H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/2002
11/14/2002	US20020168510 High dielectric constant composite material and multilayer wiring board using the same
11/14/2002	US20020168504 Prepreg and process for manufacturing same
11/14/2002	US20020168475 Impregnating a glass fiber substrate; curing; heating
11/14/2002	US20020168223 Suppressing reduction of copper ions; using solution of ammonium persulfate and 1,4,8,11 tetraazundecane complexing agent
11/14/2002	US20020167830 Semiconductor device and process for manufacturing the same
11/14/2002	US20020167828 Leadframe-based module DC bus design to reduce module inductance
11/14/2002	US20020167805 Low profile circuit device for liquid crystal display and method for manufacturing the same
11/14/2002	US20020167803 Circuit module
11/14/2002	US20020167802 Printed circuit board
11/14/2002	US20020167783 Flexible conductor foil with an electronic circuit
11/14/2002	US20020167448 Antenna structure and communication apparatus including the same
11/14/2002	US20020167331 Middle pull-up point-to-point transceiving bus structure
11/14/2002	US20020167308 Miniaturized positional assembly and method of manufacturing
11/14/2002	US20020167301 Hall effect current sensor system packaging
11/14/2002	US20020167081 Semiconductor device
11/14/2002	US20020167080 Power distribution in multi-chip modules
11/14/2002	US20020167076 Semiconductor package and semiconductor package mounting method
11/14/2002	US20020167064 Substrate for mounting a semiconductor element thereon and semiconductor device comprising a semiconductor element mounted on said substrate
11/14/2002	US20020167063 Sensor circuit module and electronic device using the same
11/14/2002	US20020167013 Optoelectronic substrate
11/14/2002	US20020166696 Land grid array (LGA) pad repair structure and method
11/14/2002	US20020166694 Monolithic ceramic substrate and method for making the same
11/14/2002	US20020166690 Connection box
11/14/2002	US20020166689 High frequency semiconductor device housing package and mounting structure for mounting the same
11/14/2002	US20020166685 Circuit element mounting board and circuit element mounting method
11/14/2002	US20020166681 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
11/14/2002	US20020166680 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
11/14/2002	US20020166618 Capacitive filtered feedthrough array for an implantable medical device
11/14/2002	US20020166580 Method for fabricating a solar tile
11/14/2002	DE10219138A1 Verfahren zur Herstellung einer flexiblen Leiterplatte A process for producing a flexible circuit board
11/14/2002	DE10206442A1 Targetted passivation of conductive track intermediate space or track regions on circuit board by applying conductive adhesive in region of tracks formed
11/14/2002	DE10206441A1 Substrate surface used as support for components in microelectronics industry, e.g. thermal sensor, comprises layer containing conducting particles, and support layer acting as the base support for conducting layer
11/14/2002	DE10206440A1 Circuit board through-hole connection method, by filling holes or openings with conductive adhesive and mounting SMD components
11/14/2002	DE10206439A1 Method for producing strip conductor structures as a connection between electrical/electrooptical component terminals uses a thread-type conductor line to go between terminals to be linked and to contact them with its ends.
11/14/2002	DE10206438A1 Method for forming and creating strip conductor structures on a substrate prepares a draft circuit for electrostatic charge patterns to generate a strip conductor structure.
11/14/2002	DE10206437A1 Production of conducting pathways on a substrate e.g. in microelectronics comprises applying a defined conducting adhesive on the substrate, partially hardening and repeating the previous steps
11/14/2002	DE10206435A1 Adhesive bonding process for forming electrically conducting structures on a substrate comprises using a conducting adhesive or similar material having selected properties
11/14/2002	DE10206434A1 Process for the selective metallization of partial structures or regions comprises applying a conducting adhesive or producing a conducting path on a substrate, and selectively depositing metal on the conducting adhesive
11/14/2002	DE10206433A1 Device for producing electrical elements e.g. resistors comprises a capillary arrangement in a dispensing arrangement for applying a conducting adhesive
11/14/2002	DE10122720A1 Stack arrangement for an image sensor chip for electrically connecting to a circuit board
11/14/2002	DE10122414A1 Durchkontaktierung von flexiblen Leiterplatten Through connection of flexible printed circuits
11/14/2002	DE10122393A1 Flexible Leiterfolie mit einer elektronischen Schaltung Flexible conductor film with an electronic circuit
11/14/2002	CA2445901A1 Metalized dielectric substrates for eas tags
11/13/2002	EP1257156A2 Flexible conductor foil comprising an electronic circuit
11/13/2002	EP1257021A1 Device for building flexible printed circuits
11/13/2002	EP1257014A1 Printed circuit interface to an I/O connector
11/13/2002	EP1256998A2 Antenna structure and communication apparatus including the same
11/13/2002	EP1256982A1 Electronic Module and its Assembling Process
11/13/2002	EP1256829A2 Optoelectronic substrate for optical interconnections with a photonic crystal waveguide
11/13/2002	EP1256564A1 Halogen-containing aromatic compound
11/13/2002	EP1256387A2 Flip chip underfill system and method
11/13/2002	EP1256263A2 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
11/13/2002	EP1256146A2 Compliant pin and its method of manufacture
11/13/2002	EP1256144A1 Method for contacting a printed circuit board to a conductor arranged on a support, and device
11/13/2002	EP0842772B1 Printing method and apparatus
11/13/2002	CN1379800A Cyanate ester based thermoset compositions
11/13/2002	CN1379506A Electric contact device uisng resin welding flux, electric connector and connecting method
11/13/2002	CN1379503A Electric contact device using resin welding flux, electric connector and connecting method of distributing board
11/13/2002	CN1379498A Composite battery having internal breaker
11/13/2002	CN1379223A Method of determining deviation of printed circuit board drilling machine
11/12/2002	US6480925 Compact and versatile SCA to SCSI bus adapter
11/12/2002	US6480682 Photometric device comprising a photo sensor mounted on a circuit board
11/12/2002	US6480396 Printed circuit board and electronic equipment using the board
11/12/2002	US6480395 Device and method for interstitial components in a printed circuit board
11/12/2002	US6480394 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuits board
11/12/2002	US6480390 Card-type peripheral device
11/12/2002	US6480385 Electronic assembly and cooling thereof
11/12/2002	US6480370 Polymeric dielectric material for high-energy density capacitors
11/12/2002	US6480359 Hard disk drive suspension with integral flexible circuit
11/12/2002	US6480020 Printed circuit assembly having integrated resistors for terminating data and control lines of a host-peripheral interface
11/12/2002	US6480014 High density, high frequency memory chip modules having thermal management structures
11/12/2002	US6479765 Vialess printed circuit board
11/12/2002	US6479764 Via structure with dual current path
11/12/2002	US6479763 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
11/12/2002	US6479762 Printed circuit board having a pattern of traces formed by screen-printing
11/12/2002	US6479761 Circuit board with reduced noise architecture
11/12/2002	US6479760 Printed wiring board for semiconductor plastic package
11/12/2002	US6479758 Wiring board, semiconductor package and semiconductor device
11/12/2002	US6479756 Flexible wiring substrate and its manufacturing method
11/12/2002	US6479615 From pyromellitic acid and a diamino-phenyl derivative like 2,2*-bis-trifluoromethyl-benzidene and a second aromatic diamine; insulation on a metal foil
11/12/2002	US6479596 Epoxy acrylates
11/12/2002	US6479578 Molding materials; wear, friction and heat resistance, dielectrics; blend of fluoropolymer and filler
11/12/2002	US6479318 Method of manufacturing a substrate with directionally anisotropic warping
11/12/2002	US6479170 Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil
11/12/2002	US6479136 Substrate of circuit board
11/12/2002	US6479120 Printed pattern defect repair sheet, and repair device and method for printed pattern defect
11/12/2002	US6478906 Method for bonding a flexible substrate to a chip
11/12/2002	US6478882 Conductive paste and laminated ceramic electronic component using the same
11/12/2002	US6478585 Electrical connection box for a vehicle
11/12/2002	US6477771 Terminal crimping method and terminal crimping apparatus
11/12/2002	CA2184858C Shelf for housing printed circuit boards
11/07/2002	WO2002089553A1 Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board
11/07/2002	WO2002089546A1 Substrate adhesion enhancement to film
11/07/2002	WO2002089544A1 Wiring board and soldering method therefor
11/07/2002	WO2002089543A1 Protection of conductive connection by electrophoresis coating and structure formed thereof
11/07/2002	WO2002089541A2 Defferential connector footprint for a multi-layer circuit board
11/07/2002	WO2002089539A1 Integrated cooling of a printed circuit board structure
11/07/2002	WO2002089338A2 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
11/07/2002	WO2002089319A2 Apparatus and method for tuning an inter-stage matching network of an integrated multistage amplifier
11/07/2002	WO2002089260A2 Separable power delivery connector

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