H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/2002
11/28/2002	US20020175407 Flip chip package, circuit board thereof and packaging method thereof
11/28/2002	US20020175405 Insulators for high density circuits
11/28/2002	US20020175402 Structure and method of embedding components in multi-layer substrates
11/28/2002	US20020175397 Wiring substrate and method for producing the same
11/28/2002	US20020175396 Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same
11/28/2002	US20020174937 Methods and apparatus for manufacturing patterned ceramic green-sheets and multilayered ceramic devices
11/28/2002	US20020174936 Cast-on-resist (COR) methods; Multilayered Microfluidic Device (MMD) for example
11/28/2002	US20020174935 Methods for manufacturing patterned ceramic green-sheets and multilayered ceramic packages
11/28/2002	DE10222421A1 Video scope for electronic endoscope system, has wiring pattern extending from electronic package to connector, which is grounded when not in use
11/28/2002	DE10123249A1 Circuit with bearer arrangement has at least two circuit boards electrically connected together by contacts attached to bearer arrangement, other components connected via the contacts
11/28/2002	DE10121970A1 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact
11/28/2002	DE10120256C1 Anschlußgehäuse für ein elektronisches Bauelement Connection housing for an electronic component
11/28/2002	CA2447860A1 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield
11/27/2002	EP1261243A2 Method of manufacturing printed wiring board
11/27/2002	EP1261241A1 Resistor and printed wiring board embedding those resistor
11/27/2002	EP1261143A1 Transceiver front end module
11/27/2002	EP1261028A2 Cooling arrangement for an electronic apparatus
11/27/2002	EP1261026A1 Device having resin package and method of producing the same
11/27/2002	EP1261021A2 Method of production of circuit board, semiconductor device, and plating system
11/27/2002	EP1260998A1 Electronic component-use substrate and electronic component
11/27/2002	EP1260359A2 Method for manufacturing a laminated board
11/27/2002	EP1260121A1 A printed circuit board assembly with improved bypass decoupling for bga packages
11/27/2002	EP1259866A2 Apparatus for providing regulated power to an integrated circuit
11/27/2002	EP1157459B1 Filter structures for integrated circuit interfaces
11/27/2002	EP0932500A4 Method to control cavity dimensions of fired multilayer circuit boards on a support
11/27/2002	EP0921887B1 Method and apparatus for forming termination stripes
11/27/2002	EP0919375B1 Method for controlling screen printing machine
11/27/2002	CN1382317A Control device and soldering method
11/27/2002	CN1382085A Laminate and process for producing same
11/27/2002	CN1382010A Printed circuit board and its making method and circuit module with printed circuit board
11/27/2002	CN1382009A Flexible printed circuit board with reinforced board
11/27/2002	CN1382008A Improved bonding strength between conductive paste and printed substrate and its production method
11/27/2002	CN1381935A Impact protection device containing hot melt sheet spring, melt sheet pulling and hoop device
11/27/2002	CN1381927A PGA socket and contact
11/27/2002	CN1381891A Semiconductor packaging device and mounting method of semiconductor packaging device
11/27/2002	CN1381888A Wiring pad with edge reinforcing structure for integrated circuit
11/27/2002	CN1381833A 结合柔性布线电路板 Combined with the flexible wired circuit board
11/27/2002	CN1095319C Circuit board assembly and heat conducting device
11/27/2002	CN1095176C Thin-film capacitor and its manufacturing method and hybrid circuit substrate and its assembling method
11/27/2002	CN1095175C Manufacturing method and apparatus for ceramic electronic components
11/27/2002	CN1095173C Rigid/flex printed circuit board and manufacturing method therefor
11/27/2002	CN1095084C Optical/electrical hybrid wiring board and its manufacturing method
11/27/2002	CN1095011C Dispersions of polyaryl aramid fibres and sheet
11/26/2002	US6487088 Package substrate
11/26/2002	US6487086 Circuit module
11/26/2002	US6487084 Printed circuit board comprising an embedded functional element therein
11/26/2002	US6487083 Multilayer circuit board
11/26/2002	US6487082 Printed circuit board component packaging
11/26/2002	US6487078 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
11/26/2002	US6487048 Conductive coating of flexible circuits for ils transmission lines
11/26/2002	US6487047 Trace interconnect array having increased bandwidth by selective etching of traces and dielectric substrate
11/26/2002	US6486696 Termination structure for high speed, high pin density chips
11/26/2002	US6486589 Circuit card assembly having controlled vibrational properties
11/26/2002	US6486551 Wired board and method of producing the same
11/26/2002	US6486415 Compliant layer for encapsulated columns
11/26/2002	US6486414 Through-hole structure and printed circuit board including the through-hole structure
11/26/2002	US6486413 Substrate coated with a conductive layer and manufacturing method thereof
11/26/2002	US6486412 Wiring board, method for producing same, display device, and electronic device
11/26/2002	US6486409 Flexible wiring substrate
11/26/2002	US6486408 Flexible circuit using discrete wiring
11/26/2002	US6486394 Process for producing connecting conductors
11/26/2002	US6486242 Flame-retardant resin composition and prepreg and laminate using the same
11/26/2002	US6486235 Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH)
11/26/2002	US6486071 Spherical shaped semiconductor integrated circuit
11/26/2002	US6485999 Wiring arrangements having electrically conductive cross connections and method for producing same
11/26/2002	US6485856 Non-woven fiber webs
11/26/2002	US6485833 Resin-coated metal foil
11/26/2002	US6485828 Tensile strength; having no self fusion-bonding ability or self-adhering ability
11/26/2002	US6485814 High density thin film circuit board and method of production thereof
11/26/2002	US6485591 Method for manufacturing laminated-ceramic electronic components
11/26/2002	US6485310 Assembly including a flex circuit and a gas tight chamber
11/26/2002	US6485309 Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies
11/26/2002	US6485112 Assembly, with lead frame, for antilock brake system and associated method
11/26/2002	US6484393 Method for wire bonding to flexible substrates
11/21/2002	WO2002093992A1 Printed circuit board comprising a contact sleeve that is mounted thereon
11/21/2002	WO2002093990A2 Polyimide adhesion enhancement to polyimide film
11/21/2002	WO2002093685A1 Ball grid array antenna
11/21/2002	WO2002093649A2 Electronic module and method for assembling same
11/21/2002	WO2002093647A2 Electronic package with high density interconnect and associated methods
11/21/2002	WO2002093473A1 Product comprising product sub-parts connected to each other by a crimp connection
11/21/2002	WO2002093472A1 Method for producing a contactless chip card using transfer paper
11/21/2002	WO2002092903A1 Glass cloth and use thereof
11/21/2002	WO2002092276A1 Method and device for laser beam machining of laminated material
11/21/2002	WO2002069680A3 Adapter for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
11/21/2002	WO2002067614A3 Method for establishing a priority call in a fixed wireless access communication system
11/21/2002	WO2002067613A3 Apparatus for reallocating communication resources to establish a priority call in a fixed wireless access communication system
11/21/2002	WO2002066256A3 Process for the manufacture of printed circuit boards with plated resistors
11/21/2002	WO2002058444A3 High-g mounting arrangement for electronic chip carrier
11/21/2002	WO2002058409A3 Apparatus and method for creating signal and channel profiles at a receiving station
11/21/2002	WO2002025732A3 Power module with integrated capacitor
11/21/2002	US20020174029 Method for collecting semiconductor devices and method for selling and using semiconductor devices
11/21/2002	US20020173202 Printed circuit board mounted electrical connector
11/21/2002	US20020173192 Power semiconductor module with pressure contact means
11/21/2002	US20020173178 Peripheral circuit board for a liquid crystal display device and liquid crystal display device equipped therewith
11/21/2002	US20020173175 Interposer member having apertures for relieving stress and increasing contact compliancy
11/21/2002	US20020173072 Connecting data processing plates to electrical contactors
11/21/2002	US20020172832 Process for producing a thin film el device
11/21/2002	US20020172828 Composite metal titanate in plate form and method for preparation thereof
11/21/2002	US20020172652 Composition for film formation and material for insulating film formation
11/21/2002	US20020172351 Circuit board capacitor structure for forming a high voltage isolation barrier

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