H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
10/2002
10/29/2002	US6471415 Multiconductor interconnect
10/29/2002	US6471109 Method and apparatus for soldering and soldering land of a printed circuit board
10/29/2002	US6470797 Apparatus for pad printing a conductive picture on an irregular surface
10/29/2002	US6470545 Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate
10/24/2002	WO2002085085A1 Connecting method for structure with implantable electrodes
10/24/2002	WO2002085083A1 Method for bonding flexible printed circuit boards and/or metal foils
10/24/2002	WO2002085082A1 Surface mounting type electronic component
10/24/2002	WO2002084893A1 Data processing terminal, terminal designing device and method, computer program, information storing medium
10/24/2002	WO2002083610A1 Curable polyvinylbenzyl compound and process for producing the same
10/24/2002	WO2002083549A1 Printed circuit board integrated switch
10/24/2002	WO2002083327A1 Layered stacks and methods of production thereof
10/24/2002	WO2002083056A1 Receiving device for drug blisters
10/24/2002	WO2002067643A3 High strength vias
10/24/2002	WO2002058234A3 High frequency printed circuit board via
10/24/2002	WO2002056652A3 Method for the production of an electronic component
10/24/2002	WO2002039793A3 Multi-layer printed circuit board fabrication system and method
10/24/2002	US20020157077 Printed board designing apparatus, printed board designing method, and recording medium on which control program for printed board design is recorded
10/24/2002	US20020156538 Data processing system and associated control chip and printed circuit board
10/24/2002	US20020156140 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board
10/24/2002	US20020155743 PGA socket and contact
10/24/2002	US20020155735 Contact structure and production method thereof and probe contact assembly using same
10/24/2002	US20020155710 HDD suspension and its manufacture
10/24/2002	US20020155298 Mixture of epoxy resins, curing agents, solvent and organophosphorus compound
10/24/2002	US20020155264 Monolithic ceramic sunstrate, manufacturing and designing methods therefor, and electronic device
10/24/2002	US20020155021 To be used in a printed board comprising a polyimide substrate
10/24/2002	US20020154592 Superimposing circuit module
10/24/2002	US20020154520 Intrinsically safe universal switching power supply
10/24/2002	US20020154492 Assembling structure of electronic device
10/24/2002	US20020154490 Electronic equipment and board insertion/removal apparatus therefor
10/24/2002	US20020154050 Integrally molded remote entry transmitter
10/24/2002	US20020153976 Short coaxial transmission line and method for use thereof
10/24/2002	US20020153872 Switching power-supply module
10/24/2002	US20020153613 Multi-layer circuit board
10/24/2002	US20020153611 Wiring substrate
10/24/2002	US20020153608 Land grid array semiconductor device and method of mounting land grid array semiconductor devices
10/24/2002	US20020153605 Packaging structure for ball grid array
10/24/2002	US20020153602 Ball grid array chip packages having improved testing and stacking characteristics
10/24/2002	US20020153582 High-frequency module and method for manufacturing the same
10/24/2002	US20020153513 Conductive paste, method of controlling viscosity thereof and electronic component using the same
10/24/2002	US20020153419 Modular architecture sensing and computing platform
10/24/2002	US20020153167 UHF ground interconnects
10/24/2002	US20020153166 Conductive pads layout for BGA packaging structure
10/24/2002	US20020153165 Electric circuit board including glass substrate and method and apparatus trimming thereof
10/24/2002	US20020153164 Multi-layer circuit board
10/24/2002	US20020153092 Methods of positioning components using liquid prime movers and related structures
10/24/2002	US20020152610 Electronic circuit device and method of production of the same
10/24/2002	US20020152609 Method and device for coupling PCB sheet
10/24/2002	DE10216026A1 Anschlußkasten und Kabelbaum-Verbindungsverfahren Junction box and wiring harness connection method
10/24/2002	DE10210286A1 Low temperature-fired porcelain for use in laminated dielectric filter, has predetermined quantities of barium oxide, silicon dioxide, aluminum trioxide, boron trioxide, zinc oxide and bismuth trioxide, respectively
10/24/2002	DE10130592C1 Module component used for storage modules for data processing comprises a main module and sub-modules
10/24/2002	DE10118866A1 Radar antenna with metal foil coating is made by separate injection molding of plastic part and electroforming of metal foil and joining them with adhesive
10/24/2002	DE10118384A1 Anordnung zur Kühlung eines Leistungs-Halbleiterelementes Arrangement for cooling a power semiconductor element
10/24/2002	DE10112324A1 Elektronische Schaltung zur Datenfernübertragung An electronic circuit for data transmission
10/24/2002	DE10109087A1 Verfahren zum Herstellen eines Formbauteils mit einer integrierten Leiterbahn A method for producing a shaped component with an integrated conductor track
10/24/2002	CA2442030A1 Layered stacks and methods of production thereof
10/23/2002	EP1251724A2 Electric circuit board including glass substrate and method and apparatus for trimming thereof
10/23/2002	EP1251580A1 Integrated microwave module and corresponding method for manufacturing it
10/23/2002	EP1251530A2 Dielectric laminate for a capacitor
10/23/2002	EP1251528A2 Surge protection device
10/23/2002	EP1251358A2 Device for and method of manufacturing and testing electronic modules
10/23/2002	EP1154914B1 Control apparatus for an automobile
10/23/2002	EP1002452B1 Contact arrangement linking two substrates and method for the production of said contact arrangement
10/23/2002	EP0972318B1 Electrical connection between a circuit support and a strip conductor support
10/23/2002	CN2518298Y Signal transmitting device
10/23/2002	CN1376021A Multi-layered base plate with built-in capacitor and is making process
10/23/2002	CN1376018A Multi-layer printed wiring base plate and mfg. method thereof
10/23/2002	CN1375867A Radiating structure of integrated circuit (IC)
10/23/2002	CN1375864A Base-plate terminal structure, liquid crystal device and electronic device
10/23/2002	CN1375840A Electronic element and making method thereof
10/23/2002	CN1093367C Multi-layer printed circuit board and method for manufacturing same
10/23/2002	CN1093366C Polyimidahenzoxazole dielectric film and printed wiring board(s) made from said film
10/23/2002	CN1093318C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/23/2002	CN1093179C Foil with controlled properties for printed circuit board and procedures and electrolyte bath solutions for preparing same
10/23/2002	CN1093020C Nickel powder and process for preparing same
10/22/2002	USRE37893 Cable assembly with equalizer board
10/22/2002	US6470133 Integrated circuit electronic equipment and method of assembly which uses said integrated circuit
10/22/2002	US6470103 Semiconductor parts and semiconductor mounting apparatus
10/22/2002	US6469908 Dual-socket interposer and method of fabrication therefor
10/22/2002	US6469907 Packaging for power and other circuitry
10/22/2002	US6469903 Flexible printed circuit and semiconductor device
10/22/2002	US6469614 Printed circuit boards having at least one metal layer
10/22/2002	US6469595 Isolating energy conditioning shield assembly
10/22/2002	US6469530 Method and apparatus for testing of ball grid array circuitry
10/22/2002	US6469494 Programmable connector
10/22/2002	US6469486 Flux equalized transformer circuit
10/22/2002	US6469393 Semiconductor package and mount board
10/22/2002	US6469378 Power semiconductor module of high isolation strength
10/22/2002	US6469377 Semiconductor device
10/22/2002	US6469371 Non-contact type IC card and process for manufacturing same
10/22/2002	US6469259 Wiring board
10/22/2002	US6469258 Circuit board for semiconductor package
10/22/2002	US6469256 Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
10/22/2002	US6469255 Composite wiring board and manufacturing method thereof
10/22/2002	US6469248 Hybrid circuit with a heat dissipation system
10/22/2002	US6469109 Copper clad laminates
10/22/2002	US6469081 Syndiotactic, polystyrenic resin composition which can be formed into an article having improved heat resistance, an increased modulus of elasticity and greatly improved toughness
10/22/2002	US6468640 Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device
10/22/2002	US6468593 Conductive paint containinga resin vehicle, a conductive whisker, electroless plating on a surface of the coating film
10/22/2002	US6468447 Comprising copper powder and glass powder, wherein glass powder is substantially lead free
10/22/2002	US6468221 Ultrasonic endoscope

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