H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/2002
11/05/2002	US6474996 Circuit member connection structure
11/05/2002	US6474438 Power steering
11/05/2002	US6473963 Method of making electrical circuit board
11/05/2002	CA2055310C Injection-moulded printed circuit boards by injection-moulding thermoplastic materials onto the back of the flexible circuits
10/2002
10/31/2002	WO2002087296A1 Circuit board, circuit board mounting method, and electronic device using the circuit board
10/31/2002	WO2002087294A1 A method for forming a printed circuit board and a printed circuit board formed thereby
10/31/2002	WO2002087070A1 Piezoelectric oscillator and its manufacturing method
10/31/2002	WO2002087024A1 Compliant interposer for single-sided electronic package attachment
10/31/2002	WO2002086924A1 Method of producing electronic parts, and member for production thereof
10/31/2002	WO2002086922A1 Micro-replicated miniaturised electric components
10/31/2002	WO2002085616A1 Laminate for electronic material
10/31/2002	WO2002066485A3 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
10/31/2002	WO2002023629A3 Electronic device manufacture
10/31/2002	US20020162083 Mid-connect architecture with point-to-point connections for high speed data transfer
10/31/2002	US20020162039 Power delivery system for a microprocessor
10/31/2002	US20020161100 Embedding resin, wiring substrate using same and process for producing wiring substrate using same
10/31/2002	US20020161094 Solid surface sheet materials containing synthetic mica
10/31/2002	US20020161077 Heat-resistant composition
10/31/2002	US20020160903 Method for manufacturing aluminum nitride sintered body in which via hole is made
10/31/2002	US20020160786 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
10/31/2002	US20020160540 Electronic component and method for forming substrate electrode of the same
10/31/2002	US20020160211 Flexible metal-clad laminate and process for preparing the same
10/31/2002	US20020160165 Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof
10/31/2002	US20020159436 Filter switching circuit having a shorter distance of connection for a higher frequency passband
10/31/2002	US20020159284 Memory system
10/31/2002	US20020159243 Wiring board
10/31/2002	US20020159242 Module with built-in electronic elements and method of manufacture thereof
10/31/2002	US20020159238 Mounting configuration of electric and/or electronic components on a printed circuit board
10/31/2002	US20020159225 Heat insulation structure of electric junction box
10/31/2002	US20020159213 Methods and systems for reducing clamp voltages in surge protection circuitry
10/31/2002	US20020158962 Printer Device
10/31/2002	US20020158944 Flexible circuit board and method of fabricating the same
10/31/2002	US20020158841 Coordinate input device having strain gauges capable of being surface-mounted without flux cleaning
10/31/2002	US20020158840 Coordinate input device having reduced number of components, being easy to assemble, and including deformation detecting elements
10/31/2002	US20020158722 High frequency circuit substrate and method for forming the same
10/31/2002	US20020158639 Laminate with an inside layer circuit used for multilayer printed circuit board for a high frequency circuit ,and method and device for measuring circuit impedance of the laminate with inside layer circuit
10/31/2002	US20020158341 Semiconductor package
10/31/2002	US20020158326 Semiconductor device and semiconductor device manufacturing method
10/31/2002	US20020158305 Organic substrate having integrated passive components
10/31/2002	US20020158300 Fault tolerant electrical circuit and method
10/31/2002	US20020158235 Negative actinic ray-sensitive paste and pattern-forming method by use of the same
10/31/2002	US20020158110 Structure to accommodate increase in volume expansion during solder reflow
10/31/2002	US20020158043 Method of fabricating a flexible circuit board
10/31/2002	US20020157865 Flexible flat circuitry with improved shielding
10/31/2002	US20020157864 Multilayer wiring board and method of fabrication thereof
10/31/2002	US20020157862 Circuit forming board and method of manufacturing circuit forming board
10/31/2002	US20020157859 Lightweight circuit board with conductive constraining cores
10/31/2002	US20020157857 Tape carrier having high flexibility with high density wiring patterns
10/31/2002	US20020157856 Protection of conductive connection by electrophoresis coating and structure formed thereof
10/31/2002	US20020157760 Method of producing ceramic multilayer substrate
10/31/2002	US20020157546 Mask and screening method for double pass screening
10/31/2002	US20020157225 Method and apparatus for manufacturing monolithic ceramic electronic component
10/31/2002	DE10218492A1 Laminate for automatic TAB-bands (sic), film capacitors, and printed wiring plates is obtained from aromatic liquid crystalline polyester and metal substrate
10/31/2002	DE10218090A1 Leiterplatte Circuit board
10/31/2002	DE10162948A1 Halbleiterbauelement eines LGA-Typs und Verfahren zum Anbringen des Halbleiterbauelements A semiconductor device of a LGA type, and method of mounting of the semiconductor component
10/31/2002	DE10142472A1 Electronic high voltage and power component comprises external contact pins and/or external contact lug protruding from a housing and partially surrounded by a heat conducting protective layer based on an organic ceramic
10/30/2002	EP1253814A2 Heat insulation structure of electric junction box
10/30/2002	EP1253811A1 Thermosetting resin composition and process for producing the same
10/30/2002	EP1253808A2 Electrical heating device, in particular for use in vehicles
10/30/2002	EP1253807A2 Electrical heating device, in particular for use in vehicles
10/30/2002	EP1253650A2 Surface-mount type light emitting diode
10/30/2002	EP1253636A1 Electronic equipment
10/30/2002	EP1253605A2 Power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit
10/30/2002	EP1252804A1 Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
10/30/2002	EP1252655A1 Microwave ic package with dual mode wave guide
10/30/2002	EP1060141B1 Impregnated glass fiber strands and products including the same
10/30/2002	CN2519586Y High-frequency connecting terminal table structure
10/30/2002	CN2519585Y Photoelectric transfer module
10/30/2002	CN2519584Y Electric control device for high-low voltage rare oil station
10/30/2002	CN2519490Y Low rack and panel construction signal change over module guidance rack assembly
10/30/2002	CN1377569A Wiring board having connector and method of manufacturing the same
10/30/2002	CN1377516A Universal energy conditioning interposer with circuit architecture
10/30/2002	CN1377217A Multi-layer circuit board assembly, unit thereof and manufacture thereof
10/30/2002	CN1377216A 线路板 PCB
10/30/2002	CN1377215A Manufacturing method for circuit device
10/30/2002	CN1377172A Mounting structure of telephone mouthpiece
10/30/2002	CN1376554A Dielectric base plate for laser process and process method thereof, semiconductor components and manufacturing method thereof
10/30/2002	CN1093689C Semiconductor chip package and manufacture thereof
10/29/2002	US6473570 Camera having flexible circuit board
10/29/2002	US6473314 RF power amplifier assembly employing multi-layer RF blocking filter
10/29/2002	US6473312 Printed circuit board, printed circuit board module and electronic device adapting same
10/29/2002	US6473293 Capacitor unit, method for producing the same, and solid electrolytic capacitor
10/29/2002	US6473146 Liquid crystal display device and a method for manufacturing a grounding device
10/29/2002	US6472960 Complex circuit board with an electrode and air gap between dielectric and magnetic substrates
10/29/2002	US6472820 Plasma display panel
10/29/2002	US6472735 Three-dimensional memory stacking using anisotropic epoxy interconnections
10/29/2002	US6472734 Stacked semiconductor device and method for manufacturing the same
10/29/2002	US6472726 Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment
10/29/2002	US6472724 Electronic device structure capable of preventing malfunction caused by electromagnetic wave coming from outside
10/29/2002	US6472613 Low-inductance connector for printed-circuit board
10/29/2002	US6472612 Printed circuit board with embedded thermocouple junctions
10/29/2002	US6472608 Semiconductor device
10/29/2002	US6472607 Electronic circuit board with known flow soldering warp direction
10/29/2002	US6472599 Arrangement for supplying power from a buss bar to a circuit board
10/29/2002	US6472082 Modified thermoplastic norbornene polymer and process for the production thereof
10/29/2002	US6472080 Thin copper film directly bonded polyimide film and method of manufacturing the same
10/29/2002	US6472074 Dielectric ceramic composition
10/29/2002	US6471805 Method of forming metal contact pads on a metal support substrate
10/29/2002	US6471538 Contact structure and production method thereof and probe contact assembly using same
10/29/2002	US6471525 Shielded carrier for land grid array connectors and a process for fabricating same

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