| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/01/2003 | CN1388401A 液晶显示装置 The liquid crystal display device |
| 01/01/2003 | CN1387993A Method for producing laminated plate |
| 01/01/2003 | CN1098023C Printed wiring board and its producing method thereof |
| 12/31/2002 | US6502221 Prototype development system |
| 12/31/2002 | US6501664 Decoupling structure and method for printed circuit board component |
| 12/31/2002 | US6501662 Motor driving inverter |
| 12/31/2002 | US6501661 Electronic control unit |
| 12/31/2002 | US6501634 High voltage transient voltage surge suppression fuse link system |
| 12/31/2002 | US6501633 Wiring board and electronic device having circuit board |
| 12/31/2002 | US6501525 Method for interconnecting a flat panel display having a non-transparent substrate and devices formed |
| 12/31/2002 | US6501352 High frequency wiring board and its connecting structure |
| 12/31/2002 | US6501341 Voltage controlled oscillator and communication device using same |
| 12/31/2002 | US6501301 Semiconductor integrated circuit and an electronic apparatus incorporating a multiplicity of semiconductor integrated circuits |
| 12/31/2002 | US6501181 Arrangement relating to electronic circuitry |
| 12/31/2002 | US6501174 Interconnect structure for surface mounted devices |
| 12/31/2002 | US6501162 Semiconductor device, semiconductor module and hard disk |
| 12/31/2002 | US6501103 Light emitting diode assembly with low thermal resistance |
| 12/31/2002 | US6500566 Depositing onto carrier film release agent layer comprising water soluble polymer, forming conductive metal layer with thickness of less than 10,000 angstroms, bonding metal layer to circuit board laminate layer, peeling off carrier film |
| 12/31/2002 | US6500546 Heterocyclic phosphonate or phosphinate compound; curing agent of styrene-maleic acid (anhydride, ester or salt) copolymer; printed circuits, prepregs |
| 12/31/2002 | US6500535 Finely dispersed crosslinked terpolymer comprising alpha-olefin, conjugated diene, and vinyl aromatic monomers |
| 12/31/2002 | US6500529 Low signal loss bonding ply for multilayer circuit boards |
| 12/31/2002 | US6500350 Formation of thin film resistors |
| 12/31/2002 | US6500349 Manufacture of printed circuits using single layer processing techniques |
| 12/31/2002 | US6499647 Method for producing contact between two circuit layers separated by an insulating layer |
| 12/31/2002 | US6499217 Method of manufacturing three-dimensional printed wiring board |
| 12/27/2002 | WO2002104088A1 Method for assembly and/or disassembly of an electronic module on an application card method for production and corresponding mechanical fixing clip |
| 12/27/2002 | WO2002103887A2 Power converters |
| 12/27/2002 | WO2002103884A1 Housing part for an electric adjusting drive |
| 12/27/2002 | WO2002103848A2 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials |
| 12/27/2002 | WO2002103839A1 Transmission structure with an air dielectric |
| 12/27/2002 | WO2002103838A1 Conductor structure |
| 12/27/2002 | WO2002103789A2 Electronic assembly with laterally connected capacitors and manufacturing method |
| 12/27/2002 | WO2002103725A1 Electrical apparatus having an electromagnetic device operable at multiple inductance values |
| 12/27/2002 | WO2002103628A1 Contactless chipcard with an antenna support and chip support made from a fibrous material |
| 12/27/2002 | WO2002103455A2 Method and apparatus for imaging with fiber optic arrays on non-flat surfaces |
| 12/27/2002 | WO2002103426A2 Optical power control system |
| 12/27/2002 | WO2002102224A2 In vivo sensing device with a circuit board having rigid sections and flexible sections |
| 12/27/2002 | WO2002089260A3 Separable power delivery connector |
| 12/27/2002 | WO2002074024A3 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 12/27/2002 | WO2002067278A3 Electrolytic capacitors and method for making them |
| 12/26/2002 | US20020199159 Naked chip motherboard module |
| 12/26/2002 | US20020199049 Signal bus arrangement |
| 12/26/2002 | US20020198356 For producing electronic components, such as, for example, printed circuit boards; hydrophobicity, low dielectric constant |
| 12/26/2002 | US20020198269 Antireflective porogens |
| 12/26/2002 | US20020197893 Electric junction box |
| 12/26/2002 | US20020197891 Socket for electrical parts |
| 12/26/2002 | US20020197843 Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components |
| 12/26/2002 | US20020197834 Method for manufacturing a composite member |
| 12/26/2002 | US20020197492 Electrolessly depositing a metal coating; depositing a photoresist coating; imaging and developing the photoresist coating; electroplating a metal on the exposed electrolessly deposited metal; and stripping the cured coating |
| 12/26/2002 | US20020197488 Use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass to enhance the reliability of the electrical connection of a silver-based conductor film |
| 12/26/2002 | US20020197479 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film |
| 12/26/2002 | US20020197466 Base material for laminate and process for producing the same |
| 12/26/2002 | US20020197024 Transparent substrate and hinged optical assembly |
| 12/26/2002 | US20020196997 Packaging and assembly method for optical coupling |
| 12/26/2002 | US20020196615 Shielded electronics package structure with enhanced mechanical reliability |
| 12/26/2002 | US20020196614 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 12/26/2002 | US20020196613 Through hole insertion type electronic component and method of packaging same |
| 12/26/2002 | US20020196612 Arrangement of memory chip housings on a DIMM circuit board |
| 12/26/2002 | US20020196119 Printed circuit boards having integrated inductor cores |
| 12/26/2002 | US20020196118 Electrical apparatus having an electromagnetic device operable at multiple inductance values |
| 12/26/2002 | US20020196093 Complex circuit board, nonreciprocal circuit device, resonator, filter, duplexer, communications device, circuit module, complex circuit board manufacturing method, and nonreciprocal circuit device manufacturing method |
| 12/26/2002 | US20020196085 High frequency module |
| 12/26/2002 | US20020196037 Method and apparatus to prevent damage to probe card |
| 12/26/2002 | US20020195722 Structure and mounting method |
| 12/26/2002 | US20020195718 Process for mounting electronic device and semiconductor device |
| 12/26/2002 | US20020195706 Semiconductor apparatus with misalignment mounting detection |
| 12/26/2002 | US20020195705 Semiconductor apparatus with decoupling capacitor |
| 12/26/2002 | US20020195704 Multi-die module and method thereof |
| 12/26/2002 | US20020195700 Electronic assembly with vertically connected capacitors and manufacturing method |
| 12/26/2002 | US20020195676 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system |
| 12/26/2002 | US20020195614 Ball grid array chip packages having improved testing and stacking characteristics |
| 12/26/2002 | US20020195612 Method of making a nickel-coated copper substrate and thin film composite containing the same |
| 12/26/2002 | US20020195272 Multilayered substrate for semiconductor device |
| 12/26/2002 | US20020195270 High frequency module device and method for its preparation |
| 12/26/2002 | US20020195269 Via intersect pad for electronic components and methods of manufacture |
| 12/26/2002 | US20020195268 Thick film circuit connection |
| 12/26/2002 | US20020195266 Flat cable covering and flat cable using same |
| 12/26/2002 | US20020195122 Test carrier for temporarily packaging bumped semiconductor components in which contact balls on the components are protected during test procedures; made of wear resistant material |
| 12/26/2002 | US20020194731 Fabrication method and structure of an integrated circuit package |
| 12/26/2002 | US20020194729 Electronic component mounting method |
| 12/25/2002 | CN1387746A Printed circuit board assembly |
| 12/25/2002 | CN1387745A Copper foil excellent in laser beam drilling performance and production method therefor |
| 12/25/2002 | CN1387397A Method for mfg. PC board |
| 12/25/2002 | CN1387396A 阻抗测量结构 Impedance measurement structure |
| 12/25/2002 | CN1387395A Base board unit |
| 12/25/2002 | CN1387284A Electric contactor and electric connection device using same |
| 12/25/2002 | CN1387239A Circuit board, semiconductor device mfg. method, and electroplating system |
| 12/25/2002 | CN1387200A 电阻器 Resistor |
| 12/25/2002 | CN1387199A 电阻器 Resistor |
| 12/25/2002 | CN1387198A 电阻器 Resistor |
| 12/25/2002 | CN1097313C Lead frame mfg. method |
| 12/25/2002 | CN1097235C Method and apparatus for providing remotely located outrigger card electrically coupled to control card |
| 12/24/2002 | US6498951 Implantable medical device employing integral housing for a formable flat battery |
| 12/24/2002 | US6498759 System for automatic generation of suitable voltage source on motherboard |
| 12/24/2002 | US6498714 Copper wiring, dielectric oxide of anodic tantalum, and valve metal barrier layer; printed circuits |
| 12/24/2002 | US6498710 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 12/24/2002 | US6498708 Method and apparatus for mounting printed circuit board components |
| 12/24/2002 | US6498705 Electrical connection arrangement for a magnetic head of a floppy disk drive |
| 12/24/2002 | US6498636 Apparatus and method for substantially stress-free electrical connection to a liquid crystal display |
| 12/24/2002 | US6498355 High flux LED array |