| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/09/2009 | CN100568420C Solid electrolytic capacitor |
| 12/09/2009 | CN100568097C Photosensitive resin composition and laminate |
| 12/09/2009 | CN100567976C Surface acoustic wave sensor assemblies and sensor box |
| 12/09/2009 | CN100567584C Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper |
| 12/09/2009 | CN100567581C Multi-step release method for electrochemically fabricated structures |
| 12/09/2009 | CN100566992C Metallized polyimide film and preparation method thereof |
| 12/09/2009 | CN100566897C Hole drilling method with single-side brass plate as back drill cover plate |
| 12/08/2009 | US7630536 Printing inspection apparatus, printing inspection method, printing inspection data generating apparatus, and printing inspection data generating method |
| 12/08/2009 | US7629870 Process for the treatment of a thin brittle metal strip and magnetic components produced from a strip made of a nanocrystalline alloy |
| 12/08/2009 | US7629555 Multiple beam micro-machining system and method |
| 12/08/2009 | US7629056 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 12/08/2009 | US7629050 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 12/08/2009 | US7629045 layer contains novolak epoxy resin, crosslinked acrylonitrile-butadiene rubber particles, and curing agent novolak phenol resin; excellent high frequency properties, high reliability; provide bonding strength, waterproofing, heat resistance; multilayer circuit board in semiconductors |
| 12/08/2009 | US7629017 Using writing tools; low temperature substrate; oxidation and electromigration resistance |
| 12/08/2009 | US7629015 Providing elongate, flexible, cylindrical inner member of polymeric material, arranging elongate electrical conductor on exposed outer surface of inner member, overlaying inner member and electrical conductor; for medical equipment |
| 12/08/2009 | US7628948 Alternate vent hole sealing method |
| 12/08/2009 | US7628840 Metal nano-particles and method for preparing the same, dispersion of metal nano-particles and method for preparing the same, and thin metallic wire and metal film and method for preparing these substances |
| 12/08/2009 | US7628308 Method of replenishing an oxidation suppressing element in a solder bath |
| 12/08/2009 | US7627947 Method for making a multilayered circuitized substrate |
| 12/08/2009 | CA2461962C Method for producing electrode structures |
| 12/03/2009 | WO2009145462A2 Substrate for metal printed circuit board and method for manufacturing the substrate |
| 12/03/2009 | WO2009145461A2 Substrate for ceramic printed circuit board and method for manufacturing the substrate |
| 12/03/2009 | WO2009145237A1 Filter, printed circuit board, and noise suppression method |
| 12/03/2009 | WO2009145224A1 Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board |
| 12/03/2009 | WO2009145207A1 Copper-foil roughening treatment and copper foil for printed circuit boards obtained using said treatment |
| 12/03/2009 | WO2009145179A1 Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 12/03/2009 | WO2009144954A1 Heat-hardened resin composition and printed wiring board |
| 12/03/2009 | WO2009144846A1 Solder ball mounting method |
| 12/03/2009 | WO2009144829A1 Multilayer substrate |
| 12/03/2009 | WO2009143805A1 Method and device for cohesively joining metallic connection structures |
| 12/03/2009 | WO2009143682A1 A heat dissipating device for a circuit board with embedded components and a fabrication method thereof |
| 12/03/2009 | US20090298230 Stacked Module Systems and Methods |
| 12/03/2009 | US20090296360 Voltage regulator attach for high current chip applications |
| 12/03/2009 | US20090296349 Component-embedded printed circuit board, method of manufacturing the same, and electronic apparatus including the same |
| 12/03/2009 | US20090296294 Electro-static discharge protection device with low temperature co-fire ceramic and manufacturing method thereof |
| 12/03/2009 | US20090295461 Device configuration |
| 12/03/2009 | US20090295364 Methods of Using a Nanotransfer Printing Stamp Having Conductively Coated Sidewalls |
| 12/03/2009 | US20090294779 Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device |
| 12/03/2009 | US20090294534 Structure including an electronic device for making a security document |
| 12/03/2009 | US20090294164 Printed circuit board including landless via and method of manufacturing the same |
| 12/03/2009 | US20090294158 Electronic circuit and method for manufacturing same |
| 12/03/2009 | US20090294157 Electro-optic device and method for manufacturing the same |
| 12/03/2009 | US20090294156 Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board |
| 12/03/2009 | US20090294155 Flexible printed circuit board, shield processing method for the circuit board and electronic apparatus |
| 12/03/2009 | US20090293946 Mixed-typed heterojunction thin-film solar cell structure and method for fabricating the same |
| 12/03/2009 | US20090293272 Method for manufacturing nonreciprocal circuit device and method for manufacturing composite electronic component |
| 12/03/2009 | US20090293271 Printed wiring board with built-in electronic component and manufacturing method thereof |
| 12/03/2009 | US20090293270 Method of assembling an electrode array that includes a plastically deforamble carrier |
| 12/03/2009 | US20090293269 Method For Selectively Processing Surface Tension Of Solder Mask Layer In Circuit Board |
| 12/03/2009 | US20090293268 Patterns of conductive objects on a substrate and method of producing thereof |
| 12/03/2009 | DE19921109B4 Elektronikbauteil und Elektronikkomponente mit einem Keramikbauteilelement Electronic component and electronic component with a ceramic component element |
| 12/03/2009 | DE19800922B4 Galvanisierverfahren unter Anwendung eines Nickel- oder Nickellegierungs-Galvanisierbads Electroplating using a nickel or nickel alloy electroplating bath- |
| 12/03/2009 | DE102008026399A1 Soldering contacts producing device for electrical components, has masking part arranged in retaining frames, where masking part and retainer are arranged with component by maintaining alignment in miniature furnace |
| 12/03/2009 | DE102008002041A1 Printed circuit board, has connection bore provided on wired component for retaining connection wire, and tin coating provided in bore, where inner diameter of coating is smaller than diameter of connection wire of wired component |
| 12/02/2009 | EP2129201A1 Multilayer wiring substrate |
| 12/02/2009 | EP2129200A1 Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film |
| 12/02/2009 | EP2129199A1 Method of manufactoring flexible film |
| 12/02/2009 | EP2129198A1 Electronic apparatus |
| 12/02/2009 | EP2129197A1 Method of manufacturing a printed circuit board. |
| 12/02/2009 | EP2129196A1 Ceramic member, method of forming groove in ceramic member, and substrate for electronic part |
| 12/02/2009 | EP2127800A1 Circuit board partition device |
| 12/02/2009 | EP2127508A1 Electric contacting device, particularly for electronic circuits, and electric/electronic circuit |
| 12/02/2009 | EP2127507A1 Method for the production of structured, electrically conductive surfaces |
| 12/02/2009 | EP2127506A1 Method for fabricating electrical circuitry on ultra-thin plastic films |
| 12/02/2009 | EP1789527B1 Cleaning compositions for microelectronics substrates |
| 12/02/2009 | EP1521811B1 A method for the production of conductive and transparent nano-coatings and nano-powder coatings |
| 12/02/2009 | CN201355884Y PCB clamp |
| 12/02/2009 | CN201354260Y Rotating mechanism for PCB board loader |
| 12/02/2009 | CN101594754A Method of making printed wiring board and electrically-conductive binder |
| 12/02/2009 | CN101594753A Printed wiring board |
| 12/02/2009 | CN101594752A Manufacturing method for multi-layer circuit board |
| 12/02/2009 | CN101594751A Structural improvement of double-sided multi-layer metal base circuit board |
| 12/02/2009 | CN101594750A Structure and manufacturing method of high-density substrate |
| 12/02/2009 | CN101594749A Manufacture method of a electric conductor for interlayer connection |
| 12/02/2009 | CN101594748A Method of making printed wiring board and method of making printed circuit board unit |
| 12/02/2009 | CN101594747A Printed wiring board and method of producing the same |
| 12/02/2009 | CN101594746A Method of manufacturing flexible film |
| 12/02/2009 | CN101594745A Improved structure of registration of upper and lower films and electronic circuit board |
| 12/02/2009 | CN101594744A Method for manufacturing conductive pattern on flexible substrate and protective printing oil thereof |
| 12/02/2009 | CN101594743A Method for manufacturing outer graphics of electronic circuit board by encapsulation method |
| 12/02/2009 | CN101594742A Method and equipment for manufacturing circuit board stepped groove |
| 12/02/2009 | CN101594741A Component-embedded printed circuit board, method of manufacturing the same, and electronic apparatus including the same |
| 12/02/2009 | CN101594740A Circuit board with imbedded electronic device and method of imbedding electronic device therein |
| 12/02/2009 | CN101594739A Embedded circuit board radiating device and processing method of element |
| 12/02/2009 | CN101594738A Signal conduction element |
| 12/02/2009 | CN101594737A Printing wiring cardinal plate and method for producing the same |
| 12/02/2009 | CN101594736A A copper-clad laminate, a surface treating copper foil and a printed circuit board |
| 12/02/2009 | CN101594735A Flexible film and display device including the same |
| 12/02/2009 | CN101594734A Flexible film and display device including the same |
| 12/02/2009 | CN101594733A Flexible film and display device including the same |
| 12/02/2009 | CN101594730A Circuit board with conductive structure |
| 12/02/2009 | CN101594729A Circuit board |
| 12/02/2009 | CN101592760A Opto-electric hybrid module and manufacturing method thereof |
| 12/02/2009 | CN101591518A High temperature resistant epoxy adhesive modified by silsesquioxane for flexible copper clad laminate |
| 12/02/2009 | CN101591488A Ink and method for manufacturing conducting wire by using same |
| 12/02/2009 | CN101590721A Container for automatically dispensing solder paste in a stencil printer |
| 12/02/2009 | CN100566537C Device and method for conveying and holding plate-like member |
| 12/02/2009 | CN100566535C Method and apparatus for fixing components |
| 12/02/2009 | CN100566517C Multilayer wiring board and method for manufacturing the same |
| 12/02/2009 | CN100566516C Manufacturing method of conductive blind hole on circuit substrate |