Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2000
10/11/2000CN1269637A Master slice, substrate element and producing method therefor
10/11/2000CN1269636A Master slice and substrate element and producing method therefor
10/11/2000CN1269585A 导电糊 Conductive paste
10/11/2000CN1269538A Low-CTE power source and stratum
10/11/2000CN1269531A Fuel composition, blank sheet and multilayer substrate materials
10/11/2000CN1269386A Photosensitive conductive paste
10/11/2000CN1269285A Soft substrate plate
10/10/2000US6130601 Thick-film resistor having concentric terminals and method therefor
10/10/2000US6130585 Cross-over distribution scheme for canceling mutually coupled signals between adjacent stripline signal distribution networks
10/10/2000US6130475 Clock distribution system for synchronous circuit assemblies
10/10/2000US6130114 Semiconductor device
10/10/2000US6130015 Method for using fiducial schemes to increase nominal registration during manufacture of laminated circuit
10/10/2000US6129982 Aromatic polyimide film having improved adhesion
10/10/2000US6129579 Low inductance flex-to-PCB spring connector for a disc drive
10/10/2000US6129556 Computer system using a card having an expansion edge
10/10/2000US6129555 Jack connector, plug connector and connector assembly
10/10/2000CA2143293C Electronic component
10/05/2000WO2000059276A1 A via connector and method of making same
10/05/2000WO2000059274A1 Method for manufacturing three-dimensional printed wiring board
10/05/2000WO2000059180A1 Vertical buzzer/earphone to reduce humming sounds
10/05/2000WO2000059000A2 Method for making segmented through holes in printed circuit boards
10/05/2000WO2000058872A1 Field programmable ball array
10/05/2000WO2000009327A9 Resin/copper/metal laminate and method of producing same
10/05/2000WO2000004446A9 Prototype development system
10/05/2000DE19915245A1 Electronic component with strip conductor, e.g. coil or coupler for high frequency application and high speed digital circuits, is produced by conductive layer deposition on metal base layer regions exposed by structured photolacquer layer
10/05/2000DE19914815A1 Halbleitermodul Semiconductor module
10/05/2000DE19914418A1 Printed circuit board, particularly flexible printed circuit board
10/05/2000DE19912674A1 Antenna arrangement for vehicle remote controlled system on printed card
10/05/2000DE19910500A1 Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board
10/05/2000DE10013255A1 Electronic component, e.g. an automobile electronic ignition module, comprises a filled resin housing encapsulating a hybrid integrated circuit substrate and a tin-antimony soldered power semiconductor on a heat sink
10/05/2000DE10013189A1 Substrate for a power semiconductor module in an electric vehicle has a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink
10/04/2000EP1041867A2 Printed circuit board and manufacturing method of the printed circuit board
10/04/2000EP1041865A2 Device to produce multi-layer electronic circuits
10/04/2000EP1041864A2 Supporting plate for flexible base supports for electronic circuits
10/04/2000EP1041631A2 Capacitor-built-in-type printed wiring substrate, printed wiring substrate, and capacitor
10/04/2000EP1041626A2 Semiconductor Module
10/04/2000EP1041617A1 Semiconductor device and method of production thereof and semiconductor mounting structure and method
10/04/2000EP1041616A1 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
10/04/2000EP1041418A2 Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same
10/04/2000EP1041051A2 Ceramics composition
10/04/2000EP1040966A2 Remote programming of an ABS electronic control module
10/04/2000EP1040737A2 Arrangement for implementing a magnetic circuit on a circuit board
10/04/2000EP1025587A4 Semiconductor flip-chip package and method for the fabrication thereof
10/04/2000EP0654174B1 Sealed conductive active alloy feedthroughs
10/04/2000CN1269120A Method for heating printed circuit board, and printed circuit board comprising a heating element
10/04/2000CN1268862A Circuit plate and soldering method therefor
10/04/2000CN1268806A Oscillation circuit and turning unit
10/04/2000CN1268790A High density cross connection device
10/04/2000CN1268769A Substrate element and soft substrate
10/04/2000CN1268675A Flexible printing wiring substrate, electrooptics arrangement, and electronic device
10/04/2000CN1268429A Metallic tension laminated plate used for electric circuit basic plate and its mfg. method
10/03/2000US6128685 Method for terminating a processor bus
10/03/2000US6128201 Three dimensional mounting assembly for integrated circuits
10/03/2000US6128063 Liquid crystal display apparatus having multi-layer substrate
10/03/2000US6127736 Microbump interconnect for semiconductor dice
10/03/2000US6127634 Wiring board with an insulating layer to prevent gap formation during etching
10/03/2000US6127204 Column grid array or ball grid array pad on via
10/03/2000US6127195 Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus
10/03/2000US6127025 Circuit board with wiring sealing filled holes
10/03/2000US6126761 Process of controlling grain growth in metal films
10/03/2000US6126489 Electrical connector for printed circuit boards
10/03/2000US6126459 Substrate and electrical connector assembly
10/03/2000US6126454 Contact device between a liquid crystal display and a printed circuit
10/03/2000US6126452 Video card
10/03/2000US6125531 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
09/2000
09/28/2000WO2000057679A1 Cross-midplane switch topology
09/28/2000WO2000057474A1 Multi-chip module
09/28/2000WO2000057405A1 Method for shunting and deshunting an electrical component and a shuntable/shunted electrical component
09/28/2000WO2000046984A8 Modular structure of a smart camera for image signal processing
09/28/2000WO1999063792A9 Flexible circuit assembly
09/28/2000DE19914032A1 Method for producing and depositing punched antenna coil with several turns on chip card by depositing one or more coils after splitting on chip card in certain spatial mode
09/28/2000DE19910131A1 Einrichtung zur Übertragung elektrischer Signale Means for transmitting electrical signals
09/28/2000DE19910078A1 Verfahren zur Erhöung der Fertigungssicherheit von Lötverbindungen Process for the production reliability of solder joints Erhöung
09/28/2000DE19860716C1 Conductive adhesive connection arrangement for electronic components on circuit board
09/27/2000EP1039792A2 High density cross-connection system
09/27/2000EP1039790A2 Electrical connector housing
09/27/2000EP1039789A1 Method of manufacturing multilayer printed wiring board
09/27/2000EP1039788A2 Flexible printed wiring board, electro-optical device, and electronic equipment
09/27/2000EP1039627A2 Oscillator circuit and turner
09/27/2000EP1039573A2 Ball grid array R-C network with high density
09/27/2000EP1039542A2 Connector set
09/27/2000EP1039539A2 Ceramic circuit board
09/27/2000EP1039537A2 Heat conductive resin substrate and semiconductor package
09/27/2000EP1039004A1 Nonwoven fabric made of glass fiber and printed wiring boards
09/27/2000EP1038417A1 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
09/27/2000EP0711102B1 Method for forming a conductive circuit on the surface of a molded product
09/27/2000EP0658300B1 Structured printed circuit boards and films and process for producing them
09/27/2000EP0634066B1 1.6 TO 3 GHz OSCILLATOR
09/27/2000CN1268282A Flexible circuits and carriers and process for manufacture
09/27/2000CN1268245A A system and method for packaging integrated circuits
09/27/2000CN1268020A Flat flexible electric cable with earthing conductor
09/27/2000CN1267910A Ball grid array package capable of relieving stress
09/27/2000CN1267909A Assembly for mounting driver IC
09/27/2000CN1267891A Conducting and resistance material with electrical stability using for electronic equipment
09/27/2000CN1267696A Interlamellar insulation adhesive using for multilayer printed circuit board
09/27/2000CN1267596A Copper surface treatment for preventing microcrack in soft circuit
09/26/2000US6125044 Suppressing EMI with PCB mounted ferrite attenuator
09/26/2000US6125042 Ball grid array semiconductor package having improved EMI characteristics
09/26/2000US6125041 Card-type electronic device
09/26/2000US6125039 Hybrid module
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