Patents for H05K 1 - Printed circuits (98,583)
11/2002
11/07/2002WO2002089257A2 Connection housing for an electronic component
11/07/2002WO2002089222A1 Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler
11/07/2002WO2002089209A1 High-frequency module and its manufacturing method
11/07/2002WO2002089204A1 Semiconductor device
11/07/2002WO2002089152A1 Conductive materials with electrical stability for use in electronics devices
11/07/2002WO2002089021A1 High-frequency electronic component and its designing method
11/07/2002WO2002088835A1 Liquid crystal display device with alterable contrast and method for altering contrast during assembly of such a liquid crystal display device
11/07/2002WO2002088225A1 High dielectric polymer composites and methods of preparation thereof
11/07/2002WO2002087887A1 Recording head unit, manufacturing method thereof, and recorder using the unit
11/07/2002WO2002087870A1 Electric circuit components having multiple electric characteristics and methods of making such components
11/07/2002WO2001059885A9 Compliant pin and its method of manufacture
11/07/2002US20020166040 Modular architecture for high bandwidth computers
11/07/2002US20020165440 Flex circuit shielded optical sensor
11/07/2002US20020164903 Interference free connector
11/07/2002US20020164895 Integrated power delivery with flex circuit interconnection for high density high power circuits for integrated circuits and systems
11/07/2002US20020164542 Photosensitive insulating paste composition and photosensitive film made therefrom
11/07/2002US20020164475 Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate
11/07/2002US20020164469 Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets
11/07/2002US20020164467 Filling a through hole on a prepreg including a releasing resin film with a conductive paste containing a conductive filler; peeling said releasing resin film; laminating a metal foil; and heating and pressurizing the laminated product.
11/07/2002US20020164163 Flash device, lens-fitted photo film unit, camera, light measuring device, and method of producing lens-fitted photo film unit
11/07/2002US20020163818 Magnetic device and method of manufacture therefor
11/07/2002US20020163784 Memory module having balanced data i/o contacts pads
11/07/2002US20020163781 Integrated cooling of a printed circuit board structure
11/07/2002US20020163589 Solid-state image pickup device and method of producing the same
11/07/2002US20020163559 Ink jet printhead chip with predetermined micro-electromechanical systems height
11/07/2002US20020163434 Metalized dielectric substrates for EAS tags
11/07/2002US20020163388 Apparatus and method for tuning an inter-stage matching network of an integrated multistage amplifier
11/07/2002US20020163019 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
11/07/2002US20020163006 Light source
11/07/2002US20020162829 Thermally controlled circuit using planar resistive elements
11/07/2002US20020162684 Mounting substrate and structure having semiconductor element mounted on substrate
11/07/2002US20020162678 Electronic apparatus
11/07/2002US20020162628 Manufacturing method and manufacturing apparatus of thin-film laminate
11/07/2002US20020162626 Tape automated bonding for packing connection band of flat display
11/07/2002US20020162218 Substrate adhesion enhancement to film
11/07/2002US20020162216 Equipment for fitting out flexible printed circuits
11/07/2002US20020162215 Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
11/07/2002DE10200858A1 Hochdichtes Hochgeschwindigkeits-Anschlusssystem für asymmetrische Differenzialübertragungs-Anwendungen High-density high-speed connection system for asymmetric differential transmission applications
11/07/2002DE10121673A1 Gedruckte Leiterplatte Printed circuit board
11/07/2002DE10121126A1 Identifikationsträger und Verfahren zu dessen Herstellung Identification carrier and process for its preparation
11/07/2002DE10117907C1 Aufnahmevorrichtung für Arzneimittelblister Cradle for pharmaceutical blister
11/07/2002DE10116489A1 Electrical circuit arrangement e.g. for motor vehicle locking systems, has electrical components covered by screening cowling, made of electrically conducting material
11/07/2002DE10114572A1 Träger für eine elektrische Schaltung, insbesondere für einen elektrischen Schalter Carrier for an electric circuit, in particular for an electric switch
11/06/2002EP1255429A1 Electronic equipment and board insertion/removal apparatus therefor
11/06/2002EP1255428A2 Wiring board and method of manufacturing the same
11/06/2002EP1255427A1 Flexible printed circuit board
11/06/2002EP1255425A2 Flash device
11/06/2002EP1255338A1 Improved bus bar with terminal insulator and connector guide therefor
11/06/2002EP1255334A1 Fault tolerant electrical circuit and method
11/06/2002EP1255322A1 Crosstalk reduction for IDC terminal block
11/06/2002EP1255300A2 Semiconductor package
11/06/2002EP1255299A2 Power semiconductor device with pressure contact
11/06/2002EP1254592A1 Printed circuit board
11/06/2002EP1254494A1 Printed circuit board and connector assembly
11/06/2002EP1030381B1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer
11/06/2002EP1009868B1 Electrochemical deposition of a composite polymer-metal oxide
11/06/2002EP0986598B1 Liquid crystalline polyesters and molding compositions prepared therefrom
11/06/2002EP0975835B1 Dispersions of aramid fibres, and aramid sheets
11/06/2002EP0771833B1 Process of producing acid-modified polyphenylene ether and polystyrenic resin composition
11/06/2002CN1378768A Bidirectional interface tool for PWB development
11/06/2002CN1378713A Differential signal electrical connectors
11/06/2002CN1378420A High frequency module and its producing method
11/06/2002CN1378416A 通孔布线板 Through-hole circuit board
11/06/2002CN1378415A Printed circuit board wth space structure and its producing method
11/06/2002CN1377937A 液晶聚酯树脂组合物 The liquid crystal polyester resin composition
11/05/2002US6477694 Method for designing a power supply decoupling circuit
11/05/2002US6477603 Multiple PCI adapters within single PCI slot on an matax planar
11/05/2002US6477286 Integrated optoelectronic device, and integrated circuit device
11/05/2002US6477284 Photo-electric combined substrate, optical waveguide and manufacturing process therefor
11/05/2002US6477060 Dual channel bus routing using asymmetric striplines
11/05/2002US6477059 Board connection structure, electronic device with board connection structure and connector used therein
11/05/2002US6477058 Integrated circuit device package including multiple stacked components
11/05/2002US6477057 High frequency de-coupling via short circuits
11/05/2002US6477054 Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
11/05/2002US6477052 Multiple layer thin flexible circuit board
11/05/2002US6477038 Electronic appliance
11/05/2002US6477034 Interposer substrate with low inductance capacitive paths
11/05/2002US6477031 Electronic component for high frequency signals and method for fabricating the same
11/05/2002US6477016 Junction assembly of bonding pad and bump, and magnetic head device using the same
11/05/2002US6476775 Method for forming radio frequency antenna
11/05/2002US6476774 Composite injection mouldable material
11/05/2002US6476695 High frequency module
11/05/2002US6476476 Integrated circuit package including pin and barrel interconnects
11/05/2002US6476333 Raised contact structures (solder columns)
11/05/2002US6476332 Conductor systems for thick film electronic circuits
11/05/2002US6476330 Wiring substrate and process for producing the same
11/05/2002US6476314 Solar tile and associated method for fabricating the same
11/05/2002US6475924 Substrate and process for producing the same
11/05/2002US6475899 Low capacitance wiring layout and method for making same
11/05/2002US6475830 Flip chip and packaged memory module
11/05/2002US6475822 Method of making microelectronic contact structures
11/05/2002US6475638 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
11/05/2002US6475607 Dielectric ceramic composition and multilayered ceramic substrate
11/05/2002US6475606 Ceramic board for apparatuses for semiconductor manufacture and inspection
11/05/2002US6475555 Process for screening features on an electronic substrate with a low viscosity paste
11/05/2002US6475429 Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
11/05/2002US6475401 Process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process
11/05/2002US6475317 Method for manufacturing electronic component of laminated ceramics
11/05/2002US6475023 Surface mount holding feature
11/05/2002US6474997 Contact sheet