| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/26/2000 | US6125034 Computer having internally mounted peripheral devices with moveable adapter |
| 09/26/2000 | US6125026 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components |
| 09/26/2000 | US6125015 Head gimbal assembly with low stiffness flex circuit and ESD Protection |
| 09/26/2000 | US6124778 Magnetic component assembly |
| 09/26/2000 | US6124772 Control unit |
| 09/26/2000 | US6124722 Universal apparatus for testing printed circuit boards utilizing independently movable needle boards |
| 09/26/2000 | US6124721 Method of engaging electrically conductive test pads on a semiconductor substrate |
| 09/26/2000 | US6124635 Functionally gradient integrated metal-ceramic member and semiconductor circuit substrate application thereof |
| 09/26/2000 | US6124629 Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip |
| 09/26/2000 | US6124625 Chip decoupling capacitor |
| 09/26/2000 | US6124421 Poly(arylene ether) compositions and methods of manufacture thereof |
| 09/26/2000 | US6124408 The composite comprises a photosensitive resin and thermoplastic resin forming a quasi-homogeneous compatible structure, wherein photosensitive resin comprsies atleast one of acrylated resin; improved heat resistance/photosensitivity |
| 09/26/2000 | US6124220 Laminated board and process for production thereof |
| 09/26/2000 | US6124041 Multilayer ceramic package comprising ceramic substrate and a copper based sintering paste for forming conductive vias or surface patterns, comprising copper powder, and powdered copper aluminate as copper sources, and organic materials |
| 09/26/2000 | US6124023 Prepreg for laminate and process for producing printed wiring-board using the same |
| 09/26/2000 | US6124004 Laminate of liquid crystal polyester resin composition |
| 09/26/2000 | US6123895 Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same |
| 09/26/2000 | US6123874 First glass powder, a second glass powder, a conductive material powder, and an organic vehicle. |
| 09/26/2000 | US6123788 Copper wire and process for making copper wire |
| 09/26/2000 | US6123577 Lan patch panel and wall mount unit assembly |
| 09/26/2000 | US6123555 Structure of the female seat of a high frequency connector |
| 09/26/2000 | US6123554 Connector cover with board stiffener |
| 09/26/2000 | US6123551 Electronic circuit interconnection method and apparatus |
| 09/26/2000 | US6122815 Circuit board stiffener and method of attachment to a circuit board |
| 09/21/2000 | WO2000056130A1 A method and an arrangement for the electrical contact of components |
| 09/21/2000 | WO2000056128A1 Method of manufacturing resistors |
| 09/21/2000 | WO2000055946A1 System for providing a removable high density electrical interconnect for flexible circuits |
| 09/21/2000 | WO2000055925A1 Opto-electronic element |
| 09/21/2000 | WO2000055917A1 Power semiconductor module |
| 09/21/2000 | WO2000055913A1 Multi-layer substrates and fabrication processes |
| 09/21/2000 | WO2000055908A1 Laminate for multi-layer printed circuit |
| 09/21/2000 | WO2000055878A1 Electromechanical switching device package with controlled impedance environment |
| 09/21/2000 | WO2000055870A1 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
| 09/21/2000 | WO2000055868A1 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
| 09/21/2000 | WO2000055742A2 System for interconnecting circuit boards housed within a chassis |
| 09/21/2000 | WO2000021101A9 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 09/21/2000 | DE19912441A1 Multi-Chip-Modul Multi-chip module |
| 09/21/2000 | DE19910407A1 Test plate for testing equipment and materials used for manufacturing printed circuit boards |
| 09/21/2000 | DE19909505A1 Verfahren zur Herstellung von Schaltungsanordnungen A process for producing circuit arrangements |
| 09/21/2000 | DE19855578C1 Stanzeinrichtung mit wechselbaren Stempeln Punching device with interchangeable dies |
| 09/21/2000 | DE10012510A1 Connector e.g. for surface mounting of circuit device, has conductor connection from connector body which is fastened at flexible element and electrically connected at flexible element |
| 09/21/2000 | CA2368057A1 A method and an arrangement for the electrical contact of components |
| 09/21/2000 | CA2367384A1 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
| 09/21/2000 | CA2360323A1 Laminate for multi-layer printed circuit |
| 09/20/2000 | EP1037518A2 Heat sink for printed circuit board |
| 09/20/2000 | EP1037512A2 Flat flexible cable with ground conductors |
| 09/20/2000 | EP1037511A2 Surface treatment of copper to prevent microcracking in flexible circuits |
| 09/20/2000 | EP1037328A1 Apparatus for providing controlled impedance in an electrical contact |
| 09/20/2000 | EP1037236A2 Electromechanical switching device package with controlled impedance environment |
| 09/20/2000 | EP1037221A2 Coil device and switching power supply apparatus using the same |
| 09/20/2000 | EP1036811A1 Prepreg and laminated board |
| 09/20/2000 | EP1036490A1 Surface mount power supply device |
| 09/20/2000 | EP1036489A1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
| 09/20/2000 | EP1036427A1 A method of reducing high frequency coupling between pairs of conductors in a connector, and a connector for transferring differential signals |
| 09/20/2000 | EP1036393A1 Flat surface-mounted multi-purpose wire |
| 09/20/2000 | EP0916238B1 Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive |
| 09/20/2000 | EP0822894A4 Anodized aluminum substrate having increased breakdown voltage |
| 09/20/2000 | EP0769155B1 Arrangement of optical modules |
| 09/20/2000 | CN2397702Y Line device for printed circuit |
| 09/20/2000 | CN1267314A Flame retardant epoxy resin composition |
| 09/20/2000 | CN1267182A PC board capable of preventing short circuit during welding |
| 09/20/2000 | CN1267180A Terminal structure to connect electronic component thereon |
| 09/20/2000 | CN1267104A Flexible circuit board connecting structure |
| 09/19/2000 | US6122695 Device for terminating a processor bus |
| 09/19/2000 | US6122187 Stacked integrated circuits |
| 09/19/2000 | US6122186 High power miniature demand power supply |
| 09/19/2000 | US6122177 Semiconductor device-mounted on a printed circuit board having solder bumps with excellent connection reliability |
| 09/19/2000 | US6122161 Circuit board assembly |
| 09/19/2000 | US6121988 Printed wiring board and its manufacturing method, and electronic apparatus |
| 09/19/2000 | US6121689 Semiconductor flip-chip package and method for the fabrication thereof |
| 09/19/2000 | US6121688 Anisotropic conductive sheet and printed circuit board |
| 09/19/2000 | US6121681 Semiconductor device |
| 09/19/2000 | US6121679 Structure for printed circuit design |
| 09/19/2000 | US6121678 Wrap-around interconnect for fine pitch ball grid array |
| 09/19/2000 | US6121676 Stacked microelectronic assembly and method therefor |
| 09/19/2000 | US6121554 Printed wiring board |
| 09/19/2000 | US6121405 Method for preparing a high-heat-resistant-epoxy-resin composition comprising pyrazinium salt containing a benzyl group |
| 09/19/2000 | US6121369 Liquid crystalline polyester compositions containing carbon black |
| 09/19/2000 | US6121174 Dielectric material with low temperature coefficient and high quality |
| 09/19/2000 | US6121173 Ceramic sintered body and a process for its production |
| 09/19/2000 | US6121171 The continuous phase of para-oriented aromatic polyamide has a laminated structure of fibrils which have diameters of not more than 1 mu.m and are arranged in the form of a planar network or a nonwoven fabric |
| 09/19/2000 | US6120975 Methods for production of a plasma display panel |
| 09/19/2000 | US6120906 Sintered body of a complex oxide of silicon, aluminum, zinc, magnesium, and boron; contains a spinel crystal phase of zinc oxide and aluminum oxide and a quartz crystal phase; low dielectric loss; for transmitting high frequency signals |
| 09/19/2000 | US6120884 Comprising conductive silver or silver alloy and a metal oxide dispersed in a vehicle; improved electrical properties |
| 09/19/2000 | US6120883 Computer printable top coating |
| 09/19/2000 | US6120839 Electro-osmotic displays and materials for making the same |
| 09/19/2000 | US6120708 Conductive paste and method for producing ceramic substrate using the same |
| 09/19/2000 | US6120588 Electronically addressable microencapsulated ink and display thereof |
| 09/19/2000 | US6120179 Apparatus for measuring the temperature of a circuit board during a drilling operation |
| 09/19/2000 | US6120114 Solenoid coil structure and interconnection |
| 09/19/2000 | US6119334 Method and apparatus for connecting wiring boards and ink jet recording head and recording apparatus |
| 09/19/2000 | CA2225129C Printed circuit board including crosstalk compensation |
| 09/19/2000 | CA2010743C Printed circuit board capable of preventing electromagnetic interference |
| 09/14/2000 | WO2000054561A1 Method for improving the manufacturing safety of weld joints |
| 09/14/2000 | WO2000054560A1 A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method |
| 09/14/2000 | WO2000054551A2 Apparatus including an electroacoustic transducer having terminal contacts which extend in the direction of the transducer axis and including a printed circuit board having mating contacts |
| 09/14/2000 | WO2000054337A1 Apparatus and method for an integrated circuit having high q reactive components |
| 09/14/2000 | WO2000054324A1 Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| 09/14/2000 | WO2000054323A1 Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| 09/14/2000 | WO2000054005A1 Improved registration of sheet materials using statistical targets and method |