H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/2002
11/21/2002	US20020172026 Electronic package with high density interconnect and associated methods
11/21/2002	US20020172023 Method for high-density, low-via-count, decoupling capacitor placement
11/21/2002	US20020172022 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
11/21/2002	US20020172021 Multi-layer wiring substrate
11/21/2002	US20020172019 Method of manufacturing printed wiring board
11/21/2002	US20020171992 Spark gap device having multiple nodes
11/21/2002	US20020171954 Rearview mirror assembly construction
11/21/2002	US20020171906 Rearview mirror constructed for efficient assembly
11/21/2002	US20020171733 Video scope utilized in electronic endoscope system
11/21/2002	US20020171634 Data input device using a laminated substrate capable of reliably filling through holes with electroconductive material
11/21/2002	US20020171591 Ball grid array antenna
11/21/2002	US20020171530 Production method of thin film passive element formed on printed circuit board and thin film passive element produced by the method
11/21/2002	US20020171508 Front end module
11/21/2002	US20020171157 Electronic device
11/21/2002	US20020171154 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
11/21/2002	US20020171141 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
11/21/2002	US20020171140 Tape carrier package (TCP) on which semiconductor chips are mounted and method of manufacuturing the same
11/21/2002	US20020171138 Multilayer wiring board and semiconductor device
11/21/2002	US20020171127 Apparatus for routing signals
11/21/2002	US20020171124 Insulators for high density circuits
11/21/2002	US20020171065 Circuit elements having an embedded conductive trace and methods of manufacture
11/21/2002	US20020170901 Equipotential fault tolerant integrated circuit heater
11/21/2002	US20020170890 Precision spray processes for direct write electronic components
11/21/2002	US20020170876 Method for manufacturing printed-circuit board
11/21/2002	US20020170748 Capacitor plate for substrate components
11/21/2002	US20020170747 Printed circuit board comprising an embedded functional element therein
11/21/2002	US20020170745 Multilayer board combound and method for the manufacture thereof
11/21/2002	US20020170744 Flexible circuit using discrete wiring
11/21/2002	US20020170740 Heat-resistant, flex-resistant flexible flat cable and process for producing the same
11/21/2002	US20020170732 Connection box
11/21/2002	US20020170660 Method for producing ceramic substrate
11/21/2002	US20020170173 Method of production of circuit board, semiconductor device, and plating system
11/21/2002	DE10141114C1 Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink
11/21/2002	DE10124328A1 Device for unsoldering electronic component has heat source at distance from bearer's component side so solder joint heating to melting point takes place indirectly by heating component
11/21/2002	DE10123684A1 Circuit board, e.g. for measurement equipment, has contact sleeve in aperture mechanically fixed and electrically connected to metallisation around aperture by solder joint
11/21/2002	DE10122701A1 Schaltungsmodul Circuit module
11/21/2002	DE10122221A1 Power electronics module with base plate and substrate soldered to it has base plate recess with at least dimensions of substrate and with wall regions inclined from out to in
11/21/2002	DE10120692A1 Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte A mounting arrangement of the electrical and / or electronic components on a printed circuit board
11/21/2002	DE10111683C1 Verfahren zur Herstellung eines Datenträgerkörpers A method for producing a data carrier body
11/21/2002	CA2441103A1 Polyimide adhesion enhancement to polyimide film
11/20/2002	EP1259103A1 Multilayer printed wiring board and method for producing multilayer printed wiring board
11/20/2002	EP1259102A1 Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same
11/20/2002	EP1258891A2 Resistors
11/20/2002	EP1258180A1 Method of printing and printing machine
11/20/2002	EP1258179A1 Electronic supports and methods and apparatus for forming apertures in electronic supports
11/20/2002	EP1258178A2 Electronic supports and methods and apparatus for forming apertures in electronic supports
11/20/2002	EP1257693A1 Composite copper foil and manufacturing method thereof
11/20/2002	EP1257438A1 Device for transmitting electric current between two components, which twist in relation to one another, of a steering device for motor vehicles
11/20/2002	EP0719442B1 Electrical assembly comprising a ptc resistive element
11/20/2002	CN1381160A Method for producing ceramic substrate
11/20/2002	CN1381159A Flexible board and information processor
11/20/2002	CN1381069A Module with built-in electronic elements and method of manufacture thereof
11/20/2002	CN1380812A Composite medium copper-covered aluiminium base plate and its production method
11/20/2002	CN1380666A Surface-mounted capacitor
11/20/2002	CN1380664A Method for manufacturing laminated ceramic electronic element, and method for mfg. laminated inductor
11/20/2002	CN1094717C PC board and fixing body thereof
11/20/2002	CN1094697C Tuning assembly for TV set
11/20/2002	CN1094674C Vibratory motor maintainer and portable electronic equipment with same apparatus
11/19/2002	US6484299 Method and apparatus for PCB array with compensated signal propagation
11/19/2002	US6483720 EMC protection in digital computers
11/19/2002	US6483715 Circuit board coupled with jacks
11/19/2002	US6483714 Multilayered wiring board
11/19/2002	US6483713 Multilayered board comprising folded flexible circuits
11/19/2002	US6483669 Integrated lead suspension with IC chip and method of manufacture
11/19/2002	US6483439 Multi color and omni directional warning lamp
11/19/2002	US6483421 Carrier substrate with a resistor track
11/19/2002	US6483406 High-frequency module using slot coupling
11/19/2002	US6483328 Probe card for probing wafers with raised contact elements
11/19/2002	US6483045 Via plug layout structure for connecting different metallic layers
11/19/2002	US6483042 Substrate for mounting semiconductor integrated circuit device
11/19/2002	US6483037 Multilayer flexible FR4 circuit
11/19/2002	US6482569 Process for forming a polyimide pattern with photosensitive composition for i-line stepper
11/19/2002	US6482529 Polyamideimide prepolymer, 1 to 25 parts by wt of a trifunctional ester, 0.5 to 15 parts by wt organo-reactive silane; corrosion resistance, electroconductivity
11/19/2002	US6482521 Structure with blended polymer conformal coating of controlled electrical resistivity
11/19/2002	US6482490 Printing sheet with base material, and method of manufacturing the same
11/19/2002	US6482014 Print board connector having rib for holding terminals
11/19/2002	US6482013 Microelectronic spring contact element and electronic component having a plurality of spring contact elements
11/19/2002	US6481323 Stamping apparatus having replaceable punches
11/19/2002	US6481101 Manufacture of a wiring loom
11/19/2002	US6481100 Wiring board manufacture method, wiring board, and electrical connection box
11/19/2002	CA2072826C Glasser for electronic substrates and products using said glasses
11/14/2002	WO2002091811A2 Throughplating of flexible printed boards
11/14/2002	WO2002091810A2 Printed circuit board
11/14/2002	WO2002091626A1 Miniaturized positional assembly and method of manufacturing
11/14/2002	WO2002091571A1 Method and apparatus for reducing electromagnetic radiation
11/14/2002	WO2002091522A1 Connector for printed circuit boards
11/14/2002	WO2002091515A1 Transmission line type components
11/14/2002	WO2002091405A1 High-frequency module device
11/14/2002	WO2002091340A1 Display module and display unit
11/14/2002	WO2002091322A2 Metalized dielectric substrates for eas tags
11/14/2002	WO2002090422A1 Polyimide composition having improved peel strength
11/14/2002	WO2002089664A2 Flex circuit shielded optical sensor and method of fabricating the same
11/14/2002	WO2002078052A3 Device with at least two organic electronic components and method for producing the same
11/14/2002	WO2002058413A3 Apparatus and method for operating a subscriber interface in a fixed wireless system
11/14/2002	US20020169256 Thermoset composition, method, and article
11/14/2002	US20020169225 Forming a nanoporous aerogel using a supercritical drying process, adding a reinforcing material and volatile compound to form an amalgamated layer; treating to increase strength; films; durability; integrated circuits
11/14/2002	US20020169063 Protective coating of such as resorcinol, isophthalic acid and terephthalic acid copolyester; photoyellowing resistance; gloss retention; solvent resistance; recyclability
11/14/2002	US20020168883 Connectors for circuit boards configured
11/14/2002	US20020168872 Insulators for high density circuits
11/14/2002	US20020168527 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom

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