Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2000
10/24/2000US6137054 Wire-circuit sheet and electric junction box thereof
10/24/2000US6136734 Low-fire, low-dielectric ceramic compositions
10/24/2000US6136733 Method for reducing coefficient of thermal expansion in chip attach packages
10/24/2000US6136512 Method of forming resistors
10/24/2000US6136419 Ceramic substrate having a sealed layer
10/24/2000US6136230 Can be fired at low temperature; wettability to solder and glass substrate having circuit; suitable for producing automobile window having antifogging property
10/24/2000US6136127 Electrically conductive adhesive transfers
10/24/2000US6135791 Method for achieving uniform expansion of dielectric plate
10/24/2000US6135782 Electrical compression connector for a disc drive
10/24/2000US6135780 Dual function lamp socket
10/24/2000US6135024 Screen printing method and printing apparatus
10/24/2000US6134772 Via fill compositions for direct attach of devices and methods of applying same
10/23/2000CA2305954A1 Package for high-frequency device
10/20/2000WO2001028767A1 Laminate and process for producing the same
10/19/2000WO2000062586A1 Ultraviolet curable silver composition and related method
10/19/2000WO2000062585A1 Circuit board with arrangement for cooling power components
10/19/2000WO2000062582A1 Composite substrate, thin film el element using it, and method of producing the same
10/19/2000WO2000062417A1 Predistortion generator coupled with an rf amplifier
10/19/2000WO2000062368A1 Inverted microstrip transmisson line integrated in a multilayer structure
10/19/2000WO2000062337A1 Metal core substrate printed wiring board enabling thermally enhanced ball grid array (bga) packages and method
10/19/2000WO2000061667A1 Polymers having backbones with reactive groups employed in crosslinking as precursors to nanoporous thin film structures
10/19/2000WO2000061658A1 Polyimide resin, resin composition with improved moisture resistance comprising the same, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these
10/19/2000WO2000026942A9 Method for producing filled vias in electronic components
10/19/2000DE19917438A1 Circuit arrangement for e.g. image sensor comprises carrier plate with contacts connected to image sensor via flip-chip mounting
10/19/2000DE19916382A1 Adjustment method for high-frequency resonant printed circuit, involves correction of conductor layer by part removal using rotary mechanical cutter applied perpendicularly to remove material around periphery of hole in substrate
10/19/2000DE19915594A1 Temperature compensated fuse element for electrical units in vehicles, has melting safeguard and cold conductor fuse which are arranged to establish parallel current path between power supply and load connections
10/19/2000DE19914497A1 Heat-removal metal base arrangement for circuit board especially ceramic substrate
10/19/2000CA2369495A1 Predistortion generator coupled with an rf amplifier
10/18/2000EP1045626A1 Method for high resolution trimming of PCB components
10/18/2000EP1045625A1 A foil fuse made on a circuit board
10/18/2000EP1045478A1 Electrical device
10/18/2000EP1045441A2 Slotted contacts for minimizing the voltage required to electrically blow fuses
10/18/2000EP1045418A2 Protective device
10/18/2000EP1044800A1 Metal laminate for a circuit board
10/18/2000EP1044473A1 Low-inductance, gate-controlled thyristor
10/18/2000EP1044472A1 Multi-chip module having interconnect dies
10/18/2000EP1044322A2 Apparatus for routing electrical signals in an engine
10/18/2000EP0935912A4 Pcmcia card with metal cover, connector, frame with cross beam and exposed ground plate disposed on connector
10/18/2000EP0909467B1 Small filament lamp, and holder for a small filament lamp
10/18/2000EP0904675B1 Screen printing method and screen printing apparatus
10/18/2000EP0888707B1 Module with a circuit arrangement
10/18/2000CN2402097Y Soft electric circuit board with support frame
10/18/2000CN1270755A Radio-electronic element
10/18/2000CN1270495A Surface installation structure and electronic elements included inside
10/18/2000CN1270494A Method for forming conductive pattern and manufacturing multi-layer ceramic substrates
10/18/2000CN1270492A Frequency regulation method and configuration for voltage-controlled oscillator
10/18/2000CN1270445A Manufacture of high frequency assembly
10/18/2000CN1270111A Flexible LED multiple module for lamp shell of vehicle
10/18/2000CN1057659C Multilayered metallic printed board and molded module
10/17/2000USRE36916 Apparatus for stacking semiconductor chips
10/17/2000US6134701 Computer motherboard with a control chip having specific pin arrangement for fast cache access
10/17/2000US6134117 Method for high resolution trimming of PCB components
10/17/2000US6134111 Vertical surface mount apparatus with thermal carrier
10/17/2000US6134093 Category 5/25-pair protector
10/17/2000US6134075 Magnetic head suspension with single layer preshaped trace interconnect
10/17/2000US6133886 Antenna for a wireless communication module
10/17/2000US6133808 Dielectric filter having input/output electrodes connected to electrodes on a substrate, and dielectric duplexer incorporating the dielectric filter
10/17/2000US6133805 Isolation in multi-layer structures
10/17/2000US6133657 Vibrator bracket
10/17/2000US6133639 Compliant interface for semiconductor chip and method therefor
10/17/2000US6133535 Electronic component having calcined electrode
10/17/2000US6133408 Polyimide resin for cast on copper laminate and laminate produced therefrom
10/17/2000US6133377 Compostion of epoxy resin, phenol-triazine-aldehyde condensate and rubber
10/17/2000US6133175 A ceramic material consisting of glass and a modifier seelcted from titanium oxide, strontium titinate or calcium titinate, atlest a high q (small loss tangent) values alkaline-earth metal oxide-aluminosilicate and high q alumina
10/17/2000US6133134 Ball grid array integrated circuit package
10/17/2000US6133052 Bump inspection method
10/17/2000US6132887 Heat treatment
10/17/2000US6132646 Electroconductive ink and curing adhesive with flux and metals
10/17/2000US6132588 Process for forming a deposit layer on an isolated conductor circuit pattern of wiring circuit boards employed in the field of electronic material
10/17/2000US6132543 Method of manufacturing a packaging substrate
10/17/2000US6132266 Method of reducing crosstalk in connector for communication system
10/17/2000US6132226 Structure and method for mounting an electronic part
10/17/2000US6132224 Connector assembly for printed circuit
10/17/2000US6131511 Screen printing method and screen printing apparatus
10/17/2000US6131275 Methods and devices relating to circuit board constructions
10/17/2000US6131269 Circuit isolation technique for RF and millimeter-wave modules
10/12/2000WO2000060912A1 Method and noise suppressor unit for installing a common mode choke for noise suppressor in a power source module onto a circuit
10/12/2000WO2000060613A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate
10/12/2000WO2000060153A1 Glass cloth and printed wiring board
10/12/2000WO2000060152A1 Woven fabric reinforcement to optimize dimensional stability of laminated composite structures, including products for electrical and electronic applications
10/12/2000WO2000059645A1 Methods to produce robust multilayer circuitry for electronic packaging
10/12/2000WO2000059374A1 Patient sensor for clinical spectrophotometric apparatus
10/12/2000WO2000028385A3 Method and device for aligning two photo masks with each other and optionally, an unexposed printed circuit board blank, and for subsequent simultaneous exposure in the production of double-sided printed circuit boards
10/12/2000WO2000008675A3 Adapter for surface mounted devices
10/12/2000DE19929610C1 Chip module for chip card has electrical component and contact bridge on one side of module carrier each coupled to contact surfaces on opposite side of module carrier via respective openings in latter
10/12/2000DE10016064A1 Combined substrate for production of single substrate has oblong single substrate formed with bore with first and second single substrates being adjacent and having common front part area of wide part
10/11/2000EP1043922A1 Multilayer printed wiring board
10/11/2000EP1043921A1 Multilayer printed wiring board and method for manufacturing the same
10/11/2000EP1043920A2 Surface mountable power supply module and method of manufacture therefor
10/11/2000EP1043433A1 Woven fabric reinforcement to optimize dimensional stability of laminated composite structures, including products for electrical and electronic applications
10/11/2000EP1043112A1 Lead-free solder
10/11/2000EP1043109A1 Assembling method through welding of a coil with an integrated circuit or a small electronic unit
10/11/2000EP1042946A2 Hybrid circuit with a heat dissipation system
10/11/2000EP1042945A1 Molded electronic package, method of preparation and method of shielding
10/11/2000EP1041927A2 Fabric or garment with integrated flexible information infrastructure
10/11/2000EP0598914B1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board
10/11/2000EP0464224B1 Method of and material for forming thick filmy pattern
10/11/2000CN1269849A Wholly aromatic synthetic fiber produced by liquid-crystal spinning, process for producing same and use thereof
10/11/2000CN1269698A Fitting structure of chip element and fitting method thereof
10/11/2000CN1269695A Printed circuit board and producing method thereof
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