| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/16/2003 | WO2003005786A1 Method for manufacturing printed wiring board |
| 01/16/2003 | WO2003005616A2 System and method for integrating optical layers in a pcb for inter-board communications |
| 01/16/2003 | WO2003005455A1 Image generation device, and method for producing such an image generation device |
| 01/16/2003 | WO2003005445A1 Semiconductor device and semiconductor module |
| 01/16/2003 | WO2003005444A2 Ceramic-filled polymer substrate for using in high frequency technology |
| 01/16/2003 | WO2003005366A1 Disc drive circuit board edge connector |
| 01/16/2003 | WO2003005094A1 Coupling to waveguides that are embedded in printed circuit boards |
| 01/16/2003 | WO2003004564A1 Flameproofed thermoplastic molding compounds |
| 01/16/2003 | WO2003004553A1 Flame resistant thermoplastic moulding materials |
| 01/16/2003 | WO2002044913A3 Topology for 66 mhz pci bus riser card system |
| 01/16/2003 | WO2002037248A3 A power distribution system with a dedicated power structure and a high performance voltage regulator |
| 01/16/2003 | WO2001086455A3 Multiple channel modules and bus systems |
| 01/16/2003 | US20030013838 Novel polyimide and circuit substrate comprising the same |
| 01/16/2003 | US20030013606 Method for the production of electrocatalyst powders |
| 01/16/2003 | US20030013344 Apparatus and method for incorporating surface mount components into connectors |
| 01/16/2003 | US20030013328 Connection assembly for integrated circuit sensors |
| 01/16/2003 | US20030013326 Printed circuit board for pin array connection |
| 01/16/2003 | US20030013324 Connectors having circuit protection |
| 01/16/2003 | US20030013048 Electromagnetic filter for display screens |
| 01/16/2003 | US20030013013 Circuit assembly for battery pack or the like, and method of making the same |
| 01/16/2003 | US20030012975 Composite copper foil and manufacturing method thereof |
| 01/16/2003 | US20030012927 Process for preparing metal-coated aromatic polyimide film |
| 01/16/2003 | US20030012882 Adhesive polyimide resin and adhesive laminate |
| 01/16/2003 | US20030012546 Electrical power distribution system |
| 01/16/2003 | US20030012004 Printed wiring board having non-through lead mounting hole and manufacturing method of the same |
| 01/16/2003 | US20030012001 Module unit for memory modules and method for its production |
| 01/16/2003 | US20030011999 Wiring substrate, method of producing the same, and electronic device using the same |
| 01/16/2003 | US20030011998 Chip scale packaging on CTE matched printed wiring boards |
| 01/16/2003 | US20030011960 Polymeric dielectric material for high-energy density capacitors |
| 01/16/2003 | US20030011735 Display device and display device assembling method |
| 01/16/2003 | US20030011523 Method for forming radio frequency antenna |
| 01/16/2003 | US20030011458 Planar inductors and method of manufacturing thereof |
| 01/16/2003 | US20030011424 Simultaneous switching noise minimization technique for power lines using dual layer power line mutual inductors |
| 01/16/2003 | US20030011393 CSP BGA test socket with insert and method |
| 01/16/2003 | US20030011391 Reversed memory module socket, motherboard and test system including same, and method of modifying motherboard |
| 01/16/2003 | US20030011319 Electronic ballast and electronic transformer |
| 01/16/2003 | US20030011074 Printed circuit board having an improved land structure |
| 01/16/2003 | US20030011070 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 01/16/2003 | US20030011062 Package board for multiple-pin ball grid array package, multiple-pin ball grid array package, and semiconductor device |
| 01/16/2003 | US20030011058 Semiconductor device, semiconductor module and hard disk |
| 01/16/2003 | US20030011026 Electrostatic discharge apparatus for network devices |
| 01/16/2003 | US20030010961 For the formation of an insulating film comprising a low dielectric constant polymeric material and a sublimating material(a silcone compound) which are dissolved in a solvent |
| 01/16/2003 | US20030010807 Surface mounting to an irregular surface |
| 01/16/2003 | US20030010615 Microspring with conductive coating deposited on tip after release |
| 01/16/2003 | US20030010530 Multilayer printed board |
| 01/16/2003 | US20030010529 Molded high impedance surface and a method of making same |
| 01/16/2003 | US20030009878 Method for attaching an electronic component to a substrate |
| 01/16/2003 | CA2453045A1 Coupling to waveguides that are embedded in printed circuit boards |
| 01/15/2003 | EP1276359A2 Method for making a flexible laminate |
| 01/15/2003 | EP1276358A1 Copper foil excellent in laser beam drilling performance and production method therefor |
| 01/15/2003 | EP1276357A2 Wiring board for electrical circuits |
| 01/15/2003 | EP1275696A1 Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal-clad laminate |
| 01/15/2003 | EP1275695A1 Curable composition and multilayered circuit substrate |
| 01/15/2003 | EP1275682A1 Lowly heat-expandable laminate |
| 01/15/2003 | EP1275680A1 Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circ |
| 01/15/2003 | EP1275679A1 Polyamide acid and polyimide, and optical material |
| 01/15/2003 | EP1275503A2 Ink jet charge plate with integrated flexible lead connector structure |
| 01/15/2003 | EP1275462A1 Method and apparatus for soldering electronic devices to a polymer film |
| 01/15/2003 | EP1275281A1 Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module |
| 01/15/2003 | EP1275277A1 Process for stacking layers that form a multilayer printed circuit |
| 01/15/2003 | EP1275168A2 Method and apparatus for integrated-battery devices |
| 01/15/2003 | EP1275153A1 Carrier substrate for electronic components |
| 01/15/2003 | EP1070445B1 Hybrid circuit with contact surfaces (solder pads) |
| 01/15/2003 | EP0917597B1 Method for producing conductor track structures, especially fine conductor track structures, arranged on a nonconductive support material |
| 01/15/2003 | EP0529097B1 Method of manufacturing two-layer tab tape |
| 01/15/2003 | CN2531482Y Convenient circuit experiment board |
| 01/15/2003 | CN1391784A Base webs for printed circuit board production using foam process and acrylic fibers |
| 01/15/2003 | CN1391704A Surface mount IC stacking method and device |
| 01/15/2003 | CN1391698A Split inductor with fractional turn of each winding and PCB including same |
| 01/15/2003 | CN1391550A High purity 4,4-isopropylidene-bis-(2,6 d1 bromophenol) and preparation thereof |
| 01/15/2003 | CN1391432A Printing circuit board embedding electronic device and its manufacture |
| 01/15/2003 | CN1391428A Printing circuit boards and their manufacture |
| 01/15/2003 | CN1391427A Flexible substrate, semiconductor device, camera device and X-ray camera system |
| 01/15/2003 | CN1391342A Radiator with built-in integrated circuit module |
| 01/15/2003 | CN1391323A Wire distribution method and connecting structure |
| 01/15/2003 | CN1391314A Installation socket connector of printing circuit board |
| 01/15/2003 | CN1391279A Circuit layout |
| 01/15/2003 | CN1391242A Metal membrane and manufacture thereof, laminated ceramic electronic elements and manufacture thereof |
| 01/15/2003 | CN1391236A Coating material for flat electric cable and flat electric cable therewith |
| 01/15/2003 | CN1391213A Magnetic head suspension device of magnetic disk drive and manufacturing mode |
| 01/15/2003 | CN1099222C Electroplate lead structure for terminal electroplate |
| 01/15/2003 | CN1099121C Multi-layer ceramic components and manufacturing thereof |
| 01/15/2003 | CN1099120C Metal-ceramic composition chip, production method therefor, and soldering material for said method |
| 01/14/2003 | US6507497 Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer |
| 01/14/2003 | US6507496 Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component |
| 01/14/2003 | US6507495 Three-dimensional technique for improving the EMC characteristics of a printed circuit board |
| 01/14/2003 | US6507384 Flexible printed wiring board, electro-optical device, and electronic equipment |
| 01/14/2003 | US6507205 Load board with matrix card for interfacing to test device |
| 01/14/2003 | US6507113 Electronic interface structures and methods of fabrication |
| 01/14/2003 | US6507105 Member for semiconductor device and method for producing the same |
| 01/14/2003 | US6507102 Printed circuit board with integral heat sink for semiconductor package |
| 01/14/2003 | US6507099 Multi-chip integrated circuit carrier |
| 01/14/2003 | US6506982 Multi-layer wiring substrate and manufacturing method thereof |
| 01/14/2003 | US6506981 Interconnect structure having fuse or anti-fuse links between profiled apertures |
| 01/14/2003 | US6506978 Flexible wiring board, electrooptical device and electronic equipment |
| 01/14/2003 | US6506063 Pin header and a method of making same |
| 01/14/2003 | US6505876 Structure for wiring circuits on panel |
| 01/14/2003 | US6505402 designed to be surface mounted on a printed circuit board; plurality of pin contacts that are arranged in parallel upper and lower rows and through an insulating housing |
| 01/09/2003 | WO2003003757A2 Splitter assembly with high density backplane board |
| 01/09/2003 | WO2003003520A2 Printed circuit board with isolated metallic substrate comprising an integrated cooling system |