 11/26/2009 | WO2009141145A1 Digital television receiver |
| 11/26/2009 | WO2009108030A3 Printed circuit board and method of manufacturing the same |
| 11/26/2009 | WO2008146047A3 Improvements relating to direct write and additive manufacturing processes |
| 11/26/2009 | US20090291573 Probe card assembly and kit, and methods of making same |
| 11/26/2009 | US20090290318 Printed wiring board and method for manufacturing the same |
| 11/26/2009 | US20090290317 Printed circuit board, method of fabricating printed circuit board, and semiconductor device |
| 11/26/2009 | US20090289228 RF powder and method for manufacturing the same |
| 11/26/2009 | US20090289039 Circuit board conveying and soldering apparatus |
| 11/26/2009 | US20090288873 Wiring board and method of manufacturing the same |
| 11/26/2009 | US20090288872 Printed circuit board including outmost fine circuit pattern and method of manufacturing the same |
| 11/26/2009 | US20090288861 Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
| 11/26/2009 | US20090288860 Flexible printed circuit and method for making same |
| 11/26/2009 | US20090288858 Circuit structure and manufacturing method thereof |
| 11/26/2009 | US20090288857 Multilayer printed circuit board and method for manufacturing same |
| 11/26/2009 | US20090288567 Method and apparatus for manufacturing electronic device using roll-to-roll rotary pressing process |
| 11/26/2009 | DE202009012030U1 Haltevorrichtung zur Fixierung eines Bauteils auf einer in einem Lötrahmen angeordneten Leiterplatte Holding device for fixing a component on a solder frames arranged in a printed circuit board |
| 11/26/2009 | DE112006000153B4 Anordnung mit einer elektronischen Komponente und einer Schaltungsplatine Arrangement with an electronic component and a circuit board |
| 11/26/2009 | DE10220780B4 Fahrzeugleuchte mit wenigstens einer Leuchtdiode Vehicle lamp with at least one light emitting diode |
| 11/26/2009 | DE10203024B4 Verfahren zur Herstellung eines Keramiksubstrats A process for producing a ceramic substrate |
| 11/26/2009 | DE102008024451A1 Elektrisch leitende Schichtstruktur und Verfahren zu deren Herstellung Electrically conductive layer structure and process for their preparation |
| 11/26/2009 | CA2721841A1 Electroplating composition and process for coating a semiconductor substrate using said composition |
| 11/25/2009 | EP2124515A1 Conductive coating structure and method for its manufacture |
| 11/25/2009 | EP2124514A1 Providing a plastic substrate with a metallic pattern |
| 11/25/2009 | EP2124513A2 Lubricant sheet for making hole and method of making hole with drill |
| 11/25/2009 | EP2124512A2 Lubricant sheet for making hole and method of making hole with drill |
| 11/25/2009 | EP2124436A1 Digital television reception device |
| 11/25/2009 | EP2123138A1 Methods of patterning a deposit metal on a substrate |
| 11/25/2009 | EP2030493B1 Submount for electronic components |
| 11/25/2009 | EP1561099B1 Method of manufacture of electrochemical sensors |
| 11/25/2009 | EP1556226B1 Enzyme print humidification in a continuous process for manufacture of electrochemical sensors |
| 11/25/2009 | EP1035183B1 Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film |
| 11/25/2009 | CN201352883Y ACF pulling and stripping mechanism and ACF supplying device using ACF pulling and stripping mechanism |
| 11/25/2009 | CN201352882Y Element foot cutting machine for short foot process |
| 11/25/2009 | CN101589655A Circuit substrate manufacturing method, and circuit substrate |
| 11/25/2009 | CN101589654A A surface-mountable waveguide arrangement |
| 11/25/2009 | CN101588680A Method of fabricating printed wiring board |
| 11/25/2009 | CN101588679A Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
| 11/25/2009 | CN101588678A Method for forming welding resisting layer |
| 11/25/2009 | CN101588677A Manufacture method of flexible printed circuit board |
| 11/25/2009 | CN101588676A Manufacture method of printed circuit board (PCB) by utilizing photosensitive dry film to realize plugging holes selectively |
| 11/25/2009 | CN101587996A Surface pasting connection needle, surface pasting connector, circuit board and making method thereof |
| 11/25/2009 | CN101587981A Antenna and manufacturing method thereof |
| 11/25/2009 | CN101587980A Method for forming antenna on shell |
| 11/25/2009 | CN101587842A Chip packaging support plate and manufacture method thereof |
| 11/25/2009 | CN101587554A Method for manufacturing and identifying etched bar codes |
| 11/25/2009 | CN101587298A Photosensitive composition, photosensitive film, photosensitive layered body, permanent pattern forming method and printed circuit board |
| 11/25/2009 | CN101585955A Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
| 11/25/2009 | CN100563407C Circuit substrate and its manufacturing method |
| 11/25/2009 | CN100563406C Combination method of soft and hard printed circuit board |
| 11/25/2009 | CN100563405C Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| 11/25/2009 | CN100563404C Circuit substrate, electronic apparatus employing circuit substrate, and process for producing circuit substrate |
| 11/25/2009 | CN100563061C Maximizing capacitance per unit area while minimizing signal transmission delay in PCB |
| 11/25/2009 | CN100562997C Interpolater provided between the semiconductor component and semiconductor packaging |
| 11/25/2009 | CN100562990C Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver |
| 11/25/2009 | CN100562947C Process for preparing a non-conductive substrate for electroplating |
| 11/25/2009 | CN100562395C Tin trough nozzle for wave soldering and wave soldering process |