| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/06/1993 | DE4136204A1 Releasable connector for linking cable ribbons to circuit boards - has clamping element strip with flexible spacer to press tracks of ribbon against those of circuit board |
| 05/06/1993 | DE4136159A1 Heat seal compsn. for electroconductive bonding of PCB, LCD etc. - comprises polymer contg. hard, discrete, electroconductive particles |
| 05/06/1993 | DE4135839A1 Verfahren zur herstellung einer mehrlagigen gedruckten schaltung sowie mehrlagige gedruckte schaltung A process for producing a multilayer printed circuit, as well as multilayer printed circuit |
| 05/05/1993 | EP0540497A2 Method of making solid solder coatings |
| 05/05/1993 | EP0540451A2 Structure and process for thin film interconnect |
| 05/05/1993 | EP0540319A2 A wire harness |
| 05/05/1993 | EP0540269A1 Soldering method and flux for use therein |
| 05/05/1993 | EP0540247A2 Formulation of multichip modules |
| 05/05/1993 | EP0540104A1 Two-layer of multilayer printed circuit board, method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method |
| 05/05/1993 | EP0540101A1 Two-layer or multilayer printed circuit board |
| 05/05/1993 | EP0540070A1 Method for forming an electrical connection for an integrated circuit |
| 05/05/1993 | EP0540050A1 Increasing adhesion of dry-film photopolymerizable compositions to carriers |
| 05/05/1993 | EP0539714A1 Amphoteric compositions |
| 05/05/1993 | EP0539607A1 Vacuum drying apparatus |
| 05/05/1993 | EP0539597A1 Liquid crystal module |
| 05/05/1993 | EP0539390A1 Process for moving an item with drillings during its wet chemical treatment, e.g. galvanisation, and device for implementing the process |
| 05/05/1993 | CN1071794A Electrical interconnection apparatus |
| 05/04/1993 | US5208761 Method for the diameter confirmation of drills in a PWB machine |
| 05/04/1993 | US5208733 Enclosure and printed circuit card with heat sink |
| 05/04/1993 | US5208728 Housing for fitting in motor vehicles to hold electronic components |
| 05/04/1993 | US5208656 Multilayer wiring substrate and production thereof |
| 05/04/1993 | US5208068 Substrates with layer pressed on supports and controlling thickness |
| 05/04/1993 | US5208067 Surface modification of organic materials to improve adhesion |
| 05/04/1993 | US5208066 Process of forming a patterned polyimide film and articles including such a film |
| 05/04/1993 | US5207955 Process for removing and/or structuring surfaces by irradiating with a light source |
| 05/04/1993 | US5207889 Electrodeposition of copper, zinc, and antimony barrier layer; bonding strength; undercutting resistance |
| 05/04/1993 | US5207888 Electroplating process and composition |
| 05/04/1993 | US5207887 Semi-additive circuitry with raised features using formed mandrels |
| 05/04/1993 | US5207867 Multilayer element with a cladd metal and etching |
| 05/04/1993 | US5207865 Multilayer structure and method for fabricating the same |
| 05/04/1993 | US5207585 Thin interface pellicle for dense arrays of electrical interconnects |
| 05/04/1993 | CA2005729C Method and apparatus for forming electrode on electronic component |
| 05/02/1993 | CA2081965A1 Increasing adhesion of dry-film photopolymerizable compositions to carriers |
| 05/01/1993 | WO1993009259A1 Support rod |
| 05/01/1993 | CA2099134A1 Support rod |
| 04/29/1993 | WO1993008672A1 Manufacture of multilayer ceramic part, and multilayer ceramic part |
| 04/29/1993 | WO1993008624A1 Interconnector |
| 04/29/1993 | WO1993008256A1 Azeotrope-like compositions of 1,1,1-trifluorohexane and perfluoromethylcyclohexane |
| 04/29/1993 | DE4135344A1 Method for prodn. of printing plates - involves film exposed on plate raw piece, and then film and plate precisely laid on transparent carrier for transfer to copier to be exposed from below |
| 04/29/1993 | DE4135103A1 High frequency electrical connection appts. - has triple plate arrangement of thin layers on flexible polyimide substrates with electric through contacts |
| 04/28/1993 | EP0539260A1 Process for the metallization of articles of plastic material |
| 04/28/1993 | EP0539211A2 Method for production of microcapsule type conductive filler |
| 04/28/1993 | EP0539131A1 Soldering flux |
| 04/28/1993 | EP0539095A2 Semiconductor device having radiator structure and method of producing the same |
| 04/28/1993 | EP0538978A2 Method of forming an electrically conductive contact on a substrate |
| 04/28/1993 | EP0538923A2 Process for the preparation of a thermosetting elongated object |
| 04/28/1993 | EP0538821A1 Foaming flux for automatic soldering process |
| 04/28/1993 | EP0538663A1 Microwave methods of fabricating multi-layer ceramic substrates |
| 04/28/1993 | EP0538642A2 Process for clamping, with a defined free working length, a drilling or milling tool of a circuit board drilling machine in the collet equipped drilling spindle of that machine |
| 04/28/1993 | EP0538457A1 Fabrication of metal matrix composites by vacuum die casting |
| 04/28/1993 | EP0538432A1 Device for producing an electric circuit, especially for a measuring probe, and a measuring probe. |
| 04/28/1993 | CN1071535A Cilver-rich conductor compositions for high thermal cycled and aged adhesions |
| 04/28/1993 | CN1071467A Azeotropic compositions of 1,1,1,2,3,4,4,5,5,5-decafluoropentane and trans-1,2-dichloroethylene, cis-1,2-dichloroethylene or 1,1-dichloroethane |
| 04/27/1993 | US5206905 Password protected device using incorrect passwords as seed values for pseudo-random number generator for outputting random data to thwart unauthorized accesses |
| 04/27/1993 | US5206795 Compliant connection for substrates |
| 04/27/1993 | US5206705 Method of checking external shape of solder portion |
| 04/27/1993 | US5206624 Intermediate product for use in the production of thick-film circuits |
| 04/27/1993 | US5206463 Overcoating with flexible material, then electroconductive material |
| 04/27/1993 | US5206277 Elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
| 04/27/1993 | US5206116 Light-sensitive composition for use as a soldermask and process |
| 04/27/1993 | US5206055 Activating substrate using solution of alkali metal hydroxide, alkali metal carbonate, and reducing agent, immersing substrate into plating bath |
| 04/27/1993 | US5206052 Electroless plating process |
| 04/27/1993 | US5205896 Component and solder preform placement device and method of placement |
| 04/27/1993 | US5205805 Printed circuit board processing machine incorporating tool holding device |
| 04/27/1993 | US5205750 Temperature compensating strain relief connection for flexible electrical circuits |
| 04/27/1993 | US5205738 High density connector system |
| 04/27/1993 | US5205683 Device for working plate-shaped members |
| 04/27/1993 | US5205461 Method and apparatus for fluxless solder bonding |
| 04/27/1993 | US5205303 Liquid cleaning process and apparatus for circuit boards and the like |
| 04/27/1993 | US5205041 Device for removing a peduncle from a printed circuit board |
| 04/27/1993 | CA1317002C Electrically conductive pressure-sensitive adhesive tape |
| 04/21/1993 | EP0538021A2 Contact structure between flexible cable and signal receiving unit and recording apparatus using said contact structure |
| 04/21/1993 | EP0538007A2 Integrated circuit demountable tab apparatus |
| 04/21/1993 | EP0538006A1 Direct metallization process |
| 04/21/1993 | EP0537982A2 Semiconductor device having improved leads |
| 04/21/1993 | EP0537879A1 Aryl triflate compound, radiologically acid producing agent, radiologically acid producing agent system, and radiosensitive composition |
| 04/21/1993 | EP0537813A2 Method and apparatus for selective electroplating of metals on products |
| 04/21/1993 | EP0537667A2 High dielectric constant material |
| 04/20/1993 | US5204498 Packaging assembly |
| 04/20/1993 | US5204287 Integrated circuit device having improved post for surface-mount package |
| 04/20/1993 | US5204221 Photosensitive resin composition |
| 04/20/1993 | US5204055 Three-dimensional printing techniques |
| 04/20/1993 | US5203955 Method for etching an organic polymeric material |
| 04/20/1993 | US5203927 Attaching thin film of water repellent surfactant to surface |
| 04/20/1993 | US5203911 Controlled electroless plating |
| 04/20/1993 | US5203487 Reflow soldering method and system therefor |
| 04/20/1993 | US5203078 Printed wiring board for IC cards |
| 04/20/1993 | US5203077 Method for mounting large discrete electronic components |
| 04/20/1993 | US5203075 Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
| 04/20/1993 | US5203060 Apparatus for making insert molded circuitry |
| 04/20/1993 | CA1316574C Moldable/foldable radio housing |
| 04/19/1993 | WO1993008649A1 Electroacoustic transducer mounting apparatus |
| 04/16/1993 | CA2078422A1 Direct metallization |
| 04/15/1993 | WO1993007736A1 Silver-rich conductor compositions for high thermal cycled and aged adhesion |
| 04/15/1993 | WO1993007657A1 Plated compliant lead |
| 04/15/1993 | WO1993007640A1 Method and compositions for diffusion patterning |
| 04/15/1993 | WO1993007310A1 Device for electroplating plate-like objects, in particular printed circuit boards |
| 04/15/1993 | WO1993007309A1 Low temperature tin-bismuth electroplating system |
| 04/15/1993 | WO1993007308A1 Azeotropic compositions of 1,1,1,2,3,4,4,5,5,5-decafluoropentane and trans-1,2-dichloroethylene, cis-1,2-dichloroethylene or 1,1-dichloroethane |
| 04/15/1993 | WO1993007306A1 Adherent metal coating for aluminum nitride surfaces |