Patents for H05K 1 - Printed circuits (98,583)
12/2002
12/24/2002US6498319 Method and an apparatus for manufacturing multi-layer boards using laser light
12/24/2002US6498309 Printed circuit with polytetrafluoroethylene foundation; tin laminated with copper
12/24/2002US6498308 Semiconductor module
12/24/2002US6498307 Electronic component package, printing circuit board, and method of inspecting the printed circuit board
12/24/2002US6498306 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder
12/24/2002US6498305 Interconnect mechanics for electromagnetic coupler
12/24/2002US6498294 Package for high frequency device
12/24/2002US6498207 Aqueous polytetrafluoroethylene dispersion composition
12/24/2002US6497991 Method of producing a printed circuit board and mask for carrying out the same
12/24/2002US6497943 Surface metal balancing to reduce chip carrier flexing
12/24/2002US6497581 Robust, small scale electrical contactor
12/24/2002US6497578 Method and apparatus to increase cable connector density in equipment
12/24/2002US6497035 Hall position sensor
12/24/2002CA2068176C Method of applying metal coatings on diamond and articles made therefrom
12/20/2002WO2002000756A1 Insulating resin composition, adhesive resin composition and adhesive sheeting
12/20/2002CA2413759A1 Resin composition for insulation material, resin composition for adhesive and adhesion sheet
12/19/2002WO2002101772A1 Low inductance grid array capacitor
12/19/2002WO2002101766A1 Improved method for forming magnetic layers in printed circuit boards
12/19/2002WO2002101438A2 Attenuator and conditioner
12/19/2002WO2002100952A2 Tab circuit for ink jet printer cartridges
12/19/2002WO2002100931A1 Nanocomposite dielectrics
12/19/2002WO2002051220A8 Method and arrangement relating to data transmission
12/19/2002WO2002049194A3 Modularized power supply
12/19/2002WO2001073883A9 Low-temperature fabrication of thin-film energy-storage devices
12/19/2002WO2001073868A9 Device enclosures and devices with integrated battery
12/19/2002US20020193552 Flame retardant resin material and flame retardant resin composition
12/19/2002US20020193541 Thermosetting resin compositions containing maleimide and/or vinyl compounds
12/19/2002US20020193519 Comprises epoxy resin, polysiloxane and curing agent; moldability; catalytic polymerization; nondegrading; elasticity
12/19/2002US20020193467 Conductive materials with electrical stability for use in electronics devices
12/19/2002US20020193238 Low temperature-fired porcelain articles and electronic parts
12/19/2002US20020193235 Dielectric porcelain composition, and dielectric resonator and nonradiative dielectric strip using same
12/19/2002US20020193229 As substrate in which an electric circuit or circuits are formed
12/19/2002US20020193154 Battery mounting and testing method
12/19/2002US20020193153 Battery-powered test-configured electronic device
12/19/2002US20020193027 Coating solubility of impregnated glass fiber strands
12/19/2002US20020192870 Impregnating a raw material of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers; curing
12/19/2002US20020192865 Process for mounting electronic device and semiconductor device
12/19/2002US20020192602 Forming nesting contour on a fiber optic array; nesting a surface of non-planar article against contour; exposing photoresist optically connected to proximal optical fiber surface within contours; developing; etching
12/19/2002US20020192540 Fuel cells and batteries including metal-carbon composite powders
12/19/2002US20020192488 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member
12/19/2002US20020192442 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
12/19/2002US20020192392 Method of making a printed circuit board
12/19/2002US20020192368 Method for the production of metal-carbon composite powders
12/19/2002US20020191380 Method and device for interconnecting, electronic components in three dimensions
12/19/2002US20020191379 Surface mount power supplies for standard assembly process
12/19/2002US20020191378 Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder material
12/19/2002US20020191368 Electronic assembly with laterally connected capacitors and manufacturing method
12/19/2002US20020191366 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
12/19/2002US20020191364 Sole structure for electrostatic dissipative footwear and method of making same
12/19/2002US20020191126 Structure of liquid crystal display device for easy assembly and disassembly
12/19/2002US20020190801 Method for adjusting oscillator frequencies
12/19/2002US20020190739 CSP BGA test socket with insert and method
12/19/2002US20020190574 Assembly, with lead frame, for antilock brake system and associated method
12/19/2002US20020190367 Slice interconnect structure
12/19/2002US20020190365 Non-contact type IC card and process for manufacturing-same
12/19/2002US20020190364 IC card indicating state of usage and system therefor
12/19/2002US20020190132 Contactless smart card with an antenna support and a chip support made of fibrous material
12/19/2002US20020189859 Printed circuit board and its manufacturing method
12/19/2002US20020189857 Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards
12/19/2002US20020189856 Circuit board and method of manufacturing same
12/19/2002US20020189855 Flexible printed circuit board
12/19/2002US20020189854 Design for long fatigue life in flexible circuits
12/19/2002US20020189852 Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board
12/19/2002US20020189851 Non-continuous conductive layer for laminated substrates
12/19/2002US20020189850 Resin-molded board
12/19/2002US20020189849 Printed wiring board and manufacturing method of printed wiring board
12/19/2002US20020189847 Shielded flat cable
12/19/2002US20020189840 Wiring connection method and wiring connection structure
12/19/2002US20020189742 Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product
12/19/2002US20020189400 Well-controlled microstructure and morphology; electrocatalytic devices
12/19/2002US20020189094 Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
12/19/2002US20020189091 Method of making printed circuit board
12/19/2002US20020189089 Mounting electrical devices to circuit boards
12/19/2002US20020189083 Surface-mount type switching power-supply unit and mounting method for the same
12/19/2002DE10222669A1 Tragbare Karten-Typ-Vorrichtung Portable card-type device
12/19/2002DE10130257A1 Method for manufacturing electric circuit on substrate, involves applying and structuring laminated layer on first layer, before applying second layer
12/19/2002DE10129118A1 Housing part for electrical adjustment drive in vehicle, has at least one outer conducting track electrically connected to at least one inner conducting track in form of stamped grid
12/19/2002DE10123198A1 Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board
12/19/2002CA2450014A1 Nanocomposite dielectrics
12/18/2002EP1267600A2 Circuit board protection cover and circuit board having circuit board protection cover
12/18/2002EP1267597A2 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
12/18/2002EP1267596A2 Printed circuit board and its manufacturing method
12/18/2002EP1267595A1 Circuit forming board producing method, circuit forming board, and material for circuit forming board
12/18/2002EP1267594A2 Transfer material, method for producing the same and wiring substrate produced by using the same
12/18/2002EP1267403A2 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
12/18/2002EP1267400A2 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using this composite material member
12/18/2002EP1267360A1 Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact id and production method thereof
12/18/2002EP1266926A1 Adhesive polyimide resin and adhesive laminate
12/18/2002EP1266426A1 Method for forming radio frequency antenna using conductive inks
12/18/2002EP1265972A1 Luminescent gel coats and moldable resins
12/18/2002EP1265946A1 Poly(phenylene ether) - polyvinyl thermosetting resin
12/18/2002CN2527063Y Combined television set casing
12/18/2002CN2527062Y Wiring structure for signal transmission line on circuit board
12/18/2002CN2526975Y Multi-layer substrate with voltage reference signal line distribution
12/18/2002CN1386396A Production method for copper-clad laminated sheet
12/18/2002CN1386395A Circuit board and method for manufacturing the same, and electronic apparatus comprising it
12/18/2002CN1386394A Flip chip package, circuit thereof and packaging method thereof
12/18/2002CN1386313A System comprising at least two printed circuit boards
12/18/2002CN1386045A Wiring board and making method thereof
12/18/2002CN1386042A Sensor circuit modular unit and electronic device using same