| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/18/2002 | CN1386032A Front module |
| 12/18/2002 | CN1386031A Antenna strucure and communication apparatus having same |
| 12/18/2002 | CN1385929A Interface for printed circuit with I/O connector |
| 12/18/2002 | CN1385427A Halogen contained aromatic compound |
| 12/18/2002 | CN1096826C Method for detecting deterioration of solder paste printing |
| 12/18/2002 | CN1096824C Flexible printed circuit composition piece and process for producing the same |
| 12/18/2002 | CN1096689C Terminal installation structure |
| 12/18/2002 | CN1096685C Thick film conductor paste compositions for aluminium nitride substrates |
| 12/17/2002 | US6496886 Directional coupling bus system using printed board |
| 12/17/2002 | US6496404 Memory system for use on a circuit board in which the number of loads is minimized |
| 12/17/2002 | US6496382 Radio frequency identification tag |
| 12/17/2002 | US6496380 High capacity memory module with high electrical design margins |
| 12/17/2002 | US6496377 Vehicle electric power distribution system |
| 12/17/2002 | US6496376 Modular backplane |
| 12/17/2002 | US6496356 Multilayer capacitance structure and circuit board containing the same and method of forming the same |
| 12/17/2002 | US6496314 Recording/playback apparatus with electric wave transmission |
| 12/17/2002 | US6495912 Structure of ceramic package with integrated passive devices |
| 12/17/2002 | US6495895 Bi-level multilayered microelectronic device package with an integral window |
| 12/17/2002 | US6495836 Two-dimensional image pickup apparatus |
| 12/17/2002 | US6495772 High performance dense wire for printed circuit board |
| 12/17/2002 | US6495769 Wiring board and production method thereof, and semiconductor apparatus |
| 12/17/2002 | US6495768 Tape carrier package and method of fabricating the same |
| 12/17/2002 | US6495244 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives |
| 12/17/2002 | US6494522 Door module with electrical wires and connectors |
| 12/17/2002 | US6494174 Wiring harness assembly for an intake manifold |
| 12/17/2002 | US6494118 Method and equipment for removing insulation from a flat cable |
| 12/17/2002 | US6494092 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor |
| 12/17/2002 | US6493933 Method of making flexible electronic circuitry |
| 12/12/2002 | WO2002100142A1 Wiring board and its production method |
| 12/12/2002 | WO2002100140A2 Circuit board with at least one electronic component |
| 12/12/2002 | WO2002100137A1 Method and device for structuring printed circuit boards |
| 12/12/2002 | WO2002100136A1 Composite copper foil with copper or copper alloy support body, and printed circuit board using the composite copper foil |
| 12/12/2002 | WO2002100135A2 Flexible polyimide circuitsubstrates having predeterminded slopedvias |
| 12/12/2002 | WO2002099876A1 Semiconductor device |
| 12/12/2002 | WO2002099851A2 Temperature controlled vacuum chuck |
| 12/12/2002 | WO2002099850A2 Interchangeable microdeposition head apparatus and method |
| 12/12/2002 | WO2002099849A2 Apparatus for microdeposition of multiple fluid materials |
| 12/12/2002 | WO2002099848A2 Formation of printed circuit board structures using piezo microdeposition |
| 12/12/2002 | WO2002099665A1 Signal buffers for printed circuit boards |
| 12/12/2002 | WO2002099490A2 Housing and mounting structure for optical connectors |
| 12/12/2002 | WO2002098974A1 Resin composition, prepreg, and layered product |
| 12/12/2002 | WO2002098638A1 Three-dimensional nonwoven substrate for circuit board |
| 12/12/2002 | WO2002098596A1 Machining device and machining method |
| 12/12/2002 | WO2002098576A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 12/12/2002 | WO2002098575A1 Over-clocking in a microdeposition control system to improve resolution |
| 12/12/2002 | WO2002098574A1 Microdeposition apparatus |
| 12/12/2002 | WO2002098573A1 Waveform generator for microdeposition control system |
| 12/12/2002 | WO2002082472A3 The use of conductor compositions in electronic circuits |
| 12/12/2002 | WO2002080302A3 Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing |
| 12/12/2002 | US20020188787 Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer |
| 12/12/2002 | US20020187803 Folding electronic apparatus and flexible substrate thereof |
| 12/12/2002 | US20020187689 Bonded structure and electronic circuit board |
| 12/12/2002 | US20020187681 Quadrax to twinax conversion apparatus and method |
| 12/12/2002 | US20020187661 Low inductance power connector and method of reducing inductance in an electrical connector |
| 12/12/2002 | US20020187585 Ball grid array module and method of manufacturing same |
| 12/12/2002 | US20020187352 Insulating film having improved adhesive strength and board having the insulating film |
| 12/12/2002 | US20020187334 Two-metal tab tape, double-sided csp tape, bga tape and method for manufacturing the same |
| 12/12/2002 | US20020187321 Utilizing a transparentizing composition comprising an acrylated epoxy oligomer and a blend of acrylate monomers; curing |
| 12/12/2002 | US20020187318 Lead frame and production process thereof and production process of thermally conductive substrate |
| 12/12/2002 | US20020187317 Metal powder containing not less than 95 mass % of Ag, a sintering restrainer containing Cr and/or Cr compound, a dielectric loss conditioner containing Mn and/or Mn compound, and a vehicle |
| 12/12/2002 | US20020187316 Hole fill composition and method for filling holes in a substrate |
| 12/12/2002 | US20020187267 Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use |
| 12/12/2002 | US20020186553 Converter device |
| 12/12/2002 | US20020186552 Module component and method of manufacturing the same |
| 12/12/2002 | US20020186551 Electronic control unit having flexible wires connecting connector to circuit board |
| 12/12/2002 | US20020186550 Circuit board protection cover and circuit board having circuit board protection cover |
| 12/12/2002 | US20020186543 Circuit arrangement |
| 12/12/2002 | US20020186542 Heat sink of module with built-in IC |
| 12/12/2002 | US20020186100 Isolating energy conditioning shield assembly |
| 12/12/2002 | US20020186096 Power splitter |
| 12/12/2002 | US20020186034 Apparatus for producing and testing electronic units |
| 12/12/2002 | US20020185747 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 12/12/2002 | US20020185731 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 12/12/2002 | US20020185718 Semiconductor device packaging structure |
| 12/12/2002 | US20020185482 Tab circuit for ink jet printer cartridges |
| 12/12/2002 | US20020185310 Printed circuit board with resistive material for absorbing spurious modes |
| 12/12/2002 | US20020185308 Depopulation of a ball grid array to allow via placement |
| 12/12/2002 | US20020185307 Printed circuit board |
| 12/12/2002 | US20020185305 Packaging substrate with electrostatic discharge protection |
| 12/12/2002 | US20020185303 Wiring circuit board and method for producing same |
| 12/12/2002 | US20020185302 Method for manufacturing a multi-layer printed circuit board |
| 12/12/2002 | US20020185221 Continuously bonding metal foil to a surface(s) of a prepreg having multiple layers of thermosetting resin; printed circuit boards; high sheet thickness precision (thickness accuracy); stable impedance; electronics/communication |
| 12/12/2002 | US20020184759 Process for producing a contact-making device |
| 12/12/2002 | DE10127334A1 Leiterplatte Circuit board |
| 12/12/2002 | DE10125597A1 Network for connection of memory chips on a DIMM circuit board ensures that the connection sections have matching impedance so that the memory can be operated at higher frequencies |
| 12/12/2002 | DE10125025A1 Circuit board for memory components has contacts on first surface associated with memory component contacts, contact spheres connecting component and board contacts, conducting tracks |
| 12/12/2002 | DE10124117A1 Circuit board with contacted surface mount unit and associated surface mount units has SMD functional part that penetrates to below solder pad plane or lies beneath solder pad plane |
| 12/12/2002 | DE10109786A1 Verfahren zur Herstellung von Leiterplatten Process for the preparation of printed circuit boards |
| 12/11/2002 | EP1265468A2 Method for manufacturing a composite member |
| 12/11/2002 | EP1265466A2 Method for fabrication wiring board provided with passive element and wiring board provided with passive element |
| 12/11/2002 | EP1265465A2 Printed circuit board |
| 12/11/2002 | EP1265464A2 Electronic component and method of manufacturing the same |
| 12/11/2002 | EP1265463A2 Method for manufacturing circuit board and circuit board and power conversion module using the same |
| 12/11/2002 | EP1265282A2 Circuit Assembly |
| 12/11/2002 | EP1264804A1 Process for manufacturing inorganic article, inorganic article, and circuit substrate |
| 12/11/2002 | EP1264683A1 Copper-clad laminate |
| 12/11/2002 | EP1264377A1 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways |
| 12/11/2002 | EP1264347A2 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 12/11/2002 | EP1263891A1 Uv curable ferromagnetic compositions |
| 12/11/2002 | EP1263877A1 Melt-processible poly(tetrafluoroethylene) |